Low Temperature Fine-Pitch Wafer-Level Cu-Cu Bonding Using Nanoparticles Fabricated by PVD

2018 ◽  
Author(s):  
Zijian Wu ◽  
Qian Wang ◽  
Changming Song ◽  
Jian Cai
Keyword(s):  
Low Temperature ◽  
Wafer Level ◽  
Fine Pitch ◽  
Cu Bonding

scholarly journals The Effect of an Ag Nanofilm on Low-Temperature Cu/Ag-Ag/Cu Chip Bonding in Air

2021 ◽  
Vol 11 (20) ◽  
pp. 9444
Author(s):  
Yoonho Kim ◽  
Seungmin Park ◽  
Sarah Eunkyung Kim
Keyword(s):  
Low Temperature ◽  
High Performance ◽  
Bonding Process ◽  
Bonding Interface ◽  
Fine Pitch ◽  
Bonding Technology ◽  
Cu Bonding ◽  
Cu Oxidation ◽  
Pure Cu

Low-temperature Cu-Cu bonding technology plays a key role in high-density and high-performance 3D interconnects. Despite the advantages of good electrical and thermal conductivity and the potential for fine pitch patterns, Cu bonding is vulnerable to oxidation and the high temperature of the bonding process. In this study, chip-level Cu bonding using an Ag nanofilm at 150 °C and 180 °C was studied in air, and the effect of the Ag nanofilm was investigated. A 15-nm Ag nanofilm prevented Cu oxidation prior to the Cu bonding process in air. In the bonding process, Cu diffused rapidly to the bonding interface and pure Cu-Cu bonding occurred. However, some Ag was observed at the bonding interface due to the short bonding time of 30 min in the absence of annealing. The shear strength of the Cu/Ag-Ag/Cu bonding interface was measured to be about 23.27 MPa, with some Ag remaining at the interface. This study demonstrated the good bonding quality of Cu bonding using an Ag nanofilm at 150 °C.

Wafer level underfill study for high density ultra-fine pitch Cu-Cu bonding for 3D IC stacking

2014 ◽  
Author(s):  
Ling Xie ◽  
Sunil Wickramanayaka ◽  
Boo Yung Jung ◽  
Jerry Aw Jie Li ◽  
Lim Jung-kai ◽  
...  
Keyword(s):  
High Density ◽  
Wafer Level ◽  
3D Ic ◽  
Fine Pitch ◽  
Cu Bonding

Low Temperature Cu-to-Cu Bonding for Wafer-Level Hermetic Encapsulation of 3D Microsystems

2011 ◽  
Vol 14 (11) ◽  
pp. H470 ◽  
Author(s):  
J. Fan ◽  
D. F. Lim ◽  
L. Peng ◽  
K. H. Li ◽  
C. S. Tan
Keyword(s):  
Low Temperature ◽  
Wafer Level ◽  
Cu Bonding
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