2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference
Latest Publications

TOTAL DOCUMENTS

202

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781424443413

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Nonlinear study of large deflection of simply supported piezoelectric layered-plate under initial tension

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference ◽

10.1109/impact.2009.5382208 ◽

2009 ◽

Author(s):

Chun-Fu Chen ◽

John-Han Chen

Keyword(s):

Large Deflection ◽

Layered Plate ◽

Initial Tension ◽

Simply Supported

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Session 21: Advanced cooling technology II

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference ◽

10.1109/impact.2009.5382248 ◽

2009 ◽

Keyword(s):

Cooling Technology

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Session 6: 3D interconnection

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference ◽

10.1109/impact.2009.5382150 ◽

2009 ◽

Cited By ~ 1

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A novel resin composition for low Dk copper clad laminate

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference ◽

10.1109/impact.2009.5382128 ◽

2009 ◽

Author(s):

June-Che Lu ◽

Yeong-Tong Hwang

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MEMS packaging IP and market status

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference ◽

10.1109/impact.2009.5382176 ◽

2009 ◽

Author(s):

C.E. Bauer ◽

R. A. Fillion ◽

H. J. Neuhaus ◽

Marc Papageorge

Keyword(s):

Mems Packaging ◽

Market Status

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Analysis of promising copper wire bonding in assembly consideration

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference ◽

10.1109/impact.2009.5382168 ◽

2009 ◽

Cited By ~ 1

Author(s):

Mu-Chun Wang ◽

Zhen-Ying Hsieh ◽

Kuo-Shu Huang ◽

Chuan-Hsi Liu ◽

Chii-Ruey Lin

Keyword(s):

Copper Wire ◽

Wire Bonding ◽

Copper Wire Bonding

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Flexible printed circuit (FPC) board for mobile antennas operation

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference ◽

10.1109/impact.2009.5382171 ◽

2009 ◽

Author(s):

Kuo-Liang Wu ◽

Guan-Yu Chen ◽

Jwo-Shiun Sun

Keyword(s):

Printed Circuit ◽

Mobile Antennas ◽

Flexible Printed Circuit

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The evaluation of assembly process for package on package components

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference ◽

10.1109/impact.2009.5382226 ◽

2009 ◽

Cited By ~ 1

Author(s):

K. C. Li ◽

J.L. Ku ◽

Andrew Lee ◽

Jay CY Huang

Keyword(s):

Assembly Process

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Thermal Performance of a Vapor Chamber Heat Pipe with Diamond-Copper Composition Wick Structures

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference ◽

10.1109/impact.2009.5382186 ◽

2009 ◽

Cited By ~ 1

Author(s):

Ying-Tung Chen ◽

Jr-Ming Miao ◽

Dau-Yuan Ning ◽

Te-Feng Chu ◽

Wei-En Chen

Keyword(s):

Heat Pipe ◽

Thermal Performance ◽

Vapor Chamber

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Time dependent deformation behavior of interfacial intermetallic compounds in electronic solder joints

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference ◽

10.1109/impact.2009.5382227 ◽

2009 ◽

Author(s):

Jenn-Ming Song ◽

Chien-Wei Su ◽

Yi-Shao Lai ◽

Ying-Ta Chiu

Keyword(s):

Intermetallic Compounds ◽

Deformation Behavior ◽

Solder Joints ◽

Time Dependent ◽

Interfacial Intermetallic Compounds

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2009 4th International Microsystems, Packaging, Assembly and Circuits Technology ConferenceLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Nonlinear study of large deflection of simply supported piezoelectric layered-plate under initial tension

Session 21: Advanced cooling technology II

Session 6: 3D interconnection

A novel resin composition for low Dk copper clad laminate

MEMS packaging IP and market status

Analysis of promising copper wire bonding in assembly consideration

Flexible printed circuit (FPC) board for mobile antennas operation

The evaluation of assembly process for package on package components

Thermal Performance of a Vapor Chamber Heat Pipe with Diamond-Copper Composition Wick Structures

Time dependent deformation behavior of interfacial intermetallic compounds in electronic solder joints

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference
Latest Publications