Structural Characteristics of the Si Whiskers Grown by Ni-Metal-Induced-Lateral-Crystallization

Si whiskers grown by Ni-Metal-Induced-Lateral-Crystallization (Ni-MILC) were grown at 413 °C, intentionally below the threshold for Solid State Crystallization, which is 420 °C. These whiskers have significant common characteristics with whiskers grown by the Vapor Liquid Solid (VLS) method. The crystalline quality of the whiskers in both methods is the same. However, in VLS, a crystalline substrate is required, in contrast to the amorphous one in Ni-MILC for the growth of single crystalline whiskers. Moreover, whiskers grown by VLS have a polygonal cross-section with their diameter determined by the diameter of the hemispherical metallic catalysts. On the other hand, in the Ni-MILC, the cross-section of the whiskers depends on the size of the NiSi2 grain from which they are emanated. This was confirmed by observing the crossing whiskers and the rotational Moiré patterns in the crossing area. The structure of disturbed short and thin nonlinear branches on the side-walls of the whiskers was studied. In the whiskers grown by the VLS method, significant contamination occurs by the metallic catalyst degrading the electrical characteristics of the whisker. Such Si whiskers are not compatible with the current CMOS process. Whiskers grown by Ni-MILC at 413 °C are also contaminated by Ni. However, the excess Ni is in the form of tetrahedral NiSi2 inclusions which are coherent with the Si matrix due to the very low misfit of 0.4% between them. These whiskers are compatible with current CMOS process and Thin Film Transistors (TFTs).

Crystallization of optically thick amorphous silicon films by near-IR femtosecond laser processing

Amorphous silicon (α-Si) film present an inexpensive and promising material for optoelectronic and nanophotonic applications. Its basic optical and optoelectronic properties are known to be improved via phase transition from amorphous to polycrystalline phase. Infrared femtosecond laser radiation can be considered as a promising nondestructive and facile way to drive uniform in-depth and lateral crystallization of α-Si films that are typically opaque in UV-visible spectral range. However, so far only a few studies reported on utilization of near-IR radiation for laser-induced crystallization of α-Si providing no information regarding optical properties of the resultant polycrystalline Si films. The present work demonstrates efficient and gentle single-pass crystallization of α-Si films induced by their direct irradiation with near-IR femtosecond laser pulses coming at sub-MHz repetition rate. Comprehensive analysis of morphology and composition of laser-annealed films by atomic-force microscopy, optical, micro-Raman and energy-dispersive X-ray spectroscopy, as well as numerical modeling of optical spectra, confirmed efficient crystallization of α-Si and high-quality of the obtained films. Moreover, we highlight localized laser-driven crystallization of α-Si as a promising way for optical information encryption, anti-counterfeiting and fabrication of micro-optical elements.

Unseeded Crystal Growth of (100)-Oriented Grain-Boundary-Free Si Thin-Film by a Single Scan of the CW-Laser Lateral Crystallization of a-Si on Insulator

Laser crystallization of a-Si film on insulating substrate is a promising technology to fabricate three-dimensional integrations (3D ICs), flat panel displays (FPDs), or flexible electronics, because the crystallization can be performed on room temperature substrate to avoid damage to the underlying devices or supporting plane. Orientation-controlled grain-boundary-free films are required to improve the uniformity in electrical characteristics of field-effect-transistors (FETs)fabricated in those films. This paper describes the recently found simple method to obtain {100}-oriented grain-boundary-free Si thin-films stably, by using a single scan of continuous-wave (CW)-laser lateral crystallization of a-Si with a highly top-flat line beam with 532 nm wavelength at room temperature in air. It was difficult to control crystal orientations in the grain-boundary-free film crystallized by the artificial modulation of solid-liquid interface, and any other trial to obtain preferential surface orientation with multiple irradiations resulted in grain boundaries. The self-organized growth of the {100}-oriented grain-boundary-free films were realized by satisfying the following conditions: (1) highly uniform top-flat line beam, (2) SiO2 cap, (3) low laser power density in the vicinity of the lateral growth threshold, and (4) single scan crystallization. Higher scan velocity makes the process window wide for the {100}-oriented grain-boundary-free film. This crystallization is very simple, because it is performed by a single unseeded scan with a line beam at room temperature substrate in air.