Next Generation of Automotive Radar with Leading-Edge Advances in SiGe Devices and Glass Panel Embedding (GPE)

2018 ◽  
Author(s):  
Tailong Shi ◽  
Yunyi Gong ◽  
Siddharth Ravichandran ◽  
Venky Sundaram ◽  
John D. Cressler ◽  
...  
Keyword(s):  
Leading Edge ◽  
Next Generation ◽  
Glass Panel ◽  
Automotive Radar

Next-generation ArF Laser technologies for multiple-patterning immersion lithography supporting leading edge processes

2018 ◽  
Author(s):  
Hirotaka Miyamoto ◽  
Hiroshi Furusato ◽  
Keisuke Ishida ◽  
Hiroaki Tsushima ◽  
Akihiko Kurosu ◽  
...  
Keyword(s):  
Leading Edge ◽  
Next Generation ◽  
Immersion Lithography ◽  
Laser Technologies ◽  
Arf Laser

Next Generation, Low-THz Automotive Radar – the potential for frequencies above 100 GHz

2019 ◽  
Author(s):  
F. Norouzian ◽  
E. G. Hoare ◽  
E. Marchetti ◽  
M. Cherniakov ◽  
M. Gashinova
Keyword(s):  
Next Generation ◽  
Automotive Radar

Glass Panel Packaging, as the Most Leading-Edge Packaging: Technologies and Applications

2020 ◽  
Author(s):  
Rao Tummala ◽  
Bartlet Deprospo ◽  
Shreya Dwarakanath ◽  
Siddharth Ravichandran ◽  
Pratik Nimbalkar ◽  
...  
Keyword(s):  
Leading Edge ◽  
Glass Panel

Study Photo Imagable dielectric (PID) and non-PID on process, fabrication and reliability by using panel glass substrate for next generation interconnection

2019 ◽  
Vol 2019 (1) ◽  
pp. 000216-000222
Author(s):  
Chun-Hsien Chien ◽  
Chien-Chou Chen ◽  
Wen-Liang Yeh ◽  
Wei-Ti Lin ◽  
Cheng-Hui Wu ◽  
...  
Keyword(s):  
Stress Test ◽  
Dielectric Materials ◽  
Circuit Board ◽  
Strip Line ◽  
Organic Substrates ◽  
Next Generation ◽  
Glass Panel ◽  
Process Technology ◽  
Fine Line ◽  
Ic Foundry

Abstract In 1965, Gordon E. Moore, the co-founder of Intel stated that numbers of transistors on a chip will double every 18 months and his theory called the Moore's Law. The law had been the guiding principle of chip design over 50 years. The technology dimension is scaling very aggressively in IC foundry. For example, TSMC announced their 5nm Fin Field-Effect Transistor (FinFET) process technology is optimized for both mobile and high performance computing applications. It is scheduled to start risk production in the second half of 2019.[1] To overview the semiconductor supply chain included IC foundry, wafer bumping, IC carrier, PCB (Printed circuit board) and OSAT (oversea assembly and testing)… etc., the IC carrier and PCB technology dimension scaling are far behind than the IC foundry since many reasons for the traditional industry. The industry needs different kinds of breakthrough approaches for the scaling of via and strip line in next generation interconnection. Traditional organic substrates faces many challenges of warpage, surface roughness and material dimension stability issues for manufacturing and high density I/Os with very fine line interconnections. To breakthrough these challenges, the materials of glass carrier, new photo-imagable dielectric (PID) and advanced equipment were evaluated for the fine line and fine via interconnection. In the papers, there are many PID and non-PID materials were surveyed and compared for fine via (< 10μm) interconnection or low loss of high frequency application. The first candidate was chosen for redistribution layers (RDL) fabrication by using 370mm × 470mm glass panels. Semi additive process (SAP) was used for direct metallization on glass panel with different build-up dielectric materials to form daisy chain test vehicles. The process, fabrication integration and electrical measurement results of daisy chain showed good continuity and electric resistance in the glass panel substrate. The reliability of the thermal cycling test (TCT) and highly accelerated stress test (HAST) were evaluated as well in this study.

scholarly journals GO_3D_OBS – The Nankai Trough-inspired benchmark geomodel for seismic imaging methods assessment and next generation 3D surveys design (version 1.0)

2020 ◽  
Author(s):  
Andrzej Górszczyk ◽  
Stéphane Operto
Keyword(s):  
High Resolution ◽  
Large Scale ◽  
Nankai Trough ◽  
Regional Scale ◽  
Waveform Inversion ◽  
Leading Edge ◽  
High Resolution Imaging ◽  
Ocean Bottom ◽  
Next Generation ◽  
Resolution Imaging

Abstract. Detailed reconstruction of deep crustal targets by seismic methods remains a long-standing challenge. One key to address this challenge is the joint development of new seismic acquisition systems and leading-edge processing techniques. In marine environments, controlled-source seismic surveys at regional scale are typically carried out with sparse arrays of ocean bottom seismometers (OBSs), which provide incomplete and down-sampled subsurface illumination. To assess and minimize the acquisition footprint in high-resolution imaging process such as full waveform inversion, realistic crustal-scale benchmark models are clearly required.The deficiency of such models prompts us to build one and release it freely to the geophysical community. Here we introduce GO_3D_OBS – a 3D high-resolution geomodel representing a subduction zone, inspired by the geology of the Nankai Trough. The 175 km x 100 km x 30 km model integrates complex geological structures with a visco-elastic isotropic parametrization. It is defined in form of a uniform Cartesian grid containing 33.6e9 degrees of freedom for a grid interval of 25 m. The size of the model raises significant high-performance computing challenges to tackle large-scale forward propagation simulations and related inverse problems. We describe the workflow designed to implement all the model ingredients including 2D structural segments, their projection into the third dimension, stochastic components and physical parametrisation. Various wavefield simulations we present clearly reflect in the seismograms the structural complexity of the model and the footprint of different physical approximations. This benchmark model shall help to optimize the design of next generation 3D academic surveys – in particular but not only long-offset OBS experiments – to mitigate the acquisition footprint during high-resolution imaging of the deep crust.

MOCVD for complex multicomponent thin films—a leading edge technology for next generation devices

2002 ◽  
Vol 5 (2-3) ◽  
pp. 85-91 ◽  
Author(s):  
M. Schumacher ◽  
J. Lindner ◽  
P.K. Baumann ◽  
F. Schienle ◽  
N. Solayappan ◽  
...  
Keyword(s):  
Thin Films ◽  
Leading Edge ◽  
Next Generation

scholarly journals Coherent Automotive Radar Networks: The Next Generation of Radar-Based Imaging and Mapping

2021 ◽  
Vol 1 (1) ◽  
pp. 149-163
Author(s):  
Michael Gottinger ◽  
Marcel Hoffmann ◽  
Mark Christmann ◽  
Martin Schutz ◽  
Fabian Kirsch ◽  
...  
Keyword(s):  
Next Generation ◽  
Automotive Radar ◽  
Radar Networks

SAP SE (NYSE: SAP)

2017 ◽  
Vol 9 (1) ◽  
pp. 136 ◽  
Author(s):  
Editorial Board
Keyword(s):  
Enterprise Resource Planning ◽  
Leading Edge ◽  
Resource Planning ◽  
Next Generation ◽  
Road Map

SAP SE (NYSE: SAP) today introduced the latest advances to SAP S/4HANA Cloud and shared its innovation road map for the industry’s next-generation, leading-edge cloud enterprise resource planning (ERP) suite.

scholarly journals GO_3D_OBS: the multi-parameter benchmark geomodel for seismic imaging method assessment and next-generation 3D survey design (version 1.0)

2021 ◽  
Vol 14 (3) ◽  
pp. 1773-1799
Author(s):  
Andrzej Górszczyk ◽  
Stéphane Operto
Keyword(s):  
High Resolution ◽  
Large Scale ◽  
Survey Design ◽  
Regional Scale ◽  
Leading Edge ◽  
Imaging Method ◽  
High Resolution Imaging ◽  
Ocean Bottom ◽  
Next Generation ◽  
Resolution Imaging

Abstract. Detailed reconstruction of deep crustal targets by seismic methods remains a long-standing challenge. One key to address this challenge is the joint development of new seismic acquisition systems and leading-edge processing techniques. In marine environments, controlled-source seismic surveys at a regional scale are typically carried out with sparse arrays of ocean bottom seismometers (OBSs), which provide incomplete and down-sampled subsurface illumination. To assess and minimize the acquisition footprint in high-resolution imaging process such as full waveform inversion, realistic crustal-scale benchmark models are clearly required. The deficiency of such models prompts us to build one and release it freely to the geophysical community. Here, we introduce GO_3D_OBS – a 3D high-resolution geomodel representing a subduction zone, inspired by the geology of the Nankai Trough. The 175km×100km×30km model integrates complex geological structures with a viscoelastic isotropic parameterization. It is defined in the form of a uniform Cartesian grid containing ∼33.6e9 degrees of freedom for a grid interval of 25 m. The size of the model raises significant high-performance computing challenges to tackle large-scale forward propagation simulations and related inverse problems. We describe the workflow designed to implement all the model ingredients including 2D structural segments, their projection into the third dimension, stochastic components, and physical parameterization. Various wavefield simulations that we present clearly reflect in the seismograms the structural complexity of the model and the footprint of different physical approximations. This benchmark model is intended to help to optimize the design of next-generation 3D academic surveys – in particular, but not only, long-offset OBS experiments – to mitigate the acquisition footprint during high-resolution imaging of the deep crust.

Sign in / Sign up

Export Citation Format

Share Document