An improved peel stress-based correlation to predict solder joint reliability of lidded flip chip ball grid array packages

2015 ◽  
Author(s):  
Guangxu Li ◽  
Siva P. Gurrum
Keyword(s):  
Solder Joint ◽  
Flip Chip ◽  
Ball Grid Array ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Ball Grid Array Packages ◽  
Peel Stress

Thermal and Physical Characterization and Curing Kinetics Study of a Novel Curable Fillet Forming Ball Attach Flux for Improvement of Solder Joint Reliability on Ball Grid Array Packages

2003 ◽  
Author(s):  
Dennis Prem Kumar Chandran ◽  
Yi He ◽  
Eng Chiang Gan
Keyword(s):  
Thermal Properties ◽  
Solder Joint ◽  
Physical Properties ◽  
Ball Grid Array ◽  
Curing Kinetics ◽  
Kinetics Study ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Ball Grid Array Packages

This paper concentrates on the characterization of a novel curable fillet forming ball attach flux. This polymer based material is expected to improve 2nd level interconnet solder joint reliability on ball grid array packages. The evaluations reported in this paper consist of the characterization of their physical and thermal properties. With the understanding of the materials physical properties, the failing mechanism, and material robustness can be predicted.

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