1995 Proceedings. 45th Electronic Components and Technology Conference
Latest Publications

TOTAL DOCUMENTS

202

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

0780327365

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Design and fabrication of low noise high diffraction efficiency diffractive optical elements

1995 Proceedings. 45th Electronic Components and Technology Conference ◽

10.1109/ectc.1995.517857 ◽

2002 ◽

Author(s):

W. Daschner ◽

M. Larsson ◽

S.H. Lee

Keyword(s):

Diffraction Efficiency ◽

Low Noise ◽

Diffractive Optical Elements ◽

Optical Elements ◽

High Diffraction Efficiency ◽

High Diffraction

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Development, validation and application of a thermal model of a plastic quad flat pack

1995 Proceedings. 45th Electronic Components and Technology Conference ◽

10.1109/ectc.1995.517835 ◽

2002 ◽

Cited By ~ 30

Author(s):

H.I. Rosten ◽

J.D. Parry ◽

J.S. Addison ◽

R. Viswanath ◽

M. Davies ◽

...

Keyword(s):

Thermal Model

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Hermeticity lifetime of a 63Sn37Pb solder sealed optical fiber feedthrough

1995 Proceedings. 45th Electronic Components and Technology Conference ◽

10.1109/ectc.1995.517831 ◽

2002 ◽

Cited By ~ 3

Author(s):

M. Rassaian ◽

M.W. Beranek ◽

M. Voitek

Keyword(s):

Optical Fiber

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An investigation of conductive polymer flip chip attachment in multichip module applications

1995 Proceedings. 45th Electronic Components and Technology Conference ◽

10.1109/ectc.1995.517850 ◽

2002 ◽

Cited By ~ 5

Author(s):

C. Howard ◽

S. Nair ◽

S. Ang ◽

L. Schaper

Keyword(s):

Flip Chip ◽

Conductive Polymer ◽

Multichip Module ◽

Chip Attachment

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Skew-free parallel optical links and their array technology

1995 Proceedings. 45th Electronic Components and Technology Conference ◽

10.1109/ectc.1995.515338 ◽

2002 ◽

Cited By ~ 4

Author(s):

M. Yano ◽

G. Nakagawa ◽

N. Fujimoto

Keyword(s):

Optical Links ◽

Array Technology

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Packaging technology for wide bandwidth, high optical coupling pigtailed optoelectronic modules

1995 Proceedings. 45th Electronic Components and Technology Conference ◽

10.1109/ectc.1995.517774 ◽

2002 ◽

Author(s):

N. Kalonji ◽

J. Semo ◽

J. Tannion ◽

M. Foucher

Keyword(s):

Optical Coupling ◽

Wide Bandwidth ◽

Packaging Technology

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Reliability testing of solder joints in surface mounted assembly using real-time holographic interferometry

1995 Proceedings. 45th Electronic Components and Technology Conference ◽

10.1109/ectc.1995.517784 ◽

2002 ◽

Cited By ~ 1

Author(s):

W.N. Wang ◽

K.M. Leung

Keyword(s):

Real Time ◽

Holographic Interferometry ◽

Solder Joints ◽

Reliability Testing

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Polyimide stress cushion for multichip glass-ceramic module packaging

1995 Proceedings. 45th Electronic Components and Technology Conference ◽

10.1109/ectc.1995.517768 ◽

2002 ◽

Cited By ~ 3

Author(s):

D.-Y. Shih ◽

P. Palmateer ◽

Y. Fu ◽

S. Kapur ◽

B. Ghosal ◽

...

Keyword(s):

Glass Ceramic

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The evolution of easily installed fiber optic connectors

1995 Proceedings. 45th Electronic Components and Technology Conference ◽

10.1109/ectc.1995.514381 ◽

2002 ◽

Author(s):

N. Lee ◽

G. Henson ◽

J. Paparella

Keyword(s):

Fiber Optic

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Optical coupling and alignment tolerances in optoelectronic array interface assemblies

1995 Proceedings. 45th Electronic Components and Technology Conference ◽

10.1109/ectc.1995.515341 ◽

2002 ◽

Cited By ~ 2

Author(s):

J. Sutherland ◽

G. George ◽

J.P. Krusius

Keyword(s):

Optical Coupling

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1995 Proceedings. 45th Electronic Components and Technology ConferenceLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Design and fabrication of low noise high diffraction efficiency diffractive optical elements

Development, validation and application of a thermal model of a plastic quad flat pack

Hermeticity lifetime of a 63Sn37Pb solder sealed optical fiber feedthrough

An investigation of conductive polymer flip chip attachment in multichip module applications

Skew-free parallel optical links and their array technology

Packaging technology for wide bandwidth, high optical coupling pigtailed optoelectronic modules

Reliability testing of solder joints in surface mounted assembly using real-time holographic interferometry

Polyimide stress cushion for multichip glass-ceramic module packaging

The evolution of easily installed fiber optic connectors

Optical coupling and alignment tolerances in optoelectronic array interface assemblies

1995 Proceedings. 45th Electronic Components and Technology Conference
Latest Publications