Thermal shock and drop test performance of lead-free assemblies with no-underfill, corner-underfill and full-underfill

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2010.5490673 ◽

2010 ◽

Cited By ~ 11

Author(s):

Bankeem V Chheda ◽

S. Manian Ramkumar ◽

Reza Ghaffarian

Keyword(s):

Thermal Shock ◽

Test Performance ◽

Drop Test ◽

Lead Free

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Using High Speed Shear and Cold Ball Pull to Characterize Lead Free Solder Alloys and Predict Board Level Drop Test Performance

2007 Proceedings 57th Electronic Components and Technology Conference ◽

10.1109/ectc.2007.373848 ◽

2007 ◽

Cited By ~ 5

Author(s):

Michael E. Johnson ◽

Henry Y. Lu ◽

David Lawhead ◽

Ted Tessier ◽

Doug Scott ◽

...

Keyword(s):

Test Performance ◽

High Speed ◽

Drop Test ◽

Lead Free ◽

Lead Free Solder ◽

Solder Alloys ◽

Free Solder ◽

Board Level

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Influence of process parameters on component assembly and drop test performance using a novel Anisotropic Conductive Adhesive for lead-free surface mount assembly

2008 58th Electronic Components and Technology Conference ◽

10.1109/ectc.2008.4549974 ◽

2008 ◽

Cited By ~ 2

Author(s):

S. Manian Ramkumar ◽

K. Srihari

Keyword(s):

Free Surface ◽

Process Parameters ◽

Test Performance ◽

Drop Test ◽

Conductive Adhesive ◽

Lead Free ◽

Influence Of Process Parameters ◽

Surface Mount ◽

Anisotropic Conductive Adhesive ◽

Component Assembly

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A Study of Nano Particles in SnAg-Based Lead Free Solders for Intermetallic Compounds and Drop Test Performance

56th Electronic Components and Technology Conference 2006 ◽

10.1109/ectc.2006.1645802 ◽

2006 ◽

Cited By ~ 28

Author(s):

M. Amagai

Keyword(s):

Intermetallic Compounds ◽

Test Performance ◽

Drop Test ◽

Nano Particles ◽

Lead Free ◽

Lead Free Solders

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Alloying design of Sn-Ag-Cu solders for the improvement in drop test performance

2008 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2008.4784222 ◽

2008 ◽

Cited By ~ 2

Author(s):

Li-Wei Lin ◽

Jenn-Ming Song ◽

Yi-Shao Lai ◽

Ying-Ta Chiu ◽

Ning-Cheng Lee

Keyword(s):

Test Performance ◽

Drop Test

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Proportional Hazard Model of doped low creep lead free solder paste under thermal shock

2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2016.7517683 ◽

2016 ◽

Cited By ~ 8

Author(s):

Anto Raj ◽

Sivasubramanian Thirugnanasambandam ◽

Thomas Sanders ◽

Sharath Sridhar ◽

Seth Gordon ◽

...

Keyword(s):

Thermal Shock ◽

Hazard Model ◽

Lead Free ◽

Lead Free Solder ◽

Solder Paste ◽

Proportional Hazard ◽

Proportional Hazard Model ◽

Free Solder

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Influence of Component Position on Lead-Free Solder Interconnections during Drop Test

2005 7th Electronic Packaging Technology Conference ◽

10.1109/eptc.2005.1614367 ◽

2006 ◽

Cited By ~ 1

Author(s):

E.L. Bonnaud ◽

P. Gudmundson

Keyword(s):

Drop Test ◽

Lead Free ◽

Lead Free Solder ◽

Component Position ◽

Free Solder

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Drop Test Reliability Improvement of Lead-free Fine Pitch BGA Using Different Solder Ball Composition

2005 7th Electronic Packaging Technology Conference ◽

10.1109/eptc.2005.1614403 ◽

2006 ◽

Cited By ~ 28

Author(s):

C. Birzer ◽

B. Rakow ◽

R. Steiner ◽

J. Walter

Keyword(s):

Solder Ball ◽

Drop Test ◽

Test Reliability ◽

Lead Free ◽

Reliability Improvement ◽

Fine Pitch

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Microstructural evolution of a lead-free solder alloy Sn-Bi-Ag-Cu prepared by mechanical alloying during thermal shock and aging

Journal of Electronic Materials ◽

10.1007/s11664-000-0167-4 ◽

2000 ◽

Vol 29 (8) ◽

pp. 1021-1026 ◽

Cited By ~ 26

Author(s):

M. L. Huang ◽

C. M. L. Wu ◽

J. K. L. Lai ◽

Y. C. Chan

Keyword(s):

Mechanical Alloying ◽

Thermal Shock ◽

Solder Alloy ◽

Microstructural Evolution ◽

Lead Free ◽

Lead Free Solder ◽

Lead Free Solder Alloy ◽

Free Solder

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Drop Test Performance of Isotropic Electrically Conductive Adhesives

Journal of Adhesion Science and Technology ◽

10.1163/156856108x320546 ◽

2008 ◽

Vol 22 (14) ◽

pp. 1699-1716 ◽

Cited By ~ 4

Author(s):

James E. Morris ◽

Jeahuck Lee

Keyword(s):

Test Performance ◽

Drop Test ◽

Conductive Adhesives ◽

Electrically Conductive ◽

Electrically Conductive Adhesives

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Thermal Shock Reliability of Isothermally Aged Doped Lead-Free Solder With Semiparametric Estimation

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2019.2909052 ◽

2019 ◽

Vol 9 (6) ◽

pp. 1082-1093 ◽

Cited By ~ 8

Author(s):

Anto Raj ◽

Thomas Sanders ◽

Sharath Sridhar ◽

John L. Evans ◽

Michael J. Bozack ◽

...

Keyword(s):

Thermal Shock ◽

Semiparametric Estimation ◽

Lead Free ◽

Lead Free Solder ◽

Free Solder

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