Evaluation of manufacturing assembly process impact on long term reliability of a high performance ASIC using flip chip hyperBGA pacuage

2004 ◽  
Author(s):  
Jie Xue ◽  
K. Hubbard ◽  
P. Li ◽  
J. Tang ◽  
J. Poom ◽  
...  
Keyword(s):  
High Performance ◽  
Flip Chip ◽  
Assembly Process ◽  
Manufacturing Assembly

No Flow Underfill Process Development for Fine Pitch Flip Chip Silicon to Silicon Wafer Level Integration

2010 ◽  
Vol 2010 (DPC) ◽  
pp. 000708-000735 ◽  
Author(s):  
Zhaozhi Li ◽  
John L. Evans ◽  
Paul N. Houston ◽  
Brian J. Lewis ◽  
Daniel F. Baldwin ◽  
...  
Keyword(s):  
High Performance ◽  
Flip Chip ◽  
Process Development ◽  
Low Cost ◽  
Three Dimensional ◽  
High Yield ◽  
Process Time ◽  
Assembly Process ◽  
Wafer Level ◽  
Fine Pitch

The industry has witnessed the adoption of flip chip for its low cost, small form factor, high performance and great I/O flexibility. As the Three Dimensional (3D) packaging technology moves to the forefront, the flip chip to wafer integration, which is also a silicon to silicon assembly, is gaining more and more popularity. Most flip chip packages require underfill to overcome the CTE mismatch between the die and substrate. Although the flip chip to wafer assembly is a silicon to silicon integration, the underfill is necessary to overcome the Z-axis thermal expansion as well as the mechanical impact stresses that occur during shipping and handling. No flow underfill is of special interest for the wafer level flip chip assembly as it can dramatically reduce the process time as well as bring down the average package cost since there is a reduction in the number of process steps and the dispenser and cure oven that would be necessary for the standard capillary underfill process. Chip floating and underfill outgassing are the most problematic issues that are associated with no flow underfill applications. The chip floating is normally associated with the size/thickness of the die and volume of the underfill dispensed. The outgassing of the no flow underfill is often induced by the reflow profile used to form the solder joint. In this paper, both issues will be addressed. A very thin, fine pitch flip chip and 2x2 Wafer Level CSP tiles are used to mimic the assembly process at the wafer level. A chip floating model will be developed in this application to understand the chip floating mechanism and define the optimal no flow underfill volume needed for the process. Different reflow profiles will be studied to reduce the underfill voiding as well as improve the processing yield. The no flow assembly process developed in this paper will help the industry understand better the chip floating and voiding issues regarding the no flow underfill applications. A stable, high yield, fine pitch flip chip no flow underfill assembly process that will be developed will be a very promising wafer level assembly technique in terms of reducing the assembly cost and improving the throughput.

Bumping Process Impact on the Chip Package Interaction (CPI) Reliability

2018 ◽  
Vol 2018 (1) ◽  
pp. 000270-000276 ◽  
Author(s):  
Lei Fu ◽  
Milind Bhagavat ◽  
Ivor Barber
Keyword(s):  
Integrated Circuit ◽  
Seed Layer ◽  
High Performance ◽  
Flip Chip ◽  
Leading Edge ◽  
Lead Free ◽  
Assembly Process ◽  
Chip Technology ◽  
Layer Deposition ◽  
Ic Package

Abstract Flip chip technology is widely used in advanced integrated circuit (IC) package. Chip package interaction (CPI) became critical in flip chip technology that needed to be addressed to avoid electrical or mechanical failure in products. When addressing CPI challenges, different areas have to be considered, ranging from silicon BEOL design and processing, bumping design and process, package assembly process, assembly bill of material (BOM), and substrate technology. Controlled collapse chip connection (C4) bump technology provided the inter-connection between the IC to package substrate for high-performance, leading-edge microprocessors. It is very critical for chip package interaction (CPI). With the transfer to lead free technology, bumping process plays more and more important role for chip package interaction reliability. In this paper, we focused on bumping process effect on the CPI reliability. The bumping process has been reviewed and CPI reliability issues induced by the bumping process like particles, Ti seed layer deposition, UBM undercut, Cu pad oxidation and contamination, photoresist opening damage have been discussed. Bumping process optimization and corrective actions have been taken to reduce those defects and improve CPI reliability.

Efficient Co-Harvesting of Solar Energy and Low-Grade Heat by Molecular Photoswitches for High Energy Density, Long-Term Stable Solar Thermal Battery

2019 ◽  
Author(s):  
Zhao-Yang Zhang ◽  
Tao LI
Keyword(s):  
Energy Density ◽  
Solar Energy ◽  
High Performance ◽  
High Energy ◽  
Solar Thermal ◽  
High Energy Density ◽  
Low Grade ◽  
Thermal Battery ◽  
Low Grade Heat

Solar energy and ambient heat are two inexhaustible energy sources for addressing the global challenge of energy and sustainability. Solar thermal battery based on molecular switches that can store solar energy and release it as heat has recently attracted great interest, but its development is severely limited by both low energy density and short storage stability. On the other hand, the efficient recovery and upgrading of low-grade heat, especially that of the ambient heat, has been a great challenge. Here we report that solar energy and ambient heat can be simultaneously harvested and stored, which is enabled by room-temperature photochemical crystal-to-liquid transitions of small-molecule photoswitches. The two forms of energy are released together to produce high-temperature heat during the reverse photochemical phase change. This strategy, combined with molecular design, provides high energy density of 320-370 J/g and long-term storage stability (half-life of about 3 months). On this basis, we fabricate high-performance, flexible film devices of solar thermal battery, which can be readily recharged at room temperature with good cycling ability, show fast rate of heat release, and produce high-temperature heat that is >20<sup> o</sup>C higher than the ambient temperature. Our work opens up a new avenue to harvest ambient heat, and demonstrate a feasible strategy to develop high-performance solar thermal battery.

Efficient Co-Harvesting of Solar Energy and Low-Grade Heat by Molecular Photoswitches for High Energy Density, Long-Term Stable Solar Thermal Battery

2019 ◽  
Author(s):  
Zhao-Yang Zhang ◽  
Tao LI
Keyword(s):  
Energy Density ◽  
Solar Energy ◽  
High Performance ◽  
High Energy ◽  
Solar Thermal ◽  
High Energy Density ◽  
Low Grade ◽  
Thermal Battery ◽  
Low Grade Heat

Solar energy and ambient heat are two inexhaustible energy sources for addressing the global challenge of energy and sustainability. Solar thermal battery based on molecular switches that can store solar energy and release it as heat has recently attracted great interest, but its development is severely limited by both low energy density and short storage stability. On the other hand, the efficient recovery and upgrading of low-grade heat, especially that of the ambient heat, has been a great challenge. Here we report that solar energy and ambient heat can be simultaneously harvested and stored, which is enabled by room-temperature photochemical crystal-to-liquid transitions of small-molecule photoswitches. The two forms of energy are released together to produce high-temperature heat during the reverse photochemical phase change. This strategy, combined with molecular design, provides high energy density of 320-370 J/g and long-term storage stability (half-life of about 3 months). On this basis, we fabricate high-performance, flexible film devices of solar thermal battery, which can be readily recharged at room temperature with good cycling ability, show fast rate of heat release, and produce high-temperature heat that is >20<sup> o</sup>C higher than the ambient temperature. Our work opens up a new avenue to harvest ambient heat, and demonstrate a feasible strategy to develop high-performance solar thermal battery.

Use Of Tai Chi Elements To Increase Respiratory Amplitude

2019 ◽  
pp. 11-20
Author(s):  
Mihai-Alexandru Citea ◽  
Marius Neculaes
Keyword(s):  
High Performance ◽  
Tai Chi ◽  
Sports Club ◽  
Optimal Functioning ◽  
Physiological Adaptations ◽  
Competitive Activity ◽  
Abdominal Breathing ◽  
Study Participants ◽  
Different Levels

High performance sport has a major impact on the physiological adaptations of the respiratory system. The importance of the optimal functioning of this system is essential to achieve top results in high performance sport but also in maintaining a long term health status. Science journals present numerous studies that highlight the benefits of practicing Tai Chi on the general population, with effects ranging from improving cardiac function, to influencing the immune system. The purpose of this study is to identify whether by practicing Tai Chi forms a athlete can change their breathing pattern and develop their respiratory amplitude. The subjects of the study were 22 fencing practitioners, accredited at the Iași Municipal Sports Club (C.S.M. Iași), aged between 14 and 18 years, with over 3 years of competitive activity. Materials and method: The study participants were evaluated initially and at the end of 7 months of practice. The frequency was 3 sessions per week, and the duration of each session was 20-30 minutes. The evaluation consisted in measuring the circumference of the thorax at 3 different levels: subaxillary, medial thorax (T6-T7) and lower rib (diaphragmatic) in maximal inspiration and expiration. Conclusions: A constant evolution is observed in most of the exposed cases. In cases where this evolution is not visible, a change in the breathing mode can be noticed, transforming from an upper rib breathing into a thoracic or abdominal breathing. With the exception of one case, all subjects had an improvement of the value in the lower rib level.

scholarly journals Review on Development and Dental Applications of Polyetheretherketone-Based Biomaterials and Restorations

Materials ◽  
2021 ◽  
Vol 14 (2) ◽  
pp. 408 ◽  
Author(s):  
Ludan Qin ◽  
Shuo Yao ◽  
Jiaxin Zhao ◽  
Chuanjian Zhou ◽  
Thomas W. Oates ◽  
...  
Keyword(s):  
High Performance ◽  
Dental Resin ◽  
Oral Environment ◽  
Inert Surface ◽  
Oral Implant ◽  
Long Term Performance ◽  
Dental Applications ◽  
Term Performance ◽  
Orthopedic Applications

Polyetheretherketone (PEEK) is an important high-performance thermoplastic. Its excellent strength, stiffness, toughness, fatigue resistance, biocompatibility, chemical stability and radiolucency have made PEEK attractive in dental and orthopedic applications. However, PEEK has an inherently hydrophobic and chemically inert surface, which has restricted its widespread use in clinical applications, especially in bonding with dental resin composites. Cutting edge research on novel methods to improve PEEK applications in dentistry, including oral implant, prosthodontics and orthodontics, is reviewed in this article. In addition, this article also discusses innovative surface modifications of PEEK, which are a focus area of active investigations. Furthermore, this article also discusses the necessary future studies and clinical trials for the use of PEEK in the human oral environment to investigate its feasibility and long-term performance.

Interpenetrating Gels as Conducting/Adhering Matrices Enabling High-Performance Silicon Anodes

2021 ◽  
Author(s):  
Tingting Xia ◽  
Chengfei Xu ◽  
Pengfei Dai ◽  
Xiaoyun Li ◽  
Riming Lin ◽  
...  
Keyword(s):  
Energy Storage ◽  
High Performance ◽  
Electrode Materials ◽  
Three Dimensional ◽  
Electrochemical Energy Storage ◽  
Active Materials ◽  
Silicon Anodes ◽  
Weak Binding ◽  
Binding Forces

Three-dimensional (3D) conductive polymers are promising conductive matrices for electrode materials toward electrochemical energy storage. However, their fragile nature and weak binding forces with active materials could not guarantee long-term...

scholarly journals Long Term Interactions of Native and Invasive Species in a Marine Protected Area Suggest Complex Cascading Effects Challenging Conservation Outcomes

Diversity ◽  
2021 ◽  
Vol 13 (2) ◽  
pp. 71
Author(s):  
Charalampos Dimitriadis ◽  
Ivoni Fournari-Konstantinidou ◽  
Laurent Sourbès ◽  
Drosos Koutsoubas ◽  
Stelios Katsanevakis
Keyword(s):  
Invasive Species ◽  
Native Species ◽  
High Performance ◽  
Marine Protected Area ◽  
Habitat Degradation ◽  
Population Increase ◽  
Rocky Reef ◽  
Cascading Effects ◽  
High Level

Understanding the interactions among invasive species, native species and marine protected areas (MPAs), and the long-term regime shifts in MPAs is receiving increased attention, since biological invasions can alter the structure and functioning of the protected ecosystems and challenge conservation efforts. Here we found evidence of marked modifications in the rocky reef associated biota in a Mediterranean MPA from 2009 to 2019 through visual census surveys, due to the presence of invasive species altering the structure of the ecosystem and triggering complex cascading effects on the long term. Low levels of the populations of native high-level predators were accompanied by the population increase and high performance of both native and invasive fish herbivores. Subsequently the overgrazing and habitat degradation resulted in cascading effects towards the diminishing of the native and invasive invertebrate grazers and omnivorous benthic species. Our study represents a good showcase of how invasive species can coexist or exclude native biota and at the same time regulate or out-compete other established invaders and native species.

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