Design of inspecting machine for next generation LCD glass panel with high modulus carbon/epoxy composites

2004 ◽  
Vol 66 (1-4) ◽  
pp. 439-447 ◽  
Author(s):  
Soon Chul Jung ◽  
Jae Eung Lee ◽  
Seung Hwan Chang
Keyword(s):  
Epoxy Composites ◽  
High Modulus ◽  
Next Generation ◽  
Glass Panel

scholarly journals High modulus polyimide particle-reinforcement of epoxy composites

2021 ◽  
Author(s):  
Johannes Essmeister ◽  
M. Josef Taublaender ◽  
Thomas Koch ◽  
D. Alonso Cerrón-Infantes ◽  
Miriam M. Unterlass ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Thermal Stability ◽  
Composite Materials ◽  
Epoxy Matrix ◽  
Epoxy Composites ◽  
High Modulus ◽  
Particle Reinforcement

A novel class of fully organic composite materials with well-balanced mechanical properties and improved thermal stability was developed by incorporating highly crystalline, hydrothermally synthesized polyimide microparticles into an epoxy matrix.

Epoxy Modified Polyurethanes Coated High Modulus Carbon Fiber: Synthesis and Properties Studies

2011 ◽  
Vol 217-218 ◽  
pp. 728-733 ◽  
Author(s):  
Yan Hong Tian ◽  
Zhan Qing Liu ◽  
Su Mei Kang ◽  
Xue Jun Zhang
Keyword(s):  
Carbon Fiber ◽  
Raw Materials ◽  
Crosslinking Agent ◽  
Epoxy Composites ◽  
High Modulus ◽  
Coating Agent ◽  
Interlaminar Shear ◽  
Carbon Fiber Epoxy ◽  
Thermal Stability Of ◽  
Properties Of Composites

With toluene 2, 4-diisocyanate (TDI), polyethylene glycol (PEG) and 2,3-Epoxy-1-prop -anol (glycidol) used as the raw materials, two epoxy terminated polyurethanes (EPU) was synthesized by prepolymerization and closed end. Moreover, EPU with high toughhess is chosen as a coating agent for carbon fiber with three ethylene tetramine (TETA) as curing agen. The influence of the content of crosslinking agent in the coating layer on properties of composites and the mechanism of interface toughness are investigated. The chemical structure and thermal property of the EPU were studied with FTIR, 1HNMR and TGA, respectively. It proves that the thermal stability of EPU is more stable than epoxy coating. The interlaminar shear strength (ILSS) of the sized high modulus carbon fiber/epoxy composites is improved to 71MPa, which increased by 19.4% compared with the composites reinforced by unsized high modulus carbon fiber, and DMTA show that using EPU as a new kind of polymer coating for carbon fiber is a feasible method to improve the interfacial performance of high modulus carbon fiber/epoxy composites.

Development of high-tenacity, high-modulus poly(ethylene terephthalate) filaments via a next generation wet-melt-spinning process

2016 ◽  
Vol 57 (2) ◽  
pp. 224-230 ◽  
Author(s):  
Joshua H. Yoon ◽  
Huseyin Avci ◽  
Mesbah Najafi ◽  
Lassad Nasri ◽  
Samuel M. Hudson ◽  
...  
Keyword(s):  
Melt Spinning ◽  
Ethylene Terephthalate ◽  
High Modulus ◽  
Next Generation ◽  
Poly Ethylene Terephthalate ◽  
Spinning Process ◽  
Poly Ethylene

Study Photo Imagable dielectric (PID) and non-PID on process, fabrication and reliability by using panel glass substrate for next generation interconnection

2019 ◽  
Vol 2019 (1) ◽  
pp. 000216-000222
Author(s):  
Chun-Hsien Chien ◽  
Chien-Chou Chen ◽  
Wen-Liang Yeh ◽  
Wei-Ti Lin ◽  
Cheng-Hui Wu ◽  
...  
Keyword(s):  
Stress Test ◽  
Dielectric Materials ◽  
Circuit Board ◽  
Strip Line ◽  
Organic Substrates ◽  
Next Generation ◽  
Glass Panel ◽  
Process Technology ◽  
Fine Line ◽  
Ic Foundry

Abstract In 1965, Gordon E. Moore, the co-founder of Intel stated that numbers of transistors on a chip will double every 18 months and his theory called the Moore's Law. The law had been the guiding principle of chip design over 50 years. The technology dimension is scaling very aggressively in IC foundry. For example, TSMC announced their 5nm Fin Field-Effect Transistor (FinFET) process technology is optimized for both mobile and high performance computing applications. It is scheduled to start risk production in the second half of 2019.[1] To overview the semiconductor supply chain included IC foundry, wafer bumping, IC carrier, PCB (Printed circuit board) and OSAT (oversea assembly and testing)… etc., the IC carrier and PCB technology dimension scaling are far behind than the IC foundry since many reasons for the traditional industry. The industry needs different kinds of breakthrough approaches for the scaling of via and strip line in next generation interconnection. Traditional organic substrates faces many challenges of warpage, surface roughness and material dimension stability issues for manufacturing and high density I/Os with very fine line interconnections. To breakthrough these challenges, the materials of glass carrier, new photo-imagable dielectric (PID) and advanced equipment were evaluated for the fine line and fine via interconnection. In the papers, there are many PID and non-PID materials were surveyed and compared for fine via (< 10μm) interconnection or low loss of high frequency application. The first candidate was chosen for redistribution layers (RDL) fabrication by using 370mm × 470mm glass panels. Semi additive process (SAP) was used for direct metallization on glass panel with different build-up dielectric materials to form daisy chain test vehicles. The process, fabrication integration and electrical measurement results of daisy chain showed good continuity and electric resistance in the glass panel substrate. The reliability of the thermal cycling test (TCT) and highly accelerated stress test (HAST) were evaluated as well in this study.

Synthesis of Latent Curing Agent for Epoxy Resin

2010 ◽  
Vol 150-151 ◽  
pp. 988-991
Author(s):  
Xue Jun Zhang ◽  
Su Mei Kang ◽  
Zhan Qing Liu
Keyword(s):  
Carbon Fiber ◽  
Epoxy Resin ◽  
Chemical Structure ◽  
Epoxy Composites ◽  
Curing Agent ◽  
High Modulus ◽  
Molar Ratios ◽  
Interlaminar Shear ◽  
Modified Epoxy ◽  
Carbon Fiber Epoxy

A new kind of latent curing agent (LCA) for epoxy resin was synthesized by the reaction of Ethylenediamine with Butylacrylate in equal molar ratios, and the chemical structure and thermal property of the LCA were studied with FTIR and TGA, respectively. Moreover, LCA was also used to modify the epoxy sizing agent for high modulus carbon fiber. The results show that the wettability of sized carbon fiber tends to increase due to the increase of the polymer film on the surface of the carbon fiber, and interlaminar shear strength (ILSS) of the sized high modulus carbon fiber/epoxy composites is improved to 78MPa, which is increased by 8.6% compared with the composites reinforced by high modulus carbon fiber with unmodified sizing agent, indicating that using LCA modified epoxy resin as polymer coating for carbon fiber is a feasible method to improve the interfacial performance of high modulus carbon fiber/epoxy composites.

New Super-Low CTE (0.7 ppm/K) Core Material for Next Generation Thin CSP

2015 ◽  
Author(s):  
Yukio Nakamura ◽  
Kenichi Oohashi ◽  
Koji Morita ◽  
Shuji Nomoto ◽  
Takayuki Suzuki ◽  
...  
Keyword(s):  
Thermal Expansion ◽  
Mobile Devices ◽  
Coefficient Of Thermal Expansion ◽  
Core Material ◽  
Resin System ◽  
High Modulus ◽  
Next Generation ◽  
Treatment Technology ◽  
Main Factor ◽  
Core Materials

The thinner and higher density PKG (package) is being required strongly for the growth of smaller mobile devices. Especially, package on package technology (PoP) has become a mainstream for application processors which are installed in smartphones and tablets. However, the warpage of thinner PKG often causes a problem at the chip mounting process. The main factor of warpage is the mismatch of CTE (coefficient of thermal expansion) between substrate and chip. Therefore, the lower CTE core materials are needed for the thinner PKG. Recently, Hitachi Chemical has developed the super-low CTE material, core and prepreg, applying our new resin system and filler treatment technology, and placed it on the market. Furthermore, a super-low CTE material of 0.7 ppm/K is currently under development. The super-low CTE material shows the best warpage performance in our low CTE core material lineups, maintaining its higher Tg, high modulus and low Dk/Df values.

Compression behavior of ultra-high modulus carbon/epoxy composites using ASTM D6641 and SACMA SRM 1R-94

2015 ◽  
Vol 50 (5) ◽  
pp. 701-712 ◽  
Author(s):  
Michael Charles Glath ◽  
Kevin Koudela ◽  
Eric Strauch
Keyword(s):  
Epoxy Composites ◽  
High Modulus ◽  
Compression Behavior
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