Effect of Underfill Formulation on Large-Die, Flip-Chip Organic Package Reliability: A Systematic Study on Compositional and Assembly Process Variations

2016 ◽  
Author(s):  
Marie-Claude Paquet ◽  
Catherine Dufort ◽  
Thomas E. Lombardi ◽  
Tuhin Sinha ◽  
Masahiro Hasegawa ◽  
...  
Keyword(s):  
Systematic Study ◽  
Flip Chip ◽  
Process Variations ◽  
Assembly Process ◽  
Package Reliability

Impact of Mechanical Simulation Methodology on Electronic Package Reliability Assessment with Applications to 3D TSS Technology

2010 ◽  
Vol 2010 (1) ◽  
pp. 000170-000175
Author(s):  
Zhongping Bao ◽  
James Burrell
Keyword(s):  
Product Development ◽  
Flip Chip ◽  
Semiconductor Industry ◽  
Reliability Assessment ◽  
Assembly Process ◽  
Development Cost ◽  
Mechanical Reliability ◽  
Simulation Methodology ◽  
Mechanical Simulation ◽  
Package Reliability

Mechanical reliability issues in electronic packages have drawn significant attention in semiconductor industry for decades and have increased product development cost significantly. Recent rapid growth of various portable electronic devices like smartphone and smartbook with increasing demand for more functionality in tighter space further challenges the limit of mechanical reliability. To reduce the product development cost and time-to-market, mechanical simulation has been extensively employed in semiconductor industry for the purpose of design optimization and reliability assessment. The importance of having the correct simulation methodology can't be overemphasized considering the extent of its utilization throughout the product development cycle. In this paper, we will discuss three fundamental mechanical modeling methodologies that are widely used for simulating flip-chip overmolded packages. These approaches are generally used to simulate package warpage at End-of-Line (EOL) as well as to assess package reliability from a stress point of view. The first approach we studied in this paper is to assume that the package is initially stress-free at a given uniform temperature, which is usually taken to be the peak temperature of the mold cure profile. However, this differs from the actual assembly process where package composition and cure profiles are different at each assembly processing step. The second approach simply accounts for that fact and assigns different stress-free temperature to each individual package component. For example, the die is assumed to be stress-free at the chip attach temperature and substrate is assumed to be stress-free instead at the substrate baking temperature. This approach captures more physics compared to the first approach. The last approach explores that idea further by simulating the actual assembly process, step by step, through element removal and addition techniques available in the software. Such study is also carried out for a flip-chip overmolded package with Through-Silicon-Stacking (TSS) technology. Both Die-to-Die-first (D2D) and Die-to-Substrate-first (D2S) processes are examined. Simulated warpage, as well as reliability assessment regarding different failure mechanisms using these three modeling methodologies are discussed in detail. The paper is prepared to the best knowledge of authors and those statements do not necessarily reflect opinions of Qualcomm Inc. Some data shared in this paper is normalized such that no commercial confidential information is published.

Development of an assembly process and reliability investigations for flip-chip LEDs using the AuSn soldering

2002 ◽  
Vol 7 (5-6) ◽  
pp. 239-243 ◽  
Author(s):  
G. Elger ◽  
M. Hutter ◽  
H. Oppermann ◽  
R. Aschenbrenner ◽  
H. Reichl ◽  
...  
Keyword(s):  
Flip Chip ◽  
Assembly Process

Micro-Mechanical Deformation Analysis of Surface Laminar Circuit in Organic Flip-Chip Package: An Experimental Study

2000 ◽  
Vol 122 (4) ◽  
pp. 294-300 ◽  
Author(s):  
B. Han ◽  
P. Kunthong
Keyword(s):  
Flip Chip ◽  
Thermal Loading ◽  
Region Of Interest ◽  
Deformation Analysis ◽  
High Modulus ◽  
Displacement Fields ◽  
Complex Deformation ◽  
Mechanical Deformations ◽  
Displacement Sensitivity ◽  
Package Reliability

Thermo-mechanical deformations of microstructures in a surface laminar circuit (SLC) substrate are quantified by microscopic moire´ interferometry. Two specimens are analyzed; a bare SLC substrate and a flip chip package assembly. The specimens are subjected to a uniform thermal loading of ΔT=−70°C and the microscopic displacement fields are documented at the identical region of interest. The nano-scale displacement sensitivity and the microscopic spatial resolution obtained from the experiments provide a faithful account of the complex deformation of the surface laminar layer and the embedded microstructures. The displacement fields are analyzed to produce the deformed configuration of the surface laminar layer and the strain distributions in the microstructures. The high modulus of underfill produces a strong coupling between the chip and the surface laminar layer, which produces a DNP-dependent shear deformation of the layer. The effect of the underfill on the deformation of the microstructures is investigated and its implications on the package reliability are discussed. [S1043-7398(00)01304-9]

Ultra-low Residue Flux Applications in RF Front-End Packages

2020 ◽  
Vol 2020 (1) ◽  
pp. 000125-000130
Author(s):  
Leo Hu ◽  
Sze Pei Lim
Keyword(s):  
Integrated Circuits ◽  
Flip Chip ◽  
Low Noise ◽  
Low Noise Amplifiers ◽  
Reflow Process ◽  
Reliability Study ◽  
Rf Switches ◽  
Front End ◽  
Rf Front End ◽  
Package Reliability

Abstract With the leap into the 5G era, the demand for improvements in the performance of mobile phones is on the rise. This is also true for the quantity of radio frequency (RF) front-end integrated circuits (ICs), especially for RF switches and low noise amplifiers (LNA). It is well-known that improvements in performance depend on the combination of new design, package technology, and choice of materials. Ultra-low residue (ULR) flux is an innovative, truly no-clean, flip-chip bonding material. By using ULR flux, the typical water-wash cleaning process can be removed and, in some instances, package reliability can be improved as well. This simplified assembly process will help to reduce total packaging costs. This paper will discuss the application of ULR fluxes on land grid arrays (LGAs) and quad-flat no-leads/dual-flat no-leads (QFN/DFN) packages for RF front-end ICs, as well as the reflow process. The solder joint strength and reliability study will be shared as well.

Flip-Chip Flux Evolution

2019 ◽  
Vol 2019 (1) ◽  
pp. 000115-000119 ◽  
Author(s):  
Andy Mackie ◽  
Hyoryoon Jo ◽  
Sze Pei Lim
Keyword(s):  
Flip Chip ◽  
Elevated Temperatures ◽  
High Volume ◽  
Automotive Electronics ◽  
Assembly Process ◽  
Surface Finishes ◽  
Solder Bumps ◽  
Thermocompression Bonding ◽  
Advanced Packaging ◽  
Flip Chip Assembly

Abstract Flip-chip assembly accounts for more than 80% of the advanced packaging technology platform, compared to fan-in, fan-out, embedded die, and through silicon via (TSV). Flip-chip interconnect remains a critical assembly process for large die used in artificial intelligence processors; thin die that warps at elevated temperatures; heterogeneous integration in SiP applications; flip-chip on leadframe; and MicroLED die usage. This paper will first outline trends in evolving flip-chip and direct chip placement (DCP) technology, then will examine the changing nature of the solder bump, the interconnect itself, and the substrate. Many variables of the flip-chip assembly process will be discussed, including standard solder bumps to micro Cu-pillar bumps with different alloys; different pad surface finishes of Cu OSP, NiAu, and solder on pad (SOP); and from regular pads on substrates to bond-on-trace applications. A major focus will be on flip-chip assembly methods, from old C4 conventional reflow processing to thermocompression bonding (TCB), and the latest laser assisted bonding (LAB) technology, with an emphasis on how the usage of different technologies necessitates different assembly materials, especially fluxes. Flip-chip fluxes such as the commonly used water-washable flux, the standard no-clean flux, and the ultra-low residue flux, and how these fluxes react to different processing methods, will be an area of discussion. Finally, the paper will examine the need for increased reliability as the technology inevitably moves into the high-volume, zero-defect arena of automotive electronics.

Surface Energy and Wettability Study of Flip Chip Packaging Materials

2011 ◽  
Vol 2011 (1) ◽  
pp. 000961-000970
Author(s):  
Jinlin Wang
Keyword(s):  
Surface Energy ◽  
Flip Chip ◽  
Substrate Surface ◽  
Solid Surfaces ◽  
Energy Calculation ◽  
Assembly Process ◽  
Flip Chip Packaging ◽  
Materials Used ◽  
Lead Free Solders ◽  
Ic Package

The surface energy of solid surfaces and surface tension of liquids are important parameters in the IC package assembly process. Wettability analyses have been completed for various materials used in the assembly process of flip chip packages, including underfills, substrates, fluxes, and lead free solders. We will highlight some of these results in this paper. We will focus our discussion on substrate surface energy analysis. A brief discussion of different surface energy methods and the liquid selection criteria will be given. The advantage and limitation of the surface energy calculation methods will be discussed. The data from several case studies will be presented. Our results show that contact angle and surface energy measurements are very useful for quality control and product development where interfacial properties are important.

Assessment of Alpha Emissivity of Packaging Materials and Method to Improve the Measurement Accuracy

2009 ◽  
Author(s):  
Peng Su ◽  
Rick Wong ◽  
Shi-Jie Wen ◽  
Li Li
Keyword(s):  
Process Control ◽  
Measurement Accuracy ◽  
Flip Chip ◽  
Error Rates ◽  
Soft Error ◽  
Packaging Materials ◽  
Assembly Process ◽  
Alpha Emission ◽  
Close Proximity ◽  
The Impact

Alpha emission from packaging materials is one of the major contributors for soft errors. Because of these materials’ immediate contact or close proximity to active areas of the silicon, even small increase in alpha emissivity may have significant impact on the performance of the device. In this work, we present the analytical steps to identify materials and manufacturing steps that caused high soft error rates for flip chip devices. We will also present some experimental results to highlight the impact of assembly process control. The results from these studies suggest that to minimize the impact of alpha emission from packaging materials, material set selection and assembly process control must be addressed simultaneously to ensure robust device performance.

Selection of Proper Fatigue Model for Flip Chip Package Reliability

2005 ◽  
pp. 393-398
Author(s):  
Young Eui Shin ◽  
Yeon Sung Kim ◽  
Hyoung-Il Kim ◽  
Jong Min Kim ◽  
Kyong Ho Chang ◽  
...  
Keyword(s):  
Flip Chip ◽  
Fatigue Model ◽  
Package Reliability ◽  
Selection Of
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