2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Latest Publications

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9781479906673

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Study on thermal conductive BN/VGCF/polyimide resin composites (IMPACT 2013)

2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2013.6706664 ◽

2013 ◽

Author(s):

Si-Yi Chin ◽

Shou-Jui Hsiang ◽

Yun-Tien Chen ◽

Wei-Ta Yang

Keyword(s):

Resin Composites

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Wafer bonding type selection for 3D IC designs

2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2013.6706670 ◽

2013 ◽

Author(s):

Shih-Hsu Huang ◽

Hua-Hsin Yeh ◽

Chun-Hua Cheng

Keyword(s):

Wafer Bonding ◽

3D Ic ◽

Type Selection ◽

Bonding Type ◽

Selection For

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A novel and green electroless copper

2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2013.6706622 ◽

2013 ◽

Author(s):

Andy Chow ◽

David Wu ◽

Crystal Li ◽

Dennis Yee

Keyword(s):

Electroless Copper

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Copyright

2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2013.6706614 ◽

2013 ◽

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Electrochemical migration failure on FR-4 PCB by hygro-thermo-vapor pressure coupled analysis

2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2013.6706687 ◽

2013 ◽

Author(s):

Hsiang-Chen Hsu ◽

Shih-Jeh Wu ◽

Feng-Jui Hsu ◽

Meng-Chieh Weng ◽

Shen-Li Fu

Keyword(s):

Vapor Pressure ◽

Coupled Analysis ◽

Electrochemical Migration

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Non-etching adhesion promoter for dry film for semi-additive manufacturing — Advanced dry film pre-treatment

2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2013.6706633 ◽

2013 ◽

Author(s):

D. Tews ◽

F. Michalik ◽

R. Haidar ◽

M. Thoms ◽

Mengliau Goh ◽

...

Keyword(s):

Additive Manufacturing ◽

Adhesion Promoter ◽

Pre Treatment ◽

Dry Film

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Review on silver wire bonding

2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2013.6706647 ◽

2013 ◽

Cited By ~ 2

Author(s):

Charlie Lu

Keyword(s):

Wire Bonding ◽

Silver Wire

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A simple printable etchant formulation for etching oxidic, transparent and conductive layers

2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2013.6706675 ◽

2013 ◽

Author(s):

Shin-Shin Wang ◽

Sui-Hui Wu ◽

Jyh-Horung Chen

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Analysis of stress buffer effect of polyimide for board level drop test by a finite element analysis

2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2013.6706623 ◽

2013 ◽

Cited By ~ 1

Author(s):

Nobuhiro Anzai ◽

Mitsuru Fujita ◽

Kazutoshi Sakamaki ◽

Yoshiharu Kanya

Keyword(s):

Finite Element Analysis ◽

Finite Element ◽

Drop Test ◽

Buffer Effect ◽

Element Analysis ◽

Board Level ◽

Stress Buffer

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Underfill adhesion enhancement via optimization of plasma treatment for 3DIC

2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2013.6706678 ◽

2013 ◽

Author(s):

Chi-Tung Yeh ◽

Huei-Nuan Huang ◽

Pai-Yuan Lee ◽

Mu-Hsuan Chan ◽

G. T. Lin ◽

...

Keyword(s):

Plasma Treatment

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2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Study on thermal conductive BN/VGCF/polyimide resin composites (IMPACT 2013)

Wafer bonding type selection for 3D IC designs

A novel and green electroless copper

Copyright

Electrochemical migration failure on FR-4 PCB by hygro-thermo-vapor pressure coupled analysis

Non-etching adhesion promoter for dry film for semi-additive manufacturing — Advanced dry film pre-treatment

Review on silver wire bonding

A simple printable etchant formulation for etching oxidic, transparent and conductive layers

Analysis of stress buffer effect of polyimide for board level drop test by a finite element analysis

Underfill adhesion enhancement via optimization of plasma treatment for 3DIC

2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Latest Publications