2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
Latest Publications

TOTAL DOCUMENTS

367

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H-INDEX

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Published By IEEE

9781479986095

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Defect mitigation of plasma-induced delamination of TiW/Cu from SiNx layer in thin si interposer processing with glass carriers

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2015.7159703 ◽

2015 ◽

Author(s):

Vijay Sukumaran ◽

Thuy Tran-Quinn ◽

Jorge Lubguban ◽

Dave Webster ◽

Brittany Hedrick ◽

...

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Development and application of a micro-infrared photoelasticity system for stress evaluation of through-silicon Vias (TSV)

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2015.7159841 ◽

2015 ◽

Cited By ~ 1

Author(s):

Fei Su ◽

Tianbao Lan ◽

Xiaoxu Pan ◽

Zheng Zhang

Keyword(s):

Through Silicon Vias ◽

Stress Evaluation ◽

Silicon Vias

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Analysis of copper plasticity impact in TSV-middle and backside TSV-last fabrication processes

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2015.7159723 ◽

2015 ◽

Cited By ~ 4

Author(s):

Wei Guo ◽

Aditya P. Karmarkar ◽

Xiaopeng Xu ◽

Geert Van der Plas ◽

Stefaan Van Huylenbroeck ◽

...

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Three-dimensional integration technology for sensor application using 5-µm-pitch au cone bump connections

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2015.7159775 ◽

2015 ◽

Cited By ~ 3

Author(s):

Makoto Motoyoshi ◽

Kohki Yanagimura ◽

Junichi Takanohashi ◽

Mariappan Murugesan ◽

Masahiro Aoyagi ◽

...

Keyword(s):

Three Dimensional ◽

Integration Technology ◽

Sensor Application

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Solder printability of a stencil with a hydrophobic organic coating

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2015.7159596 ◽

2015 ◽

Cited By ~ 1

Author(s):

Kyoung-Ho Kim ◽

Min-Soo Kang ◽

Ji-Young Jang ◽

Chang-Joon Lee ◽

Yong-Won Lee ◽

...

Keyword(s):

Organic Coating

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Assembly and integration of optical sensors based on quantum dots-in-well in double-barrier photodetector array

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2015.7159821 ◽

2015 ◽

Cited By ~ 1

Author(s):

M. J. Wang ◽

W. Wang ◽

H.D. Lu ◽

F.M. Guo ◽

F. Y. Yue ◽

...

Keyword(s):

Quantum Dots ◽

Optical Sensors ◽

Double Barrier ◽

Photodetector Array

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Investigation of thermo-mechanical stresses and reliability of 3D die-stack structures by synchrotron x-ray micro-diffraction

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2015.7159829 ◽

2015 ◽

Cited By ~ 1

Author(s):

Tengfei Jiang ◽

Peng Su ◽

Patrick Kim ◽

Cassie Bassett ◽

Kevin Sichak ◽

...

Keyword(s):

Mechanical Stresses ◽

X Ray

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Two-dimensional (2D) in-plane strain mapping using a laser scanning technique on the cross-section of a microelectronics package

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2015.7159623 ◽

2015 ◽

Cited By ~ 2

Author(s):

Hanshuang Liang ◽

Todd Houghton ◽

Zeming Song ◽

Teng Ma ◽

Hoa Nguyen ◽

...

Keyword(s):

Plane Strain ◽

Cross Section ◽

Laser Scanning ◽

Two Dimensional ◽

Strain Mapping ◽

Scanning Technique ◽

The Cross

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Technology of packaging by Liquid Mold-Underfill (MUF) material for advanced mobile devices

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2015.7159588 ◽

2015 ◽

Author(s):

Yuki Ishikawa ◽

Joji Yukimaru ◽

Tomoya Takao ◽

Kazuhiro Ikeda ◽

Kazuaki Yamane ◽

...

Keyword(s):

Mobile Devices

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Low stress bonding for large size die application

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2015.7159851 ◽

2015 ◽

Cited By ~ 8

Author(s):

Kei Murayama ◽

Mitsuhiro Aizawa ◽

Takashi Kurihara

Keyword(s):

Large Size

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2015 IEEE 65th Electronic Components and Technology Conference (ECTC)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Defect mitigation of plasma-induced delamination of TiW/Cu from SiNx layer in thin si interposer processing with glass carriers

Development and application of a micro-infrared photoelasticity system for stress evaluation of through-silicon Vias (TSV)

Analysis of copper plasticity impact in TSV-middle and backside TSV-last fabrication processes

Three-dimensional integration technology for sensor application using 5-µm-pitch au cone bump connections

Solder printability of a stencil with a hydrophobic organic coating

Assembly and integration of optical sensors based on quantum dots-in-well in double-barrier photodetector array

Investigation of thermo-mechanical stresses and reliability of 3D die-stack structures by synchrotron x-ray micro-diffraction

Two-dimensional (2D) in-plane strain mapping using a laser scanning technique on the cross-section of a microelectronics package

Technology of packaging by Liquid Mold-Underfill (MUF) material for advanced mobile devices

Low stress bonding for large size die application

2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
Latest Publications