A Study of Nano Particles in SnAg-Based Lead Free Solders for Intermetallic Compounds and Drop Test Performance

2006 ◽  
Author(s):  
M. Amagai
Keyword(s):  
Intermetallic Compounds ◽  
Test Performance ◽  
Drop Test ◽  
Nano Particles ◽  
Lead Free ◽  
Lead Free Solders

scholarly journals Investigation Of Intermetallic Compounds In Sn-Cu-Ni Lead-Free Solders

2015 ◽  
Vol 60 (2) ◽  
pp. 1511-1515 ◽  
Author(s):  
E. Nagy ◽  
F. Kristaly ◽  
A. Gyenes ◽  
Z. Gacsi
Keyword(s):  
Intermetallic Compounds ◽  
Diffraction Method ◽  
Lead Free ◽  
Structural Behaviour ◽  
Cu Content ◽  
Soldering Process ◽  
Cu Alloys ◽  
Complex Structural ◽  
Interfacial Intermetallic Compounds ◽  
Lead Free Solders

Abstract Interfacial intermetallic compounds (IMC) play an important role in Sn-Cu lead-free soldering. The size and morphology of the intermetallic compounds formed between the lead-free solder and the Cu substrate have a significant effect on the mechanical strength of the solder joint. In the soldering process of Sn-Cu alloys, Cu6Sn5 intermetallic compounds are formed. The complex structural behaviour of Cu6Sn5 IMC is temperature- and composition-dependent and it is long since subject to scientific research. The Cu6Sn5 phase basically exists in two crystal structures: hexagonal η-Cu6Sn5 (at temperatures above 186°C) and monoclinic η’-Cu6Sn5 (at lower temperatures). In the presence of Ni in the solder, the η-η’ transformation does not occur, therefore, the η-Cu6Sn5 phase remains stable. In this study the role of Ni in the (Cu,Ni)6Sn5 intermetallic compound in Sn-Cu lead-free solders was examined. Sn-Cu alloys with different Cu content (0.5 to 1 mass%) were modified through Ni addition. The morphology of the intermetallic compounds of the modified Sn-Cu alloys was investigated by optical microscopy (OM) and scanning electron microscopy (SEM), the IMC phases were examined with X-ray diffraction method (XRD).

scholarly journals Properties and Microstructures of Sn-Bi-X Lead-Free Solders

2016 ◽  
Vol 2016 ◽  
pp. 1-15 ◽  
Author(s):  
Fan Yang ◽  
Liang Zhang ◽  
Zhi-quan Liu ◽  
Su-juan Zhong ◽  
Jia Ma ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Rare Earth ◽  
Intermetallic Compounds ◽  
Melting Temperature ◽  
Fatigue Resistance ◽  
Low Cost ◽  
Eutectic Point ◽  
Lead Free ◽  
Melting Characteristic ◽  
Lead Free Solders

The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C) and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth) and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variation of wettability, melting characteristic, electromigration, mechanical properties, microstructures, intermetallic compounds reaction, and creep behaviors was analyzed systematically, which can provide a reference for investigation of Sn-Bi base solders.

Formation and Mechanical Properties of Intermetallic Compounds in Sn-Cu High-Temperature Lead-Free Solder Joints

2010 ◽  
Vol 654-656 ◽  
pp. 2450-2454 ◽  
Author(s):  
De Kui Mu ◽  
Hideaki Tsukamoto ◽  
Han Huang ◽  
Kazuhiro Nogita
Keyword(s):  
Mechanical Properties ◽  
High Temperature ◽  
Intermetallic Compounds ◽  
Solder Joints ◽  
Nickel Content ◽  
Lead Free ◽  
Lead Free Solder ◽  
Nickel Addition ◽  
Free Solder ◽  
Lead Free Solders

High-temperature lead-free solders are important materials for electrical and electronic devices due to increasing legislative requirements that aim at reducing the use of traditional lead-based solders. For the successful use of lead-free solders, a comprehensive understanding of the formation and mechanical properties of Intermetallic Compounds (IMCs) that form in the vicinity of the solder-substrate interface is essential. In this work, the effect of nickel addition on the formation and mechanical properties of Cu6Sn5 IMCs in Sn-Cu high-temperature lead-free solder joints was investigated using Scanning Electron Microscopy (SEM) and nanoindentation. It was found that the nickel addition increased the elastic modulus and hardness of the (Cu, Ni)6Sn5. The relationship between the nickel content and the mechanical properties of the IMCs was also established.

Sedimentation of Cu-rich intermetallics in liquid lead-free solders

2007 ◽  
Vol 22 (12) ◽  
pp. 3432-3439 ◽  
Author(s):  
Jenn-Ming Song ◽  
Yu-Lin Shen ◽  
Hsin-Yi Chuang
Keyword(s):  
Intermetallic Compounds ◽  
Critical Value ◽  
Experimental Results ◽  
Lead Free ◽  
Liquid Lead ◽  
Complete Dissolution ◽  
Cu Content ◽  
Lead Free Solders ◽  
Dissolution Potential

This study investigated the behavior of Cu-containing intermetallic compounds (IMCs) in liquid Sn–Ag and Sn–Zn solders. Experimental results show that for the intermetallics investigated, Cu–Sn and Cu–Zn compounds, the occurrence of settling was dominated by the crystalline temperature of IMCs, buoyancy due to difference in densities, and dissolution potential for the compounds into the liquid. The complete dissolution of Cu–Zn compounds, which took place in the Sn–Zn solders when the Cu content exceeded a critical value, might be ascribed to the depletion of Zn in the melt.

Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate

Rare Metals ◽  
2009 ◽  
Vol 28 (6) ◽  
pp. 656-660 ◽  
Author(s):  
Wenxue Chen ◽  
Songbai Xue ◽  
Hui Wang ◽  
Jianxin Wang ◽  
Zongjie Han
Keyword(s):  
Intermetallic Compounds ◽  
Lead Free ◽  
Cu Substrate ◽  
Lead Free Solders
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