Drop test reliability assessment of leaded & lead-free solder joints for IC packages

2005 ◽  
Author(s):  
D.Y.R. Chong ◽  
K. Ng ◽  
J.Y.N. Tan ◽  
P.T.H. Low ◽  
J.H.L. Pang ◽  
...  
Keyword(s):  
Solder Joints ◽  
Reliability Assessment ◽  
Drop Test ◽  
Test Reliability ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Analysis Methods for Characterizing Drop Test Robustness of Lead-Free FBGAs

2005 ◽  
Author(s):  
J. Walter ◽  
R. Fischer ◽  
C. Birzer
Keyword(s):  
Crack Detection ◽  
Printed Circuit Boards ◽  
Ion Beam ◽  
Drop Test ◽  
Test Reliability ◽  
Lead Free ◽  
Detection Methods ◽  
Lead Free Solder ◽  
Analysis Methods ◽  
Free Solder

Abstract During the last few years the drop test has become more and more important for electronic handheld components. Drop test reliability for lead-free solder interconnects is an extreme challenge today. Thus, the need for improved micro structural diagnostics of new material combinations and crack detection methods has increased. The target of this paper is to summarize detection and analysis methods for solder joint cracks, material characterization [1] and preparation methods of assembled printed circuit boards (PCB) after a drop test to completely understand lead-free solder interconnect reliability in fine pitch ball grid array packages (FBGA). In particular, we will introduce the outstanding advantages of embedded cross-sections combined with ion beam polishing (IBP), dye- or rather resin-penetration, selective tin etch and micro-hardness measurements.

Effect of Solder Composition and Substrate Surface Finish on Board Level Drop Test Reliability

2005 ◽  
Author(s):  
Don-Son Jiang ◽  
Joe Hung ◽  
Yu-Po Wang ◽  
C. S. Hsiao
Keyword(s):  
Solder Joint ◽  
Substrate Surface ◽  
Drop Impact ◽  
Drop Test ◽  
Test Reliability ◽  
Lead Free ◽  
Lead Free Solder ◽  
Snagcu Solder ◽  
Free Solder ◽  
Board Level

For handheld or portable telecommunication devices such as mobile phone, PDA, etc., board level joint reliability during drop impact is a great concern to simulate mishandling during usage. In general, solder composition and substrate surface finish would principally determine the solder joint reliability. Board level drop test reliability of two solder compositions (SnPb and lead free SnAgCu) and surface finishes (Ni/Au and OSP) were examined in this study. The result indicated SnAgCu lead free solder showed poorer reliability life than Sn-Pb solder during drop impact. The crack path in SnPb solder joint almost went through bulk solder near substrate side. However, another IMC/Ni interfacial failure mode near substrate side was found in SnAgCu solder to cause lower reliability. This difference could attribute to higher strength of SnAgCu solder and deformation with higher strain rate in drop test. Comparison between two surface finishes indicated Ni/Au is better than OSP in both SnPb and SnAgCu lead free solder joints. In SnAgCu lead free solder joint with OSP, there are thicker Cu6Sn5 IMC and many large Ag3Sn IMC plates in interface to degrade the interfacial bonding, so drop impact would easily cause the all cracks through IMC/Cu interface and then reduce the reliability.

Void Formation and Their Effect on Reliability of Lead-Free Solder Joints on MID and PCB Substrates

2017 ◽  
Vol 66 (4) ◽  
pp. 1229-1237 ◽  
Author(s):  
P. Wild ◽  
T. Grozinger ◽  
D. Lorenz ◽  
A. Zimmermann
Keyword(s):  
Solder Joints ◽  
Void Formation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Quantitative Evaluation of Voids in Lead Free Solder Joints

2015 ◽  
Vol 772 ◽  
pp. 284-289 ◽  
Author(s):  
Sabuj Mallik ◽  
Jude Njoku ◽  
Gabriel Takyi
Keyword(s):  
Solder Bump ◽  
Solder Joints ◽  
Void Formation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
X Ray ◽  
Size And Shape ◽  
Solder Bumps ◽  
Free Solder

Voiding in solder joints poses a serious reliability concern for electronic products. The aim of this research was to quantify the void formation in lead-free solder joints through X-ray inspections. Experiments were designed to investigate how void formation is affected by solder bump size and shape, differences in reflow time and temperature, and differences in solder paste formulation. Four different lead-free solder paste samples were used to produce solder bumps on a number of test boards, using surface mount reflow soldering process. Using an advanced X-ray inspection system void percentages were measured for three different size and shape solder bumps. Results indicate that the voiding in solder joint is strongly influenced by solder bump size and shape, with voids found to have increased when bump size decreased. A longer soaking period during reflow stage has negatively affectedsolder voids. Voiding was also accelerated with smaller solder particles in solder paste.

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