Three Dimensional System Integration
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Published By Springer US

9781441909619, 9781441909626
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Introduction to Three-Dimensional Integration

2010 ◽  
pp. 1-12 ◽  
Author(s):  
Antonis Papanikolaou ◽  
Dimitrios Soudris ◽  
Riko Radojcic
Keyword(s):  
Three Dimensional

PathFinding and TechTuning

2010 ◽  
pp. 137-185 ◽  
Author(s):  
Dragomir Milojevic ◽  
Ravi Varadarajan ◽  
Dirk Seynhaeve ◽  
Pol Marchal

TSV Characterization and Modeling

2010 ◽  
pp. 33-49 ◽  
Author(s):  
Michele Stucchi ◽  
Guruprasad Katti ◽  
Dimitrios Velenis

Co-optimization of Power, Thermal, and Signal Interconnect for 3D ICs

2010 ◽  
pp. 103-136
Author(s):  
Young-Joon Lee ◽  
Michael Healy ◽  
Sung Kyu Lim
Keyword(s):  
3D Ics

3D Stacking of DRAM on Logic

2010 ◽  
pp. 187-210
Author(s):  
Trevor Carlson ◽  
Marco Facchini
Keyword(s):  
3D Stacking

3D Physical Design

2010 ◽  
pp. 73-100
Author(s):  
Jason Cong ◽  
Guojie Luo
Keyword(s):  
Physical Design
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