A modified broad beam ion source for low-energy hydrogen implantation

1998 ◽  
Vol 69 (3) ◽  
pp. 1499-1504 ◽  
Author(s):  
K. Otte ◽  
A. Schindler ◽  
F. Bigl ◽  
H. Schlemm
1994 ◽  
Vol 65 (4) ◽  
pp. 1371-1373
Author(s):  
D. L. Lu ◽  
J. F. Yang ◽  
S. F. Jiang
Keyword(s):  

1983 ◽  
Vol 25 ◽  
Author(s):  
A. Climent ◽  
J.-S. Wang ◽  
S. J. Fonash

ABSTRACTThe dry etching technologies reactive ion etching (RIE) and ion beam etching (IBE) have both been shown to cause a damaged layer at silicon surfaces. It has been demonstrated that this damage can be annealed out or, alternatively, it can be passivated with low energy hydrogen implants from a Kaufman ion source. This study further explores the hydrogen passivation approach by focusing on the effect of hydrogen implantation on damage caused by argon ion beam etching. The lighter hydrogen ions are actually shown ta cause more extensive damage than the heavier argon ions. However, by using low-energy hydrogen implants all damage, that present from the Ar and that generated during the hydrogen implant, can be passivated.


2003 ◽  
Vol 83 (23) ◽  
pp. 4722-4724 ◽  
Author(s):  
E. K. Wåhlin ◽  
M. Watanabe ◽  
J. Shimonek ◽  
D. Burtner ◽  
D. Siegfried

2019 ◽  
Vol 8 (3) ◽  
pp. 354-359 ◽  
Author(s):  
Ali Atta ◽  
Hassan Mohamed Abdel-Hamid ◽  
Yasser Hassan Ali Fawzy ◽  
Mohamed Mahmoud El-Okr
Keyword(s):  

Vacuum ◽  
1986 ◽  
Vol 36 (11-12) ◽  
pp. 917-920 ◽  
Author(s):  
S Ashok ◽  
SA Ringel

1989 ◽  
Vol 48 (1) ◽  
pp. 31-40 ◽  
Author(s):  
T. Zundel ◽  
A. Mesli ◽  
J. C. Muller ◽  
P. Siffert

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