Residual stress behavior of thin plasma-enhanced chemical vapor deposited silicon dioxide films as a function of storage time

1997 ◽  
Vol 81 (7) ◽  
pp. 3129-3133 ◽  
Author(s):  
M. S. Haque ◽  
H. A. Naseem ◽  
W. D. Brown
Keyword(s):  
Residual Stress ◽  
Silicon Dioxide ◽  
Storage Time ◽  
Chemical Vapor ◽  
Stress Behavior ◽  
Silicon Dioxide Films ◽  
Chemical Vapor Deposited ◽  
Thin Plasma

Improving stress stability in low-pressure chemical vapor deposited silicon dioxide films by ion implantation

2016 ◽  
Vol 598 ◽  
pp. 103-108 ◽  
Author(s):  
Haiping Shang ◽  
Jianyu Fu ◽  
Changqing Xie ◽  
Zhigang Li ◽  
Dapeng Chen
Keyword(s):  
Ion Implantation ◽  
Silicon Dioxide ◽  
Chemical Vapor ◽  
Low Pressure ◽  
Silicon Dioxide Films ◽  
Chemical Vapor Deposited ◽  
Pressure Chemical
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