High drop test reliability: lead-free solders

2004 ◽  
Author(s):  
M. Amagai ◽  
Y. Toyoda ◽  
T. Ohnishi ◽  
S. Akita
Keyword(s):  
Drop Test ◽  
Test Reliability ◽  
Lead Free ◽  
Lead Free Solders

scholarly journals Drop test reliability of lead-free chip scale packages

2008 ◽  
Author(s):  
Andrew Farris ◽  
Jianbiao Pan ◽  
Albert Liddicoat ◽  
Brian J. Toleno ◽  
Dan Maslyk ◽  
...  
Keyword(s):  
Drop Test ◽  
Test Reliability ◽  
Lead Free

Analysis Methods for Characterizing Drop Test Robustness of Lead-Free FBGAs

2005 ◽  
Author(s):  
J. Walter ◽  
R. Fischer ◽  
C. Birzer
Keyword(s):  
Crack Detection ◽  
Printed Circuit Boards ◽  
Ion Beam ◽  
Drop Test ◽  
Test Reliability ◽  
Lead Free ◽  
Detection Methods ◽  
Lead Free Solder ◽  
Analysis Methods ◽  
Free Solder

Abstract During the last few years the drop test has become more and more important for electronic handheld components. Drop test reliability for lead-free solder interconnects is an extreme challenge today. Thus, the need for improved micro structural diagnostics of new material combinations and crack detection methods has increased. The target of this paper is to summarize detection and analysis methods for solder joint cracks, material characterization [1] and preparation methods of assembled printed circuit boards (PCB) after a drop test to completely understand lead-free solder interconnect reliability in fine pitch ball grid array packages (FBGA). In particular, we will introduce the outstanding advantages of embedded cross-sections combined with ion beam polishing (IBP), dye- or rather resin-penetration, selective tin etch and micro-hardness measurements.

Effect of Solder Composition and Substrate Surface Finish on Board Level Drop Test Reliability

2005 ◽  
Author(s):  
Don-Son Jiang ◽  
Joe Hung ◽  
Yu-Po Wang ◽  
C. S. Hsiao
Keyword(s):  
Solder Joint ◽  
Substrate Surface ◽  
Drop Impact ◽  
Drop Test ◽  
Test Reliability ◽  
Lead Free ◽  
Lead Free Solder ◽  
Snagcu Solder ◽  
Free Solder ◽  
Board Level

For handheld or portable telecommunication devices such as mobile phone, PDA, etc., board level joint reliability during drop impact is a great concern to simulate mishandling during usage. In general, solder composition and substrate surface finish would principally determine the solder joint reliability. Board level drop test reliability of two solder compositions (SnPb and lead free SnAgCu) and surface finishes (Ni/Au and OSP) were examined in this study. The result indicated SnAgCu lead free solder showed poorer reliability life than Sn-Pb solder during drop impact. The crack path in SnPb solder joint almost went through bulk solder near substrate side. However, another IMC/Ni interfacial failure mode near substrate side was found in SnAgCu solder to cause lower reliability. This difference could attribute to higher strength of SnAgCu solder and deformation with higher strain rate in drop test. Comparison between two surface finishes indicated Ni/Au is better than OSP in both SnPb and SnAgCu lead free solder joints. In SnAgCu lead free solder joint with OSP, there are thicker Cu6Sn5 IMC and many large Ag3Sn IMC plates in interface to degrade the interfacial bonding, so drop impact would easily cause the all cracks through IMC/Cu interface and then reduce the reliability.

Lead-Free Chip Scale Packages: Assembly and Drop Test Reliability

2006 ◽  
Vol 29 (1) ◽  
pp. 1-9 ◽  
Author(s):  
Y. Liu ◽  
G. Tian ◽  
S. Gale ◽  
R.W. Johnson ◽  
L. Crane
Keyword(s):  
Drop Test ◽  
Test Reliability ◽  
Lead Free

Effect of aluminum content on structure, transport and mechanical properties of Sn-Zn eutectic lead free solder alloy rapidly solidified from melt.

2015 ◽  
Vol 10 (1) ◽  
pp. 2641-2648
Author(s):  
Rizk Mostafa Shalaby ◽  
Mohamed Munther ◽  
Abu-Bakr Al-Bidawi ◽  
Mustafa Kamal
Keyword(s):  
Mechanical Properties ◽  
Melting Point ◽  
Lead Free ◽  
Al Alloy ◽  
Lead Free Solder ◽  
Pronounced Increase ◽  
Mass Unit ◽  
Size Refinement ◽  
Free Solder ◽  
Lead Free Solders

The greatest advantage of Sn-Zn eutectic is its low melting point (198 oC) which is close to the melting point. of Sn-Pb eutectic solder (183 oC), as well as its low price per mass unit compared with Sn-Ag and Sn-Ag-Cu solders. In this paper, the effect of 0.0, 1.0, 2.0, 3.0, 4.0, and 5.0 wt. % Al as ternary additions on melting temperature, microstructure, microhardness and mechanical properties of the Sn-9Zn lead-free solders were investigated. It is shown that the alloying additions of Al at 4 wt. % to the Sn-Zn binary system lead to lower of the melting point to 195.72 ˚C.  From x-ray diffraction analysis, an aluminium phase, designated α-Al is detected for 4 and 5 wt. % Al compositions. The formation of an aluminium phase causes a pronounced increase in the electrical resistivity and microhardness. The ternary Sn-9Zn-2 wt.%Al exhibits micro hardness superior to Sn-9Zn binary alloy. The better Vickers hardness and melting points of the ternary alloy is attributed to solid solution effect, grain size refinement and precipitation of Al and Zn in the Sn matrix.  The Sn-9%Zn-4%Al alloy is a lead-free solder designed for possible drop-in replacement of Pb-Sn solders.  

Shear Strength and Dsc Analysis of High-Temperature Solders

2013 ◽  
Vol 58 (2) ◽  
pp. 529-533 ◽  
Author(s):  
R. Koleňák ◽  
M. Martinkovič ◽  
M. Koleňáková
Keyword(s):  
Shear Strength ◽  
High Temperature ◽  
Lead Free ◽  
Dsc Analysis ◽  
Ultrasonic Activation ◽  
Metallic Substrates ◽  
Cu Substrate ◽  
Lead Free Solders

The work is devoted to the study of shear strength of soldered joints fabricated by use of high-temperature solders of types Bi-11Ag, Au-20Sn, Sn-5Sb, Zn-4Al, Pb-5Sn, and Pb-10Sn. The shear strength was determined on metallic substrates made of Cu, Ni, and Ag. The strength of joints fabricated by use of flux and that of joints fabricated by use of ultrasonic activation without flux was compared. The obtained results have shown that in case of soldering by use of ultrasound (UT), higher shear strength of soldered joints was achieved with most solders. The highest shear strength by use of UT was achieved with an Au-20Sn joint fabricated on copper, namely up to 195 MPa. The lowest average values were achieved with Pb-based solders (Pb-5Sn and Pb-10Sn). The shear strength values of these solders used on Cu substrate varied from 24 to 27 MPa. DSC analysis was performed to determine the melting interval of lead-free solders.

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