High-resolution direct-write multiphoton photolithography in poly(methylmethacrylate) films

2006 ◽  
Vol 88 (18) ◽  
pp. 184101 ◽  
Author(s):  
Daniel A. Higgins ◽  
Thomas A. Everett ◽  
Aifang Xie ◽  
Sarah M. Forman ◽  
Takashi Ito
Keyword(s):  
High Resolution ◽  
Direct Write

Aerosol Printing of High Resolution Films for LTCC-Multilayer Components

2012 ◽  
Vol 9 (3) ◽  
pp. 133-137 ◽  
Author(s):  
Martin Ihle ◽  
Uwe Partsch ◽  
Sindy Mosch ◽  
Adrian Goldberg
Keyword(s):  
High Resolution ◽  
High Frequency ◽  
High Reliability ◽  
Direct Write ◽  
Printing Technology ◽  
Fine Line ◽  
Aerosol Printing ◽  
Fine Structures ◽  
Cost Efficient ◽  
Printing Parameters

For the electronic packaging of sensor stable and cost-efficient fine line printing technologies on LTCC and high frequency laminates are needed. Especially common technologies like screen printing and thin film techniques are unsuitable for fine structures or too expensive. In addition, there is no direct write technology for 3D LTCC designs as well as for high reliability cofiring structures. Closing this gap, aerosol printing technology is used to print high resolution conductors on planar and nonplanar substrates. Aerosol printing is a direct write noncontact printing technology of functional layers. After pneumatic atomization, the ink is transformed into 1–5 μm droplets. The resulting continuous aerosol stream is focused by a sheath gas in the printing head. Thus, the long standoff distance between the substrate and the deposition tip of max. 5 mm allows 3D printing on nonplanar substrates. With optimized inks and printing parameters, line widths of 10 μm are achievable. This paper will present applications for aerosol printed functional layers on LTCC. These are, for example, aerosol printed films embedded in cofired LTCC, fine line structures for high frequency applications, and the evaluation of printed 3D structures like LTCC stairways. Furthermore, the 90° contact of unconventional sensor designs will be presented.

High Resolution 3-D Laser Direct-Write Patterning

2010 ◽  
Author(s):  
Linjie Li ◽  
Rafael R. Gattass ◽  
Michael Stocker ◽  
Erez Gershgoren ◽  
Hana Hwang ◽  
...  
Keyword(s):  
High Resolution ◽  
Direct Write ◽  
Laser Direct Write

High resolution variable-shaped beam direct write

2007 ◽  
Vol 84 (5-8) ◽  
pp. 774-778 ◽  
Author(s):  
Peter Hahmann ◽  
Lutz Bettin ◽  
Monika Boettcher ◽  
Ulrich Denker ◽  
Thomas Elster ◽  
...  
Keyword(s):  
High Resolution ◽  
Direct Write ◽  
Shaped Beam

Aerosol Printing of High Resolution Films for LTCC-Multilayer Components

2012 ◽  
Vol 2012 (CICMT) ◽  
pp. 000071-000076 ◽  
Author(s):  
Martin Ihle ◽  
Uwe Partsch ◽  
Sindy Mosch ◽  
Adrian Goldberg
Keyword(s):  
High Resolution ◽  
High Frequency ◽  
High Reliability ◽  
Direct Write ◽  
Contact Printing ◽  
Printing Technology ◽  
Fine Line ◽  
Aerosol Printing ◽  
Cost Efficient ◽  
Planar Substrates

For the electronic packaging of sensor stable and cost-efficient fine-line printing technologies on LTCC and high frequency laminates are needed. Especially common technologies like screen printing and thin film techniques are unsuitable for fine structures or too expensive. In addition there is no direct write technology for 3D-LTCC-designs as well as for high reliability Co-firing structures. Closing this gap the aerosol printing technology is used to print high resolution conductors on planar and non-planar substrates. Aerosol printing is a direct write non-contact printing technology of functional layers. After a pneumatic atomization the ink is transformed into 1 to 5 μm droplets. The resulting, continuous aerosol stream is focused by a sheath gas in the printing head. Thus the long standoff distance between substrate and deposition tip of max. 5 mm allows the 3D-printing on non-planar substrates. With optimized inks and printing parameters line widths of 10 μm are achievable. This paper will present applications for aerosol printed functional layers on LTCC. These are, for example, aerosol printed films embedded in co-fired LTCC, fine line structures for high frequency applications and the evaluation of printed 3D-structures like LTCC-stairways. Furthermore the 90 degree contacting of unconventional sensor designs will be presented.

High-resolution direct-write patterning using focused ion beams

MRS Bulletin ◽  
2014 ◽  
Vol 39 (4) ◽  
pp. 336-341 ◽  
Author(s):  
Leonidas E. Ocola ◽  
Chad Rue ◽  
Diederik Maas
Keyword(s):  
High Resolution ◽  
Ion Beams ◽  
Focused Ion Beams ◽  
Direct Write ◽  
Image Position

Abstract

Dose Measurements on Micro- and Submicrometer Implanted Structures using Thermal-Waves

1985 ◽  
Vol 45 ◽  
Author(s):  
W. Lee Smith ◽  
Robert H. Reuss ◽  
William Clark ◽  
David Rensch
Keyword(s):  
High Resolution ◽  
Thermal Wave ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Measurement Techniques ◽  
Direct Write ◽  
Patterned Wafers ◽  
Wave Measurements ◽  
Dose Measurements ◽  
Focused Beams

ABSTRACTThermal-wave measurement techniques have recently been developed for measuring ion implant dose over the range 1E10 to 1E16 ions/cm2. The spatial resolution obtained with this method is 1 µm, an improvement of approximately 3000X over that of other dose monitors. This resolution capability together with the fact that the thermal-wave measurements are noncontact and nondestructive, permit dose measurements to be made on implanted areas (device features) on patterned wafers, as well as on test wafers.A new potential application of the thermal-wave technique is the measurement of dose implanted by focused ion beam (FIB). Since the FIB technique is a high-resolution, direct-write process and since current FIB systems are limited to scan fields of less than 0.5 mm2, a high-resolution probe to monitor dose and uniformity is necessary.In this paper, we report the measurement of ion dose implanted by focused beams into areas of ‹10−2 mm2. Even single FIB-implanted lines of 0.20 µm width have been detected, and programmed lateral dose variations measured. Experimental results demonstrating the potential of this technique are presented.

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