Influence of elements in lead-free solder with electrolytic Ni and electroless NiP layers during extended time reflow on ball grid array packages

The study of vibrational performance on different doped low creep lead free solder paste and solder ball grid array packages

Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2014.6892379 ◽

2014 ◽

Cited By ~ 7

Author(s):

Sivasubramanian Thirugnanasambandam ◽

Thomas Sanders ◽

Anto Raj ◽

Derrick Stone ◽

John Evans ◽

...

Keyword(s):

Solder Ball ◽

Ball Grid Array ◽

Lead Free ◽

Lead Free Solder ◽

Solder Paste ◽

Free Solder ◽

Ball Grid Array Packages

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Evaluation of Lead-Free Solder Bump Voiding Ball Grid Array Packages Using Laser Ultrasound and Interferometric Technique

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2013.2262500 ◽

2013 ◽

Vol 3 (8) ◽

pp. 1310-1320 ◽

Cited By ~ 2

Author(s):

Ifeanyi Charles Ume ◽

Jie Gong

Keyword(s):

Solder Bump ◽

Ball Grid Array ◽

Lead Free ◽

Laser Ultrasound ◽

Lead Free Solder ◽

Interferometric Technique ◽

Free Solder ◽

Ball Grid Array Packages

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Design and assembly process effects on lead free solder joint reliability of bare die and lidded flip chip ball grid array packages

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2015.7159576 ◽

2015 ◽

Cited By ~ 1

Author(s):

Dongming He ◽

Brian Roggeman ◽

Eric Zhou ◽

Jiantao Zheng ◽

Pat Holmes

Keyword(s):

Flip Chip ◽

Ball Grid Array ◽

Lead Free ◽

Lead Free Solder ◽

Assembly Process ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Process Effects ◽

Free Solder ◽

Ball Grid Array Packages

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Nondestructive Evaluation of Poor-Wetted Lead-Free Solder Bumps in Ball Grid Array Packages Using Laser Ultrasound and Interferometric Technique

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2012.2226033 ◽

2013 ◽

Vol 3 (8) ◽

pp. 1301-1309 ◽

Cited By ~ 6

Author(s):

Jie Gong ◽

I. Charles Ume

Keyword(s):

Nondestructive Evaluation ◽

Ball Grid Array ◽

Lead Free ◽

Laser Ultrasound ◽

Lead Free Solder ◽

Interferometric Technique ◽

Solder Bumps ◽

Free Solder ◽

Ball Grid Array Packages

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Application of response surface methods in Lead-free solder joints of plastic ball grid array thermal fatigue life prediction

2011 12th International Conference on Electronic Packaging Technology and High Density Packaging ◽

10.1109/icept.2011.6066961 ◽

2011 ◽

Cited By ~ 1

Author(s):

Zhao Qiang ◽

Dejian Zhou

Keyword(s):

Life Prediction ◽

Ball Grid Array ◽

Fatigue Life Prediction ◽

Lead Free ◽

Lead Free Solder ◽

Response Surface Methods ◽

Thermal Fatigue Life ◽

Plastic Ball ◽

Plastic Ball Grid Array ◽

Free Solder

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Methodology for Analyzing Slip Behavior in Ball Grid Array Lead-Free Solder Joints After Simple Shear

Journal of Electronic Materials ◽

10.1007/s11664-009-0929-6 ◽

2009 ◽

Vol 38 (12) ◽

pp. 2702-2711 ◽

Cited By ~ 36

Author(s):

Bite Zhou ◽

Thomas R. Bieler ◽

Tae-Kyu Lee ◽

Kuo-Chuan Liu

Keyword(s):

Simple Shear ◽

Solder Joints ◽

Ball Grid Array ◽

Lead Free ◽

Lead Free Solder ◽

Free Solder

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Solder Joint Reliability Assessment for Flip Chip Ball Grid Array Components with Various Designs in Lead-Free Solder Materials and Solder Mask Dimensions

Journal of Electronic Materials ◽

10.1007/s11664-006-0026-z ◽

2006 ◽

Vol 36 (1) ◽

pp. 6-16 ◽

Cited By ~ 3

Author(s):

Y. S. Chen ◽

C. S. Wang ◽

T. C. Wang ◽

W. H. Chan ◽

K. C. Chang ◽

...

Keyword(s):

Solder Joint ◽

Flip Chip ◽

Reliability Assessment ◽

Ball Grid Array ◽

Lead Free ◽

Lead Free Solder ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Solder Mask ◽

Free Solder

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Ball Grid Array Lead-Free Solder Joint Strength under Monotonic Flexural Load

Journal of ASTM International ◽

10.1520/jai103044 ◽

2010 ◽

Vol 7 (6) ◽

pp. 103044 ◽

Cited By ~ 1

Author(s):

Phil Geng ◽

S. W. Dean

Keyword(s):

Solder Joint ◽

Joint Strength ◽

Ball Grid Array ◽

Lead Free ◽

Lead Free Solder ◽

Free Solder

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Simulations of the impact of single-grained lead-free solder joints on the reliability of ball Grid Array components

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2017.7926289 ◽

2017 ◽

Cited By ~ 1

Author(s):

Andreas Lovberg ◽

Per-Erik Tegehall ◽

Goran Wetter ◽

Klas Brinkfeldt ◽

Dag Andersson

Keyword(s):

Solder Joints ◽

Ball Grid Array ◽

Lead Free ◽

Lead Free Solder ◽

Free Solder ◽

The Impact

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Impact of crystalline orientation of lead-free solder joints on thermomechanical response and reliability of ball grid array components

Microelectronics Reliability ◽

10.1016/j.microrel.2020.113812 ◽

2020 ◽

Vol 114 ◽

pp. 113812

Author(s):

E. Ben Romdhane ◽

A. Guédon-Gracia ◽

S. Pin ◽

P. Roumanille ◽

H. Frémont

Keyword(s):

Solder Joints ◽

Ball Grid Array ◽

Lead Free ◽

Lead Free Solder ◽

Crystalline Orientation ◽

Thermomechanical Response ◽

Free Solder

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