Reliability evaluations for board-level chip-scale packages under coupled power and thermal cycling test conditions

2008 ◽  
Vol 48 (1) ◽  
pp. 132-139 ◽  
Author(s):  
Tong Hong Wang ◽  
Yi-Shao Lai ◽  
Yu-Cheng Lin
Keyword(s):  
Thermal Cycling ◽  
Thermal Cycling Test ◽  
Cycling Test ◽  
Test Conditions ◽  
Board Level

Transient Thermal Analysis for Board-Level Chip-Scale Packages Subjected to Coupled Power and Thermal Cycling Test Conditions

2005 ◽  
Vol 128 (3) ◽  
pp. 281-284 ◽  
Author(s):  
Tong Hong Wang ◽  
Chang-Chi Lee ◽  
Yi-Shao Lai ◽  
Yu-Cheng Lin
Keyword(s):  
Thermal Analysis ◽  
Boundary Conditions ◽  
Thermal Cycling ◽  
Thermal Cycling Test ◽  
Transient Thermal Analysis ◽  
Cycling Test ◽  
Test Conditions ◽  
Power Cycling ◽  
Transient Thermal ◽  
Board Level

In this work, thermal characteristics of a board-level chip-scale package, subjected to coupled power and thermal cycling test conditions defined by JEDEC, are investigated through the transient thermal analysis. Tabular boundary conditions are utilized to deal with time-varying thermal boundary conditions brought by thermal cycling. It is obvious from the analysis that the presence of power cycling leads to a significant deviation of the junction temperature from the thermal cycling profile. However, for components away from the die, the deviation is insignificant. Moreover, for low-power applications, temperature histories from coupled power and thermal cycling are approximately linear combinations of temperature histories from pure power cycling and the ones from pure thermal cycling.

Development of BiAgX® HT Solder Paste for 200°C Application

2016 ◽  
Vol 2016 (HiTEC) ◽  
pp. 000128-000133 ◽  
Author(s):  
Hongwen Zhang ◽  
Jonathan Minter ◽  
Ning-Cheng Lee
Keyword(s):  
Shear Strength ◽  
Thermal Cycling ◽  
Melting Temperature ◽  
Thermal Aging ◽  
Joint Strength ◽  
Solder Paste ◽  
Thermal Cycling Test ◽  
Cycling Test ◽  
Die Attach ◽  
Board Level

Abstract BiAgX® paste with the remelting temperature around 262°C has been tested and adopted successfully for die attach applications [1–5]. BiAgX® HT pastes with the enhanced remelting temperature above 265°C have been designed for the application of 200°C or even higher. The joint strength has been well maintained for most of the tested pastes after thermal aging @ 200°C for 1000hrs. The thermal cycling test (from −55°C to 200°C) degrades the bond shear strength but some of the tested pastes can still keep the joint strength well above IEC standard (IEC 60749-19) required. The melting temperature and the reliability have been observed to closely associate with the alloying elements Z%wt. The BiAgX® pastes have also been modified for board level assembly application. BiAgX® solder wire is under development too.

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