Drop reliability study of PBGA assemblies with SAC305, SAC105 and SAC105-Ni solder ball on Cu-OSP and ENIG surface finish

Author(s):  
W.H. Zhu ◽  
Luhua Xu ◽  
John H.L. Pang ◽  
X.R. Zhang ◽  
Edith Poh ◽  
...  
2018 ◽  
Vol 2018 (1) ◽  
pp. 000104-000109
Author(s):  
Mollie Benson ◽  
Burton Carpenter ◽  
Andrew Mawer

Abstract Radar is currently employed in automotive applications to provide the range, angle, and velocity of objects using RF waves (77GHz). This paper outlines solder joint reliability of a specific micro-processor that processes data received from a SRR (short range radar operating from 0.2 to 30 meters). It is a powerful digital signal processing accelerator, which targets safety applications that require a high Automotive Safety Integrity Level (ASIL-B). The paper explores the package design and construction, SMT (surface mount technology) assembly, and board level reliability testing of various BGA pad surface finish and solder ball alloy materials on a 0.65 mm pitch, 10 × 10 mm body 141 MAPBGA (mold array process-ball grid array) package. The package configurations include two BGA pad surface finishes (Ni/Au and OSP [organic solderability protectant]) and three solder alloys (SnAg, SAC405, and SAC-Bi [a Bi containing SAC derivative]). Solder joint reliability analysis was performed through AATS (air-to-air thermal shock) between 40°C and +125°C and JEDEC Drop Testing at 1500G's. Thermal shock was extended until at least 75% of the populations failed, which was well past the points needed to qualify the packages for the intended end-use applications. The evaluations of the micro-processor indicate that the MAPBGA package can meet the ASIL-B specification requirements with optimized combinations of BGA pad surface finish and solder alloy. The focus of this paper was to determine the baseline solder-joint thermal shock and JEDEC drop performance with varied BGA pad surface finish and solder ball alloy materials.


Author(s):  
C. W. Price ◽  
E. F. Lindsey ◽  
R. M. Franks ◽  
M. A. Lane

Diamond-point turning is an efficient technique for machining low-density polystyrene foam, and the surface finish can be substantially improved by grinding. However, both diamond-point turning and grinding tend to tear and fracture cell walls and leave asperities formed by agglomerations of fragmented cell walls. Vibratoming is proving to be an excellent technique to form planar surfaces in polystyrene, and the machining characteristics of vibratoming and diamond-point turning are compared.Our work has demonstrated that proper evaluation of surface structures in low density polystyrene foam requires stereoscopic examinations; tilts of + and − 3 1/2 degrees were used for the stereo pairs. Coating does not seriously distort low-density polystyrene foam. Therefore, the specimens were gold-palladium coated and examined in a Hitachi S-800 FESEM at 5 kV.


2010 ◽  
Author(s):  
Ran Zhao ◽  
Chia-Lin Tsai ◽  
Adipat Chaichanasakul ◽  
Lisa Y. Flores ◽  
Shane J. Lopez

2000 ◽  
Vol 9 (3) ◽  
pp. 148-155 ◽  
Author(s):  
Han-Kuang Tan ◽  
Andrew Woo ◽  
Silvia Kim ◽  
Michael Lamoureux ◽  
Michael Grace

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