Low Temperature Cu-to-Cu Bonding for Wafer-Level Hermetic Encapsulation of 3D Microsystems

2011 ◽  
Vol 14 (11) ◽  
pp. H470 ◽  
Author(s):  
J. Fan ◽  
D. F. Lim ◽  
L. Peng ◽  
K. H. Li ◽  
C. S. Tan
Keyword(s):  
Low Temperature ◽  
Wafer Level ◽  
Cu Bonding

Low Temperature Al-Al Thermo-compression Bonding with Sn Oxidation Protect Layer for Wafer-level Hermetic Sealing

2016 ◽  
Vol 136 (6) ◽  
pp. 237-243 ◽  
Author(s):  
Shiro Satoh ◽  
Hideyuki Fukushi ◽  
Masayoshi Esashi ◽  
Shuji Tanaka
Keyword(s):  
Low Temperature ◽  
Wafer Level ◽  
Hermetic Sealing

Hydrogen thermal reductive Cu nanowires in low temperature Cu–Cu bonding

2017 ◽  
Vol 27 (7) ◽  
pp. 075019 ◽  
Author(s):  
Li Du ◽  
Tielin Shi ◽  
Lei Su ◽  
Zirong Tang ◽  
Guanglan Liao
Keyword(s):  
Low Temperature ◽  
Cu Nanowires ◽  
Cu Bonding

High Precision Low Temperature Direct Wafer Bonding Technology for Wafer-Level 3D ICs Manufacturing

2016 ◽  
Vol 75 (9) ◽  
pp. 345-353 ◽  
Author(s):  
F. Kurz ◽  
T. Plach ◽  
J. Suss ◽  
T. Wagenleitner ◽  
D. Zinner ◽  
...  
Keyword(s):  
Low Temperature ◽  
High Precision ◽  
Wafer Bonding ◽  
Wafer Level ◽  
3D Ics ◽  
Direct Wafer Bonding ◽  
Bonding Technology

High-precision wafer-level Cu-Cu bonding for 3DICs

2014 ◽  
Author(s):  
Masashi Okada ◽  
Isao Sugaya ◽  
Hajime Mitsuishi ◽  
Hidehiro Maeda ◽  
Toshimasa Shimoda ◽  
...  
Keyword(s):  
High Precision ◽  
Wafer Level ◽  
Cu Bonding

scholarly journals Bonding-Based Wafer-Level Vacuum Packaging Using Atomic Hydrogen Pre-Treated Cu Bonding Frames

Micromachines ◽  
2018 ◽  
Vol 9 (4) ◽  
pp. 181 ◽  
Author(s):  
Koki Tanaka ◽  
Hideki Hirano ◽  
Masafumi Kumano ◽  
Joerg Froemel ◽  
Shuji Tanaka
Keyword(s):  
Atomic Hydrogen ◽  
Vacuum Packaging ◽  
Wafer Level ◽  
Cu Bonding
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