2015 International 3D Systems Integration Conference (3DIC)
Latest Publications

TOTAL DOCUMENTS

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781467393850

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

An ultra-fast temporary bonding and release process based on thin photolysis polymer in 3D integration

2015 International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2015.7334613 ◽

2015 ◽

Author(s):

Tsung-Yen Tsai ◽

Chien-Hung Lin ◽

Chia-Lin Lee ◽

Shan-Chun Yang ◽

Kuan-Neng Chen

Keyword(s):

3D Integration ◽

Release Process ◽

Temporary Bonding

Download Full-text

Modeling and analysis of defects in through silicon via channel for non-invasive fault isolation

2015 International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2015.7334599 ◽

2015 ◽

Cited By ~ 5

Author(s):

Daniel H. Jung ◽

Heegon Kim ◽

Jonghoon J. Kim ◽

Sukjin Kim ◽

Joungho Kim ◽

...

Keyword(s):

Fault Isolation ◽

Through Silicon Via ◽

Modeling And Analysis ◽

Non Invasive

Download Full-text

Design of a 3-D stacked floating-point Goldschmidt divider

2015 International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2015.7334598 ◽

2015 ◽

Author(s):

Jubee Tada ◽

Ryusuke Egawa ◽

Hiroaki Kobayashi

Keyword(s):

Floating Point

Download Full-text

Proposed static timing analysis framework for extracted 3D integrated circuits (3D-STA)

2015 International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2015.7334604 ◽

2015 ◽

Author(s):

Mohamed N. ElBahey ◽

DiaaEldin S. Khalil ◽

Hani F. Ragai

Keyword(s):

Integrated Circuits ◽

Timing Analysis ◽

Analysis Framework ◽

Static Timing Analysis ◽

Static Timing ◽

3D Integrated Circuits

Download Full-text

Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC

2015 International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2015.7334595 ◽

2015 ◽

Cited By ~ 1

Author(s):

Sumin Choi ◽

Heegon Kim ◽

Daniel H. Jung ◽

Jonghoon J. Kim ◽

Jaemin Lim ◽

...

Keyword(s):

High Speed ◽

3D Ic ◽

Eye Diagram

Download Full-text

On TSV array defect detection method using two ring-oscillators considering signal transitions at adjacent TSVs

2015 International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2015.7334594 ◽

2015 ◽

Author(s):

Hiroyuki Yotsuyanagi ◽

Akihiro Fujiwara ◽

Masaki Hashizume

Keyword(s):

Defect Detection ◽

Detection Method ◽

Ring Oscillators

Download Full-text

Electrical investigation of Cu pumping in through-silicon vias for BEOL reliability in 3D integration

2015 International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2015.7334581 ◽

2015 ◽

Author(s):

Chuan-An Cheng ◽

Ryuichi Sugie ◽

Tomoyuki Uchida ◽

Kou-Hua Chen ◽

Chi-Tsung Chiu ◽

...

Keyword(s):

3D Integration ◽

Through Silicon Vias ◽

Electrical Investigation ◽

Silicon Vias

Download Full-text

Consideration of microbump layout for reduction of local bending stress due to CTE Mismatch in 3D IC

2015 International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2015.7334596 ◽

2015 ◽

Cited By ~ 2

Author(s):

Hisashi Kino ◽

Hideto Hashiguchi ◽

Seiya Tanikawa ◽

Yohei Sugawara ◽

Shunsuke Ikegaya ◽

...

Keyword(s):

Bending Stress ◽

3D Ic ◽

Cte Mismatch

Download Full-text

Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers

2015 International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2015.7334471 ◽

2015 ◽

Cited By ~ 3

Author(s):

K.W. Lee ◽

C. Nagai ◽

A. Nakamura ◽

H. Aizawa ◽

J.C. Bea ◽

...

Keyword(s):

High Density ◽

Thin Metal ◽

3D Integration ◽

Bonding Technology

Download Full-text

Temperature-aware online testing of power-delivery TSVs

2015 International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2015.7334617 ◽

2015 ◽

Cited By ~ 1

Author(s):

Hua-Cheng Fu ◽

Shi-Yu Huang ◽

Ding-Ming Kwai ◽

Yung-Fa Chou

Keyword(s):

Power Delivery ◽

Online Testing

Download Full-text

2015 International 3D Systems Integration Conference (3DIC)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

An ultra-fast temporary bonding and release process based on thin photolysis polymer in 3D integration

Modeling and analysis of defects in through silicon via channel for non-invasive fault isolation

Design of a 3-D stacked floating-point Goldschmidt divider

Proposed static timing analysis framework for extracted 3D integrated circuits (3D-STA)

Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC

On TSV array defect detection method using two ring-oscillators considering signal transitions at adjacent TSVs

Electrical investigation of Cu pumping in through-silicon vias for BEOL reliability in 3D integration

Consideration of microbump layout for reduction of local bending stress due to CTE Mismatch in 3D IC

Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers

Temperature-aware online testing of power-delivery TSVs

2015 International 3D Systems Integration Conference (3DIC)
Latest Publications