Ultra-low temperature curable nano-silver conductive adhesive for piezoelectric composite material

2018 ◽  
Vol 529 ◽  
pp. 9-15 ◽  
Author(s):  
Chao Yan ◽  
Qingwei Liao ◽  
Xingli Zhou ◽  
Likun Wang ◽  
Chao Zhong ◽  
...  
2019 ◽  
Vol 717 ◽  
pp. 158-163
Author(s):  
Xingli Zhou ◽  
Likun Wang ◽  
Qingwei Liao ◽  
Lei Qin ◽  
Shaohua Hao ◽  
...  

2020 ◽  
Vol 226 ◽  
pp. 111291
Author(s):  
Qingwei Liao ◽  
Binglin Kang ◽  
Ou Lei ◽  
Liyin Chen ◽  
Lei Qin ◽  
...  

Sensors ◽  
2018 ◽  
Vol 18 (7) ◽  
pp. 2347 ◽  
Author(s):  
Shaohua Hao ◽  
Hongwei Wang ◽  
Chao Zhong ◽  
Likun Wang ◽  
Hao Zhang

A wide-band cylindrical transducer was developed by using the wide band of the composite material and the matched matching layer for multimode coupling. Firstly, the structure size of the transducer’s sensitive component was designed by using ANSYS simulation software. Secondly, the piezoelectric composite ring-shaped sensitive component was fabricated by the piezoelectric composite curved-surface forming process, and the matching layer was coated on the periphery of the ring-shaped piezoelectric composite material. Finally, it was encapsulated and the electrodes were drawn out to make a high-frequency broadband horizontal omnidirectional water acoustic transducer prototype. After testing, the working frequency range of the transducer was 230–380 kHz, and the maximum transmission voltage response was 168 dB in the water.


Author(s):  
Tuomo Siponkoski ◽  
Mikko Nelo ◽  
Niklas Ilonen ◽  
Jari Juuti ◽  
Heli Jantunen

2014 ◽  
Vol 2014 (HITEC) ◽  
pp. 000172-000177
Author(s):  
Koji Sasaki ◽  
Noritsuka Mizumura

Traditional thick film technology is widely used in various electronics products. There are two type of paste based on thick film technology. Typically, over 400°C is required for high temperature sintering type which contains glass for adhesion function. It shows high electrical and thermal performance. On the other hand, 150–300°C range process is used for low temperature process type as silver epoxy. In last decade, nano silver technology shows amazing progress to address low temperature operation by low temperature sintering. This paper will discuss the results on fundamental study of newly developed nano silver pastes with unique approach which uses MO (Metallo-organic) technology and resin reinforcing technology. Nano silver pastes contain several types of dispersant as surface coating to prevent agglomeration of the particles. Various coating technique has been reported to optimize sintering performance and stability. MO technology provides low temperature sintering capability by minimizing the coating material. The nano silver pastes show high electrical and thermal performance. However, degradation of die shear strength has been found by thermal cycling test due to the fragility of porous sintered structure. To improve the mechanical property, resin reinforcing technology has been developed. By adding special resin to the pastes, the porous area is filled with the resin and the sintered structure is reinforced. Degradation of die shear strength was not found by thermal cycling test to 1000 cycles. Nano silver pastes using MO technology and resin reinforcing technology will meet lots of requirement on various thick film applications.


2007 ◽  
Vol 36 (10) ◽  
pp. 1333-1340 ◽  
Author(s):  
Tao Wang ◽  
Xu Chen ◽  
Guo-Quan Lu ◽  
Guang-Yin Lei

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