A shallow trench isolation using nitric oxide (NO)-annealed wall oxide to suppress inverse narrow width effect

2000 ◽  
Vol 21 (12) ◽  
pp. 575-577 ◽  
Author(s):  
Jongoh Kim ◽  
Taewoo Kim ◽  
Jaebeom Park ◽  
Woojin Kim ◽  
Byungseop Hong ◽  
...  
2002 ◽  
Vol 23 (11) ◽  
pp. 676-676 ◽  
Author(s):  
Youngmin Kim ◽  
S. Sridhar ◽  
A. Chatterjee

2019 ◽  
Vol 8 (1) ◽  
pp. 71-75 ◽  
Author(s):  
Jae Yong Seo ◽  
Jeong-Eun Seok ◽  
Hyun-Jung Kim ◽  
Sang-keun Lee ◽  
Jae-Eun Jeon ◽  
...  

2002 ◽  
Vol 23 (10) ◽  
pp. 600-602 ◽  
Author(s):  
Youngmin Kim ◽  
S. Sridhar ◽  
A. Chatterjee

1998 ◽  
Author(s):  
I. De Wolf ◽  
G. Groeseneken ◽  
H.E. Maes ◽  
M. Bolt ◽  
K. Barla ◽  
...  

Abstract It is shown, using micro-Raman spectroscopy, that Shallow Trench Isolation introduces high stresses in the active area of silicon devices when wet oxidation steps are used. These stresses result in defect formation in the active area, leading to high diode leakage currents. The stress levels are highest near the outer edges of line structures and at square structures. They also increase with decreasing active area dimensions.


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