Application of real time spectroscopic ellipsometry for high resolution depth profiling of compositionally graded amorphous silicon alloy thin films

1997 ◽  
Vol 70 (16) ◽  
pp. 2150-2152 ◽  
Author(s):  
H. Fujiwara ◽  
Joohyun Koh ◽  
C. R. Wronski ◽  
R. W. Collins
Keyword(s):  
Thin Films ◽  
High Resolution ◽  
Amorphous Silicon ◽  
Real Time ◽  
Spectroscopic Ellipsometry ◽  
Depth Profiling ◽  
Silicon Alloy

Formation of Large, Orientation-Controlled, Nearly Single Crystalline Si Thin Films on SiO2 Using Contact Printing of Rolled and Annealed Nickel Tapes

2003 ◽  
Vol 762 ◽  
Author(s):  
Hwang Huh ◽  
Jung H. Shin
Keyword(s):  
Electron Microscopy ◽  
Thin Films ◽  
High Resolution ◽  
Amorphous Silicon ◽  
Tem Analysis ◽  
Contact Printing ◽  
Single Crystalline ◽  
High Resolution Tem ◽  
Lateral Crystallization ◽  
Si Films

AbstractAmorphous silicon (a-Si) films prepared on oxidized silicon wafer were crystallized to a highly textured form using contact printing of rolled and annealed nickel tapes. Crystallization was achieved by first annealing the a-Si film in contact with patterned Ni tape at 600°C for 20 min in a flowing forming gas (90 % N2, 10 % H2) environment, then removing the Ni tape and further annealing the a-Si film in vacuum for2hrsat600°C. An array of crystalline regions with diameters of up to 20 μm could be formed. Electron microscopy indicates that the regions are essentially single-crystalline except for the presence of twins and/or type A-B formations, and that all regions have the same orientation in all 3 directions even when separated by more than hundreds of microns. High resolution TEM analysis shows that formation of such orientation-controlled, nearly single crystalline regions is due to formation of nearly single crystalline NiSi2 under the point of contact, which then acts as the template for silicide-induced lateral crystallization. Furthermore, the orientation relationship between Si grains and Ni tape is observed to be Si (110) || Ni (001)

Real Time Spectroscopic Ellipsometry Studies of the Solid Phase Crystallization of Amorphous Silicon

1998 ◽  
Vol 507 ◽  
Author(s):  
H. Fujiwara ◽  
Joohyun Koh ◽  
Yeeheng Lee ◽  
C. R. Wronski ◽  
R. W. Collins
Keyword(s):  
Amorphous Silicon ◽  
Real Time ◽  
Spectroscopic Ellipsometry ◽  
Volume Fraction ◽  
Solid Phase ◽  
Thin Layers ◽  
Crystallization Time ◽  
Calibration Data ◽  
Solid Phase Crystallization ◽  
Near Surface

ABSTRACTWe have introduced real time spectroscopic ellipsometry (RTSE) for characterization of the solid phase crystallization (SPC) of intrinsic and n-type amorphous silicon (a-Si:H) thin films. RTSE has several advantages in the study and design of SPC processes for thin film transistor and solar cell fabrication. These include the capability of obtaining (i) calibration data that yield the near surface temperature of the film during processing, (ii) the volume fraction of the crystalline Si component of the film continuously versus time during SPC, and (iii) a measurement of the grain size and quality of the final polycrystalline Si film. For the thin layers studied here (∼150-1000 Å), we demonstrate excellent fitting of the SPC dynamics to the Avrami-Johnson-Mehl theory for random nucleation and two-dimensional crystallite growth. For a-Si:H n-layers, the crystallization time over the range from 565 to 645°C appears to be weakly activated with an energy of 0.6 eV.

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