Thermal and Physical Characterization and Curing Kinetics Study of a Novel Curable Fillet Forming Ball Attach Flux for Improvement of Solder Joint Reliability on Ball Grid Array Packages

2003 ◽  
Author(s):  
Dennis Prem Kumar Chandran ◽  
Yi He ◽  
Eng Chiang Gan
Keyword(s):  
Thermal Properties ◽  
Solder Joint ◽  
Physical Properties ◽  
Ball Grid Array ◽  
Curing Kinetics ◽  
Kinetics Study ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Ball Grid Array Packages

This paper concentrates on the characterization of a novel curable fillet forming ball attach flux. This polymer based material is expected to improve 2nd level interconnet solder joint reliability on ball grid array packages. The evaluations reported in this paper consist of the characterization of their physical and thermal properties. With the understanding of the materials physical properties, the failing mechanism, and material robustness can be predicted.

Characterization of Solder Joint Reliability Using Cyclic Mechanical Fatigue Testing

JOM ◽  
2013 ◽  
Vol 65 (10) ◽  
pp. 1362-1373 ◽  
Author(s):  
Choong-Un Kim ◽  
Woong-Ho Bang ◽  
Huili Xu ◽  
Tae-Kyu Lee
Keyword(s):  
Solder Joint ◽  
Fatigue Testing ◽  
Solder Joint Reliability ◽  
Mechanical Fatigue ◽  
Joint Reliability

Reliability of Underfilled Chip Scale Packages Attached With Heat Sink

2005 ◽  
Author(s):  
Saketh Mahalingam ◽  
Ashutosh Joshi ◽  
Joseph Lacey ◽  
Kunal Goray
Keyword(s):  
Solder Joint ◽  
Heat Sink ◽  
Operating Temperature ◽  
Ball Grid Array ◽  
Solder Joint Reliability ◽  
Proper Understanding ◽  
Joint Reliability ◽  
Board Level ◽  
Inelastic Strains ◽  
Underfill Material

Chip Scale Packages (CSP) are ideal intermediates between Direct Chip Attach (DCA) and Ball Grid Array (BGA) technologies in terms of both size and cost. Depending upon the application, chip scale packages are either underfilled for better solder joint reliability or are attached with a heat sink to keep the operating temperature of the chip under control. In many applications, as discussed in this paper, both an underfill and a heat sink are required. Quite expectedly the addition of two more materials, heat sink and adhesive, in the board level assembly results in fresh reliability concerns. In particular, the requirements on the underfill material and the heat sink attach adhesive are more rigorous and needless to say, a proper understanding of process and material issues is needed to make such a choice. The inelastic strains experienced by the solder joint (related to the underfill) and the peeling stresses at the heat sink attach adhesive interfaces (related to the thermal adhesive) are used as metric for comparing the number of material choices that are available. Based on the results, it is shown that it is important to choose materials that are thermo-mechanically matched with the rest of the system.

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