scholarly journals Correction: Hydrolysis and condensation of a benzocyclobutene-functionalized precursor for the synthesis of high performance low-K polymers

RSC Advances ◽  
2017 ◽  
Vol 7 (29) ◽  
pp. 17768-17768
Author(s):  
Yuanrong Cheng ◽  
Wenhao Chen ◽  
Zhuo Li ◽  
Tangwei Zhu ◽  
Ziyu Zhang ◽  
...  
Keyword(s):  
High Performance ◽  
Hydrolysis And Condensation ◽  
Low K

Correction for ‘Hydrolysis and condensation of a benzocyclobutene-functionalized precursor for the synthesis of high performance low-K polymers’ by Yuanrong Cheng et al., RSC Adv., 2017, 7, 14406–14412.

scholarly journals Hydrolysis and condensation of a benzocyclobutene-functionalized precursor for the synthesis of high performance low-K polymers

RSC Advances ◽  
2017 ◽  
Vol 7 (24) ◽  
pp. 14406-14412 ◽  
Author(s):  
Yuanrong Cheng ◽  
Wenhao Chen ◽  
Zhuo Li ◽  
Tangwei Zhu ◽  
Ziyu Zhang ◽  
...  
Keyword(s):  
High Performance ◽  
Functionalized Polymers ◽  
Synthetic Route ◽  
Hydrolysis And Condensation ◽  
Low K

A new synthetic route involving the hydrolysis and condensation of a BCB precursor for high performance low-K benzocyclobutene-functionalized polymers was developed.

High-performance intrinsic low-k polymer via the synergistic effect of its three units: adamantyl, perfluorocyclobutylidene and benzocyclobutene

RSC Advances ◽  
2016 ◽  
Vol 6 (73) ◽  
pp. 68560-68567 ◽  
Author(s):  
Lingqiang Kong ◽  
Tianke Qi ◽  
Zhidong Ren ◽  
Yunxia Jin ◽  
Yan Li ◽  
...  
Keyword(s):  
Synergistic Effect ◽  
High Performance ◽  
Low K

Intrinsic highly cross-linked low-k benzocyclobutene polymer functionalized with adamantyl and perfluorocyclobutylidene.

High-Performance Extremely Low-k Film Integration Technology with Metal Hard Mask Process for Cu Interconnects

2016 ◽  
Vol 5 (10) ◽  
pp. P578-P583 ◽  
Author(s):  
Naoki Torazawa ◽  
Susumu Matsumoto ◽  
Takeshi Harada ◽  
Yasunori Morinaga ◽  
Daisuke Inagaki ◽  
...  
Keyword(s):  
High Performance ◽  
Hard Mask ◽  
Integration Technology ◽  
Cu Interconnects ◽  
Low K

Kinetics of a novel cytosolic protein during the onset of renal epithelial cell growth

1988 ◽  
Vol 255 (5) ◽  
pp. F868-F873 ◽  
Author(s):  
H. N. Aithal ◽  
M. M. Walsh-Reitz ◽  
S. Kartha ◽  
S. L. Gluck ◽  
W. A. Franklin ◽  
...  
Keyword(s):  
Epithelial Cells ◽  
High Performance ◽  
Rabbit Antiserum ◽  
Size Exclusion ◽  
Immunocytochemical Staining ◽  
Enzyme Linked Immunosorbent Assay ◽  
Renal Epithelial Cell ◽  
Control Value ◽  
Low K ◽  
In Cells

Exposure of monkey kidney epithelial cells (BSC-1 line) to medium with a reduced K concentration (3.2 mM) stimulated growth and transiently activated glyceraldehyde-3-phosphate dehydrogenase (G3PD). The increase in enzyme activity was mediated by a cytosolic modifier protein that was purified using affinity and size-exclusion chromatography, and anion-exchange high-performance liquid chromatography. The apparent molecular mass of the protein was 62 kDa. A monospecific antibody to the protein was prepared from rabbit antiserum and used as an immunoprobe. Immunocytochemical staining and Western blotting revealed that the protein was a normal constituent of the cytosol and that it accumulated in cells exposed to low-K medium. A quantitative enzyme-linked immunosorbent assay showed that the amount of modifier protein increased progressively for up to 2 h in cells exposed to low-K medium, and then returned to the control value, a kinetic profile similar to that observed for G3PD activity. These results indicate that the modifier protein is a constituent of renal epithelial cells and accumulates transiently in the cytosol where it could regulate G3PD activity during the onset of growth induced by the low-K mitogenic signal.

High Reliability and Thermal Performance FCBGA Package

2007 ◽  
Author(s):  
Gino Hung ◽  
Ho-Yi Tsai ◽  
Chun An Huang ◽  
Steve Chiu ◽  
C. S. Hsiao
Keyword(s):  
Thermal Performance ◽  
High Performance ◽  
Flip Chip ◽  
Dielectric Material ◽  
High Reliability ◽  
Lead Free ◽  
Molding Process ◽  
Molding Compound ◽  
Reliability Performance ◽  
Low K

A high reliability and high thermal performance molding flip chip ball grid arrays structure which was improved from Terminator FCBGA®. (The structure are shown as Fig. 1) It has many advantages, like better coplanarity, high through put (multi pes for each shut of molding process), low stress, and high thermal performance. In conventional flip chip structure, underfill dispenses and cure processes are a bottleneck due to low through put (dispensing unit by unit). For the high performance demand, large package/die size with more integrated functions needs to meet reliability criteria. Low k dielectric material, lead free bump especially and the package coplanarity are also challenges for package development. Besides, thermal performance is also a key concern with high power device. From simulation and reliability data, this new structure can provide strong bump protection and reach high reliability performance and can be applied for low-K chip and all kind of bump composition such as tin-lead, high lead, and lead free. Comparing to original Terminator FCBGA®, this structure has better thermal performance because the thermal adhesive was added between die and heat spreader instead of epoxy molding compound (EMC). The thermal adhesive has much better thermal conductivity than EMC. Furthermore, this paper also describes the process and reliability validation result.

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