Lead-Free Flip Chip Package Reliability and the Finite Element-Factorial Design Methodology

2006 ◽  
Author(s):  
Chien-chia Chiu ◽  
Chung-jung Wu ◽  
Chih-tang Peng ◽  
Kuo-ning Chiang ◽  
Terry Ku ◽  
...  
Keyword(s):  
Finite Element ◽  
Factorial Design ◽  
Design Methodology ◽  
Flip Chip ◽  
Lead Free ◽  
Package Reliability

Failure life prediction and factorial design of lead‐free flip chip package

2007 ◽  
Vol 30 (3) ◽  
pp. 481-490 ◽  
Author(s):  
Chien‐Chia Chiu ◽  
Chung‐Jung Wu ◽  
Chih‐Tang Peng ◽  
Kuo‐Ning Chiang ◽  
Terry Ku ◽  
...  
Keyword(s):  
Factorial Design ◽  
Life Prediction ◽  
Flip Chip ◽  
Lead Free ◽  
Failure Life

Advanced Simulation/Modeling and Reliability of Fine Pitch (130um) Lead-Free Flip-Chip Package

2008 ◽  
Author(s):  
Bahareh Banijamali ◽  
Ilyas Mohammed
Keyword(s):  
Fatigue Life ◽  
Life Prediction ◽  
Flip Chip ◽  
Solder Bump ◽  
Fatigue Life Prediction ◽  
Lead Free ◽  
Design Parameters ◽  
Chip Technology ◽  
Low K ◽  
Package Reliability

Flip-chip technology has been introduced in recent years which accommodate the ever increasing demands for higher performance and I/O density, while achieving smaller form factor and offering a cost effective solution. As the industry moves toward the 65nm and 45nm technology node, die sizes require a significant reduction while accommodating the need for tighter and finer pitches. For decades, the C4 process has served as the main interconnect method in the flip-chip package. But with bump pitches shrinking, the solder bump based C4 process is facing challenges in terms of reducing pitch and underfill process. At the same time, increasing challenges for flip-chip are seen by the movement toward lead-free solder bumps and low-k dielectric layers. This work conducted simulations and analyses on Tessera developmental μPILR flip chip package incorporating a 130um pitch bump array, using 3-D finite element method (FEM). This study explores the effect of various design parameters on package reliability while providing suggestions for selecting packaging materials. Based on modeling data certain set of over mold, underfill and thermal interface materials enhance overall package reliability performance. Solder fatigue life prediction was performed and solder bump reliability was compared for Tessera flip chip technology and standard flip chip solder joints using Modified Anand solder material properties and Darveaux fatigue life prediction theory. Further more, fracture mechanics approach was applied, and energy release rates were obtained in order to check reliability of low-k dielectric layer, provided passive/low-k material selection. The data presented here provides a baseline for reliability/feasibility of Tessera developmental μPILR flip chip package design for 130um bump pitch. Experimental reliability data is not complete at this time but will be available and published soon.

Development of Lead-Free Compatible Molded Underfill (MUF) Materials for Flip Chip Stacked Packaging: Key Challenges and Learnings

2005 ◽  
Author(s):  
Vassou LeBonheur ◽  
Choong Kooi Chee
Keyword(s):  
Flip Chip ◽  
Coefficient Of Thermal Expansion ◽  
Lead Free ◽  
Filler Concentration ◽  
Moisture Resistance ◽  
Potential Applications ◽  
Reliability Performance ◽  
Relationship Of ◽  
Package Reliability ◽  
Structure Properties

This paper reports the structure-properties-performance relationship of various molded underfill materials for potential applications in flip-chip MMAP (FCMMAP) and mixed technology (FC and WB) stacked CSP (MTsCSP) packages. Chemical, rheological, and thermo-mechanical properties of five high temperature reflow compatible materials were characterized and relationship to materials processability & package reliability performance were investigated. Materials having higher filler concentration and lower coefficient of thermal expansion tended to exhibit improved HTR compatibility due to improved moisture resistance and decreased CTE mis-match.

Application of Finite Element Method in Optimal Design of Flip-Chip Package

2011 ◽  
Vol 264-265 ◽  
pp. 1660-1665
Author(s):  
Yong Cheng Lin ◽  
Yu Chi Xia
Keyword(s):  
Finite Element ◽  
Fatigue Life ◽  
Solder Joint ◽  
Thermal Fatigue ◽  
Flip Chip ◽  
Solder Joints ◽  
Temperature Cycling ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

More and more solder joints in circuit boards and electronic products are changing to lead free solder, placing an emphasis on lead free solder joint reliability. Solder joint fatigue failure is a serious reliability concern in area array technologies. In this study, the effects of substrate materials on the solder joint thermal fatigue life were investigated by finite element model. Accelerated temperature cycling loading was imposed to evaluate the reliability of solder joints. The thermal strain/stress in solder joints of flip chip assemblies with different substrates was compared, and the fatigue life of solder joints were evaluated by Darveaux’s crack initiation and growth model. The results show the mechanisms of substrate flexibility on improving solder joint thermal fatigue.

scholarly journals Stator Non-Uniform Radial Ventilation Design Methodology for a 15 MW Turbo-Synchronous Generator Based on Single Ventilation Duct Subsystem

Energies ◽  
2021 ◽  
Vol 14 (10) ◽  
pp. 2760
Author(s):  
Ruiye Li ◽  
Peng Cheng ◽  
Hai Lan ◽  
Weili Li ◽  
David Gerada ◽  
...  
Keyword(s):  
Finite Element ◽  
Temperature Distribution ◽  
Design Methodology ◽  
Large Scale ◽  
Synchronous Generator ◽  
Axial Direction ◽  
Scale Model ◽  
Element Analysis ◽  
Axial Temperature ◽  
Ventilation Duct

Within large turboalternators, the excessive local temperatures and spatially distributed temperature differences can accelerate the deterioration of electrical insulation as well as lead to deformation of components, which may cause major machine malfunctions. In order to homogenise the stator axial temperature distribution whilst reducing the maximum stator temperature, this paper presents a novel non-uniform radial ventilation ducts design methodology. To reduce the huge computational costs resulting from the large-scale model, the stator is decomposed into several single ventilation duct subsystems (SVDSs) along the axial direction, with each SVDS connected in series with the medium of the air gap flow rate. The calculation of electromagnetic and thermal performances within SVDS are completed by finite element method (FEM) and computational fluid dynamics (CFD), respectively. To improve the optimization efficiency, the radial basis function neural network (RBFNN) model is employed to approximate the finite element analysis, while the novel isometric sampling method (ISM) is designed to trade off the cost and accuracy of the process. It is found that the proposed methodology can provide optimal design schemes of SVDS with uniform axial temperature distribution, and the needed computation cost is markedly reduced. Finally, results based on a 15 MW turboalternator show that the peak temperature can be reduced by 7.3 ∘C (6.4%). The proposed methodology can be applied for the design and optimisation of electromagnetic-thermal coupling of other electrical machines with long axial dimensions.

Investigation on the shaft voltage generation of large synchronous turboalternators

2020 ◽  
Vol 39 (5) ◽  
pp. 1145-1156
Author(s):  
Kevin Darques ◽  
Abdelmounaïm Tounzi ◽  
Yvonnick Le-menach ◽  
Karim Beddek
Keyword(s):  
Finite Element ◽  
Design Methodology ◽  
Short Circuit ◽  
Element Model ◽  
Stator Winding ◽  
Content Type ◽  
Voltage Generation ◽  
The Impact ◽  
Investigation Process ◽  
Circulating Currents

Purpose This paper aims to go deeper on the analysis of the shaft voltage of large turbogenerators. The main interest of this study is the investigation process developed. Design/methodology/approach The analysis of the shaft voltage because of several defects is based on a two-dimensional (2D) finite element modeling. This 2D finite element model is used to determine the shaft voltage because of eccentricities or rotor short-circuit. Findings Dynamic eccentricities and rotor short circuit do not have an inherent impact on the shaft voltage. Circulating currents in the stator winding because of defects impact the shaft voltage. Originality/value The original value of this paper is the investigation process developed. This study proposes to quantify the impact of a smooth stator and then to explore the contribution of the real stator winding on the shaft voltage.

scholarly journals Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis

2001 ◽  
Vol 42 (5) ◽  
pp. 809-813 ◽  
Author(s):  
Young-Eui Shin ◽  
Kyung-Woo Lee ◽  
Kyong-Ho Chang ◽  
Seung-Boo Jung ◽  
Jae Pil Jung
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Lead Free ◽  
Element Analysis ◽  
Thermal Fatigue Life
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