2020 Pan Pacific Microelectronics Symposium (Pan Pacific)
Latest Publications

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Published By IEEE

9781944543143

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The New Standard for Cyber Security

2020 Pan Pacific Microelectronics Symposium (Pan Pacific) ◽

10.23919/panpacific48324.2020.9059551 ◽

2020 ◽

Cited By ~ 1

Author(s):

Cameron Shearon

Keyword(s):

Cyber Security

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Recent Advances in Underfill for New Package Architectures

2020 Pan Pacific Microelectronics Symposium (Pan Pacific) ◽

10.23919/panpacific48324.2020.9059466 ◽

2020 ◽

Author(s):

Osamu Suzuki

Keyword(s):

Recent Advances

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Anaylysis of Mechanism About Data Retention Characteristic in Tanos Structure

2020 Pan Pacific Microelectronics Symposium (Pan Pacific) ◽

10.23919/panpacific48324.2020.9059496 ◽

2020 ◽

Author(s):

Ji-Seok Lee ◽

Ilgu Yun

Keyword(s):

Data Retention ◽

Retention Characteristic

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Understanding Creep Corrosion Field Fails

2020 Pan Pacific Microelectronics Symposium (Pan Pacific) ◽

10.23919/panpacific48324.2020.9059471 ◽

2020 ◽

Author(s):

Phil Isaacs ◽

Jing Zhang ◽

Terry Munson

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Simulation and Fault Diagnosis in Post-Manufacturing Mixed Signal Circuits

2020 Pan Pacific Microelectronics Symposium (Pan Pacific) ◽

10.23919/panpacific48324.2020.9059414 ◽

2020 ◽

Author(s):

Kyle Pawlowski ◽

Sumit Chkravarty ◽

Arjun Kumar Joginipelly

Keyword(s):

Fault Diagnosis ◽

Mixed Signal ◽

Mixed Signal Circuits

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Sustained High-Temperature Vibration Reliability of Thermally Aged Leadfree Assemblies in Automotive Environments

2020 Pan Pacific Microelectronics Symposium (Pan Pacific) ◽

10.23919/panpacific48324.2020.9059339 ◽

2020 ◽

Author(s):

Pradeep Lall ◽

Vikas Yadav ◽

David Locker

Keyword(s):

High Temperature ◽

Vibration Reliability

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Comparing Past Board Assembly iNEMI Roadmaps to Technology Outcomes

2020 Pan Pacific Microelectronics Symposium (Pan Pacific) ◽

10.23919/panpacific48324.2020.9059530 ◽

2020 ◽

Author(s):

Annaka Balch ◽

Ronald C. Lasky

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Aerosol Jet Printing of Electronics: An Enabling Technology for Wearable Devices

2020 Pan Pacific Microelectronics Symposium (Pan Pacific) ◽

10.23919/panpacific48324.2020.9059444 ◽

2020 ◽

Author(s):

Casey Cooper ◽

Bruce Hughes

Keyword(s):

Wearable Devices ◽

Enabling Technology ◽

Jet Printing ◽

Aerosol Jet Printing

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Fabriciton of High Strength NiCo Alloy and Rh Coating Using Electroplating Method

2020 Pan Pacific Microelectronics Symposium (Pan Pacific) ◽

10.23919/panpacific48324.2020.9059510 ◽

2020 ◽

Author(s):

Yong-Soo Lee ◽

Seo-Hyang Lee ◽

Jae-Ho Lee

Keyword(s):

High Strength

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Advances in Power Electronics

2020 Pan Pacific Microelectronics Symposium (Pan Pacific) ◽

10.23919/panpacific48324.2020.9059348 ◽

2020 ◽

Author(s):

Chris Bailey

Keyword(s):

Power Electronics

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2020 Pan Pacific Microelectronics Symposium (Pan Pacific)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

The New Standard for Cyber Security

Recent Advances in Underfill for New Package Architectures

Anaylysis of Mechanism About Data Retention Characteristic in Tanos Structure

Understanding Creep Corrosion Field Fails

Simulation and Fault Diagnosis in Post-Manufacturing Mixed Signal Circuits

Sustained High-Temperature Vibration Reliability of Thermally Aged Leadfree Assemblies in Automotive Environments

Comparing Past Board Assembly iNEMI Roadmaps to Technology Outcomes

Aerosol Jet Printing of Electronics: An Enabling Technology for Wearable Devices

Fabriciton of High Strength NiCo Alloy and Rh Coating Using Electroplating Method

Advances in Power Electronics

2020 Pan Pacific Microelectronics Symposium (Pan Pacific)
Latest Publications