Effects of tacky flux formulation on solder ball attach to a Cu-OSP surface finish in air and N2

2012 ◽  
Author(s):  
J. Z. Hussain ◽  
S. A. Khoo ◽  
C. D. Breach ◽  
A. Hawkins
Keyword(s):  
Surface Finish ◽  
Solder Ball ◽  
Osp Surface Finish

Solder-Joint Reliability of a Radar Processor for Semi-Autonomous Driving Applications

2018 ◽  
Vol 2018 (1) ◽  
pp. 000104-000109
Author(s):  
Mollie Benson ◽  
Burton Carpenter ◽  
Andrew Mawer
Keyword(s):  
Solder Joint ◽  
Thermal Shock ◽  
Surface Finish ◽  
Solder Ball ◽  
Digital Signal ◽  
Autonomous Driving ◽  
Solder Joint Reliability ◽  
Automotive Safety ◽  
Safety Integrity Level ◽  
Joint Reliability

Abstract Radar is currently employed in automotive applications to provide the range, angle, and velocity of objects using RF waves (77GHz). This paper outlines solder joint reliability of a specific micro-processor that processes data received from a SRR (short range radar operating from 0.2 to 30 meters). It is a powerful digital signal processing accelerator, which targets safety applications that require a high Automotive Safety Integrity Level (ASIL-B). The paper explores the package design and construction, SMT (surface mount technology) assembly, and board level reliability testing of various BGA pad surface finish and solder ball alloy materials on a 0.65 mm pitch, 10 × 10 mm body 141 MAPBGA (mold array process-ball grid array) package. The package configurations include two BGA pad surface finishes (Ni/Au and OSP [organic solderability protectant]) and three solder alloys (SnAg, SAC405, and SAC-Bi [a Bi containing SAC derivative]). Solder joint reliability analysis was performed through AATS (air-to-air thermal shock) between 40°C and +125°C and JEDEC Drop Testing at 1500G's. Thermal shock was extended until at least 75% of the populations failed, which was well past the points needed to qualify the packages for the intended end-use applications. The evaluations of the micro-processor indicate that the MAPBGA package can meet the ASIL-B specification requirements with optimized combinations of BGA pad surface finish and solder alloy. The focus of this paper was to determine the baseline solder-joint thermal shock and JEDEC drop performance with varied BGA pad surface finish and solder ball alloy materials.

scholarly journals Effect of Bismuth Additions on Wettability, Intermetallic Compound, and Microhardness Properties of Sn-0.7Cu on Different Surface Finish Substrates

2020 ◽  
Vol 49 (12) ◽  
pp. 3201-3205
Author(s):  
Mohd Izrul Izwan Ramli ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Siti Farahnabilah Muhd Amli ◽  
Nurul Razliana Abdul Razak
Keyword(s):  
Intermetallic Compound ◽  
Solder Alloy ◽  
Surface Finish ◽  
Casting Process ◽  
Organic Solderability Preservative ◽  
Different Types ◽  
Osp Surface Finish ◽  
Interfacial Intermetallic Compound ◽  
Immersion Tin

The influence of bismuth (Bi) addition on wettability, thickness of interfacial intermetallic compound (IMC), and microhardness properties of Sn-0.7Cu + xBi solder alloy using different types of substrate were examined. The 0.5, 1.0, 1.5, and 2.0 wt. % Bi was added into Sn-0.7Cu and fabricated using the casting process. The result shows that the influence of 1.5 wt. % Bi in the Sn-0.7Cu solder soldered on copper organic solderability preservative (Cu-OSP) and immersion tin (Im-Sn) surface finish has improved the wettability and microhardness. Subsequently, the IMC thickness of Sn-0.7Cu+1.5Bi solder alloy on Im-Sn surface finish gives a better result than reflowed on Cu-OSP. Generally, with the addition of 1.5 wt. % Bi in Sn-0.7Cu solder alloy reflowed on the Im-Sn surface finish had enhanced the performance in terms of wettability, thickness of IMC and microhardness properties compared to on Cu-OSP surface finish.

scholarly journals Effect of Bismuth Additions on Wettability, Intermetallic Compound, and Microhardness Properties of Sn-0.7Cu on Different Surface Finish Substrates

2020 ◽  
Vol 49 (12) ◽  
pp. 3255-3259
Author(s):  
Mohd Izrul Izwan Ramli ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Siti Farahnabilah Muhd Amli ◽  
Nurul Razliana Abdul Razak
Keyword(s):  
Intermetallic Compound ◽  
Solder Alloy ◽  
Surface Finish ◽  
Casting Process ◽  
Organic Solderability Preservative ◽  
Different Types ◽  
Osp Surface Finish ◽  
Interfacial Intermetallic Compound ◽  
Immersion Tin

The influence of bismuth (Bi) addition on wettability, thickness of interfacial intermetallic compound (IMC), and microhardness properties of Sn-0.7Cu + xBi solder alloy using different types of substrate were examined. The 0.5, 1.0, 1.5, and 2.0 wt. % Bi was added into Sn-0.7Cu and fabricated using the casting process. The result shows that the influence of 1.5 wt. % Bi in the Sn-0.7Cu solder soldered on copper organic solderability preservative (Cu-OSP) and immersion tin (Im-Sn) surface finish has improved the wettability and microhardness. Subsequently, the IMC thickness of Sn-0.7Cu+1.5Bi solder alloy on Im-Sn surface finish gives a better result than reflowed on Cu-OSP. Generally, with the addition of 1.5 wt. % Bi in Sn-0.7Cu solder alloy reflowed on the Im-Sn surface finish had enhanced the performance in terms of wettability, thickness of IMC and microhardness properties compared to on Cu-OSP surface finish.

Characterization of machined polystyrene foam

1989 ◽  
Vol 47 ◽  
pp. 372-373
Author(s):  
C. W. Price ◽  
E. F. Lindsey ◽  
R. M. Franks ◽  
M. A. Lane
Keyword(s):  
Surface Finish ◽  
Cell Walls ◽  
Surface Structures ◽  
Efficient Technique ◽  
Low Density ◽  
Polystyrene Foam ◽  
Planar Surfaces ◽  
Machining Characteristics

Diamond-point turning is an efficient technique for machining low-density polystyrene foam, and the surface finish can be substantially improved by grinding. However, both diamond-point turning and grinding tend to tear and fracture cell walls and leave asperities formed by agglomerations of fragmented cell walls. Vibratoming is proving to be an excellent technique to form planar surfaces in polystyrene, and the machining characteristics of vibratoming and diamond-point turning are compared.Our work has demonstrated that proper evaluation of surface structures in low density polystyrene foam requires stereoscopic examinations; tilts of + and − 3 1/2 degrees were used for the stereo pairs. Coating does not seriously distort low-density polystyrene foam. Therefore, the specimens were gold-palladium coated and examined in a Hitachi S-800 FESEM at 5 kV.

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