A high performance 0.13 μm SOI CMOS technology with Cu interconnects and low-k BEOL dielectric

2000 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.00CH37104) ◽

10.1109/vlsit.2000.852818 ◽

2002 ◽

Cited By ~ 7

Author(s):

P. Smeys ◽

V. McGahay ◽

I. Yang ◽

J. Adkisson ◽

K. Beyer ◽

...

Keyword(s):

High Performance ◽

Cmos Technology ◽

Cu Interconnects ◽

Low K ◽

Soi Cmos

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Highly stable partial body tied SOI CMOS technology with Cu interconnect and low-k dielectric for high performance microprocessor

IEEE International SOI Conference SOI-02 ◽

10.1109/soi.2002.1044443 ◽

2002 ◽

Cited By ~ 1

Author(s):

Kim ◽

Oh ◽

Kang ◽

Oh ◽

Yoo ◽

...

Keyword(s):

High Performance ◽

Cmos Technology ◽

Partial Body ◽

Cu Interconnect ◽

Low K ◽

Soi Cmos

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High-performance 80-nm gate length SOI-CMOS technology with copper and very-low-k interconnects

2000 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.00CH37104) ◽

10.1109/vlsit.2000.852819 ◽

2002 ◽

Cited By ~ 4

Author(s):

K. Sukegawa ◽

M. Yamaji ◽

K. Yoshie ◽

K. Furumochi ◽

T. Maruyama ◽

...

Keyword(s):

High Performance ◽

Cmos Technology ◽

Gate Length ◽

Low K ◽

Soi Cmos

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A high performance 0.13 μm SOI CMOS technology with a 70 nm silicon film and with a second generation low-k Cu BEOL

International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224) ◽

10.1109/iedm.2001.979476 ◽

2002 ◽

Author(s):

J.W. Sleight ◽

P.R. Varekamp ◽

N. Lustig ◽

J. Adkisson ◽

A. Allen ◽

...

Keyword(s):

High Performance ◽

Second Generation ◽

Silicon Film ◽

Cmos Technology ◽

Low K ◽

Soi Cmos

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High-Performance Extremely Low-k Film Integration Technology with Metal Hard Mask Process for Cu Interconnects

ECS Journal of Solid State Science and Technology ◽

10.1149/2.0141610jss ◽

2016 ◽

Vol 5 (10) ◽

pp. P578-P583 ◽

Cited By ~ 2

Author(s):

Naoki Torazawa ◽

Susumu Matsumoto ◽

Takeshi Harada ◽

Yasunori Morinaga ◽

Daisuke Inagaki ◽

...

Keyword(s):

High Performance ◽

Hard Mask ◽

Integration Technology ◽

Cu Interconnects ◽

Low K

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High performance 60 nm CMOS technology enhanced with BST (body-slightly-tied) structure SOI and Cu/low-k (k=2.9) interconnect for microprocessors

2002 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.01CH37303) ◽

10.1109/vlsit.2002.1015436 ◽

2003 ◽

Author(s):

I. Kudo ◽

S. Miyake ◽

T. Syo ◽

S. Maruyama ◽

Y. Yama ◽

...

Keyword(s):

High Performance ◽

Cmos Technology ◽

Low K

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High performance Cu interconnects with low-k BCB-polymers by plasma-enhanced monomer-vapor polymerization (PE-MVP) method

1999 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.99CH36325) ◽

10.1109/vlsit.1999.799332 ◽

2003 ◽

Cited By ~ 6

Author(s):

J. Kawahara ◽

A. Nakano ◽

S. Saito ◽

K. Kinoshita ◽

T. Onodera ◽

...

Keyword(s):

High Performance ◽

Cu Interconnects ◽

Low K

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High performance 0.18 μm SOI CMOS technology

International Electron Devices Meeting 1999. Technical Digest (Cat. No.99CH36318) ◽

10.1109/iedm.1999.824243 ◽

2003 ◽

Cited By ~ 6

Author(s):

E. Leobandung ◽

E. Barth ◽

M. Sherony ◽

S.-H. Lo ◽

R. Schulz ◽

...

Keyword(s):

High Performance ◽

Cmos Technology ◽

Soi Cmos

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Thin bonded wafer SOI CMOS technology for low voltage high performance applications

10.1109/edms.1994.771270 ◽

2005 ◽

Author(s):

E.D. Nowak ◽

L. Ding ◽

Y.T. Loh ◽

C. Hu

Keyword(s):

High Performance ◽

Low Voltage ◽

Cmos Technology ◽

Soi Cmos

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Integration of ultra wide band high pass filter using high performance inductors in advanced high resistivity SOI CMOS technology

Digest of Papers. 2005 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, 2005. ◽

10.1109/smic.2005.1587959 ◽

2006 ◽

Cited By ~ 1

Author(s):

F. Gianesello ◽

D. Gloria ◽

C. Raynaud ◽

C. Tinella ◽

P. Vincent ◽

...

Keyword(s):

High Performance ◽

Wide Band ◽

Cmos Technology ◽

Ultra Wide Band ◽

High Resistivity ◽

Pass Filter ◽

High Pass Filter ◽

High Pass ◽

Soi Cmos

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An enhanced 16nm CMOS technology featuring 2nd generation FinFET transistors and advanced Cu/low-k interconnect for low power and high performance applications

2014 IEEE International Electron Devices Meeting ◽

10.1109/iedm.2014.7046970 ◽

2014 ◽

Cited By ~ 9

Author(s):

Shien-Yang Wu ◽

C.Y. Lin ◽

M.C. Chiang ◽

J.J. Liaw ◽

J.Y. Cheng ◽

...

Keyword(s):

Low Power ◽

High Performance ◽

Cmos Technology ◽

Low K

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