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Author(s):  
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Tao Li
Keyword(s):  
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Architecting high-performance energy-efficient soft error resilient cache under 3D integration technology

2011 ◽  
Vol 35 (4) ◽  
pp. 371-381 ◽  
Author(s):  
Hongbin Sun ◽  
Pengju Ren ◽  
Nanning Zheng ◽  
Tong Zhang ◽  
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High Performance ◽  
Soft Error ◽  
3D Integration ◽  
Error Resilient ◽  
Integration Technology

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2014 ◽  
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Keyword(s):  
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3D Integration ◽  
3D Technology ◽  
Integration Technology

This publication will cover Tezzaron's latest advancements in 2.5D and 3D technology including new wafer to wafer integration of InP and GaAs with CMOS devices and new work in bonded die to wafer assembly with sub 25um pitch. A manufacturing perspective of the evolving customer requirements and the unique challenges in testing these highly complex devices will be discussed.

Using 3D integration technology to realize multi-context FPGAs

2009 ◽  
Author(s):  
Alesandro Cevrero ◽  
Panagiotis Athanasopoulos ◽  
Hadi Parandeh-Afshar ◽  
Maurizio Skerlj ◽  
Philip Brisk ◽  
...  
Keyword(s):  
3D Integration ◽  
Integration Technology

scholarly journals Recent progress in 3D integration technology

2015 ◽  
Vol 12 (7) ◽  
pp. 20152001-20152001 ◽  
Author(s):  
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Keyword(s):  
Recent Progress ◽  
3D Integration ◽  
Integration Technology
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