Design and assembly process effects on lead free solder joint reliability of bare die and lidded flip chip ball grid array packages

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2015.7159576 ◽

2015 ◽

Cited By ~ 1

Author(s):

Dongming He ◽

Brian Roggeman ◽

Eric Zhou ◽

Jiantao Zheng ◽

Pat Holmes

Keyword(s):

Flip Chip ◽

Ball Grid Array ◽

Lead Free ◽

Lead Free Solder ◽

Assembly Process ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Process Effects ◽

Free Solder ◽

Ball Grid Array Packages

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Solder Joint Reliability Assessment for Flip Chip Ball Grid Array Components with Various Designs in Lead-Free Solder Materials and Solder Mask Dimensions

Journal of Electronic Materials ◽

10.1007/s11664-006-0026-z ◽

2006 ◽

Vol 36 (1) ◽

pp. 6-16 ◽

Cited By ~ 3

Author(s):

Y. S. Chen ◽

C. S. Wang ◽

T. C. Wang ◽

W. H. Chan ◽

K. C. Chang ◽

...

Keyword(s):

Solder Joint ◽

Flip Chip ◽

Reliability Assessment ◽

Ball Grid Array ◽

Lead Free ◽

Lead Free Solder ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Solder Mask ◽

Free Solder

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Lead-free solder paste selection and solder joint reliability for copper stud flip chip

2008 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2008.4784234 ◽

2008 ◽

Author(s):

Fon Bih Wen ◽

Shutesh Krishnan ◽

Yo Meng Chan

Keyword(s):

Solder Joint ◽

Flip Chip ◽

Lead Free ◽

Lead Free Solder ◽

Solder Paste ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Free Solder

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Lead‐free solder joint reliability estimation of flip chip package using FEM‐based sensitivity analysis

Soldering & Surface Mount Technology ◽

10.1108/09540910910928283 ◽

2009 ◽

Vol 21 (1) ◽

pp. 31-41 ◽

Cited By ~ 7

Author(s):

Chang‐Chun Lee ◽

Kuo‐Chin Chang ◽

Ya‐Wen Yang

Keyword(s):

Sensitivity Analysis ◽

Solder Joint ◽

Flip Chip ◽

Reliability Estimation ◽

Lead Free ◽

Lead Free Solder ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Free Solder

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An improved peel stress-based correlation to predict solder joint reliability of lidded flip chip ball grid array packages

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2015.7159857 ◽

2015 ◽

Author(s):

Guangxu Li ◽

Siva P. Gurrum

Keyword(s):

Solder Joint ◽

Flip Chip ◽

Ball Grid Array ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Ball Grid Array Packages ◽

Peel Stress

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Solder joint reliability of Sn–0·7Cu and Sn–0·3Ag–0·7Cu lead-free solder alloys solidified on copper substrates with different surface roughnesses

Materials Science and Technology ◽

10.1179/1743284713y.0000000287 ◽

2013 ◽

Vol 29 (12) ◽

pp. 1430-1440 ◽

Cited By ~ 2

Author(s):

Satyanarayan ◽

K N Prabhu

Keyword(s):

Solder Joint ◽

Lead Free ◽

Lead Free Solder ◽

Solder Alloys ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Free Solder

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Process Development and Solder Joint Reliability of a New Lead-Free Solder: Sn3wt%Ag0.5wt%Cu0.019wt%Ce (SACC)

2007 9th Electronics Packaging Technology Conference ◽

10.1109/eptc.2007.4469811 ◽

2007 ◽

Cited By ~ 1

Author(s):

John Lau ◽

Sang Liu ◽

Dongkai Shangguan ◽

Zhi Wei Song ◽

David Geiger

Keyword(s):

Solder Joint ◽

Process Development ◽

Lead Free ◽

Lead Free Solder ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Free Solder

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Low silver lead-free solder joint reliability of VFBGA packages under board level drop test at −45°C

2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy ◽

10.1109/isaf.2014.6917970 ◽

2014 ◽

Author(s):

Xiaoyan Niu ◽

Zhanbiao Zhang ◽

Guixiang Wang ◽

Xuefeng Shu

Keyword(s):

Solder Joint ◽

Drop Test ◽

Lead Free ◽

Lead Free Solder ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Free Solder ◽

Board Level

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Influence of elements in lead-free solder with electrolytic Ni and electroless NiP layers during extended time reflow on ball grid array packages

Microelectronics Reliability ◽

10.1016/j.microrel.2005.02.015 ◽

2005 ◽

Author(s):

M ISLAM ◽

Y CHAN

Keyword(s):

Ball Grid Array ◽

Lead Free ◽

Lead Free Solder ◽

Extended Time ◽

Free Solder ◽

Ball Grid Array Packages

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Lead-Free Solder Joint Reliability

Lead-Free Soldering ◽

10.1007/978-0-387-68422-2_6 ◽

2007 ◽

pp. 145-172 ◽

Cited By ~ 4

Author(s):

Jean-Paul Clech

Keyword(s):

Solder Joint ◽

Lead Free ◽

Lead Free Solder ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Free Solder

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The study of vibrational performance on different doped low creep lead free solder paste and solder ball grid array packages

Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2014.6892379 ◽

2014 ◽

Cited By ~ 7

Author(s):

Sivasubramanian Thirugnanasambandam ◽

Thomas Sanders ◽

Anto Raj ◽

Derrick Stone ◽

John Evans ◽

...

Keyword(s):

Solder Ball ◽

Ball Grid Array ◽

Lead Free ◽

Lead Free Solder ◽

Solder Paste ◽

Free Solder ◽

Ball Grid Array Packages

Download Full-text