IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)
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0780355970

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Simultaneous switching, noise, and reliability analyses of VLSI core logic

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) ◽

10.1109/epep.1999.819213 ◽

2003 ◽

Author(s):

I.N. Hajj

Keyword(s):

Switching Noise ◽

Simultaneous Switching Noise ◽

Simultaneous Switching

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Validation of integrated capacitor-via-planes model

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) ◽

10.1109/epep.1999.819207 ◽

2003 ◽

Author(s):

Yuan-Liang Li ◽

D.G. Figueroa ◽

Teong Guan Yew ◽

Chee Yee Chung

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Modeling the effects of non-linear materials in de-coupling components of digital systems

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) ◽

10.1109/epep.1999.819202 ◽

2003 ◽

Cited By ~ 3

Author(s):

G. Cokkinides ◽

B. Beker

Keyword(s):

Digital Systems ◽

Non Linear ◽

Coupling Components

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Electronic packaging for microwave multichip modules

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) ◽

10.1109/epep.1999.819181 ◽

2003 ◽

Author(s):

A.J. Piloto

Keyword(s):

Electronic Packaging ◽

Multichip Modules

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Characteristic impedance of microstrip on silicon

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) ◽

10.1109/epep.1999.819221 ◽

2003 ◽

Cited By ~ 7

Author(s):

D.F. Williams ◽

B.K. Alpert

Keyword(s):

Characteristic Impedance

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Study of meander line delay in circuit boards

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) ◽

10.1109/epep.1999.819224 ◽

2003 ◽

Cited By ~ 4

Author(s):

B.J. Rubin ◽

B. Singh

Keyword(s):

Circuit Boards ◽

Meander Line

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Noise measurements on Power4 Test chip

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) ◽

10.1109/epep.1999.819186 ◽

2003 ◽

Author(s):

A. Haridass ◽

N. James ◽

B. McCredie

Keyword(s):

Test Chip ◽

Noise Measurements

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On-chip wiring design challenges for GHz operation

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) ◽

10.1109/epep.1999.819190 ◽

2003 ◽

Cited By ~ 3

Author(s):

A. Deutsch ◽

H. Smith ◽

G.V. Kopcsay ◽

D.C. Edelstein ◽

P.W. Coteus

Keyword(s):

On Chip ◽

Design Challenges

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Precise chip and package 3D capacitance simulations of realistic interconnects using a general purpose FEM-tool

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) ◽

10.1109/epep.1999.819205 ◽

2003 ◽

Cited By ~ 1

Author(s):

A. Hieke

Keyword(s):

General Purpose

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Methods to reduce radiation from split ground plane structures [packaging]

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) ◽

10.1109/epep.1999.819226 ◽

2003 ◽

Cited By ~ 13

Author(s):

T.E. Moran ◽

K.L. Virga ◽

G. Aguirre ◽

J.L. Prince

Keyword(s):

Ground Plane

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IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Simultaneous switching, noise, and reliability analyses of VLSI core logic

Validation of integrated capacitor-via-planes model

Modeling the effects of non-linear materials in de-coupling components of digital systems

Electronic packaging for microwave multichip modules

Characteristic impedance of microstrip on silicon

Study of meander line delay in circuit boards

Noise measurements on Power4 Test chip

On-chip wiring design challenges for GHz operation

Precise chip and package 3D capacitance simulations of realistic interconnects using a general purpose FEM-tool

Methods to reduce radiation from split ground plane structures [packaging]

IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)
Latest Publications