Electrical characterization of ball grid array packages from S-parameter measurements below 500 MHz

1999 ◽  
Vol 22 (3) ◽  
pp. 343-347 ◽  
Author(s):  
Jaeyong Jeong ◽  
Seungki Nam ◽  
Y.S. Shin ◽  
Y.S. Kim ◽  
Jichai Jeong
Keyword(s):  
Electrical Characterization ◽  
Ball Grid Array ◽  
S Parameter ◽  
Ball Grid Array Packages

Electrical modeling of ball grid array packages based on one-port S-parameter measurement for electrical evaluation of high-speed test board

2005 ◽  
Vol 5 (3) ◽  
pp. 271-276
Author(s):  
Seungki Nam ◽  
Jaehoon Lee ◽  
Yonggyoo Kim ◽  
Kyun-Hyun Tchah ◽  
Jaeyong Jeong ◽  
...  
Keyword(s):  
High Speed ◽  
Ball Grid Array ◽  
Parameter Measurement ◽  
Electrical Modeling ◽  
Speed Test ◽  
S Parameter ◽  
Test Board ◽  
Ball Grid Array Packages

Thermal and Physical Characterization and Curing Kinetics Study of a Novel Curable Fillet Forming Ball Attach Flux for Improvement of Solder Joint Reliability on Ball Grid Array Packages

2003 ◽  
Author(s):  
Dennis Prem Kumar Chandran ◽  
Yi He ◽  
Eng Chiang Gan
Keyword(s):  
Thermal Properties ◽  
Solder Joint ◽  
Physical Properties ◽  
Ball Grid Array ◽  
Curing Kinetics ◽  
Kinetics Study ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Ball Grid Array Packages

This paper concentrates on the characterization of a novel curable fillet forming ball attach flux. This polymer based material is expected to improve 2nd level interconnet solder joint reliability on ball grid array packages. The evaluations reported in this paper consist of the characterization of their physical and thermal properties. With the understanding of the materials physical properties, the failing mechanism, and material robustness can be predicted.

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