Investigating Effect of Unfilled Underfills on Board Level Solder Joint Reliability of Area Array Packages under Drop Test and Thermal Cycling Test

2006 ◽  
Author(s):  
E.S. Ibe ◽  
K.I. Loh ◽  
Jing-en Luan ◽  
Tong Yan Tee
Keyword(s):  
Solder Joint ◽  
Thermal Cycling ◽  
Drop Test ◽  
Thermal Cycling Test ◽  
Solder Joint Reliability ◽  
Cycling Test ◽  
Joint Reliability ◽  
Area Array ◽  
Board Level

scholarly journals Thermal Cycling Test and Simulation of Fan-Out Chip-Last Panel-Level Packaging for Heterogeneous Integration

2021 ◽  
Vol 18 (2) ◽  
pp. 29-39
Author(s):  
John H Lau ◽  
Cheng-Ta Ko ◽  
Chia-Yu Peng ◽  
Kai-Ming Yang ◽  
Tim Xia ◽  
...  
Keyword(s):  
Solder Joint ◽  
Thermal Cycling ◽  
Circuit Board ◽  
Heterogeneous Integration ◽  
Thermal Cycling Test ◽  
Test Results ◽  
Solder Joint Reliability ◽  
Cycling Test ◽  
Pcb Assembly ◽  
Joint Reliability

Abstract In this study, the reliability of the solder joints of a heterogeneous integration of one large chip (10 × 10 mm) and two smaller chips (7 × 5 mm) by a fan-out method with a redistribution layer-first substrate fabricated on a 515 × 510-mm panel is investigated. Emphasis is placed on the thermal cycling test (−55°C Δ 125°C, 50-min cycle) of the heterogeneous integration package on a printed circuit board (PCB). The thermal cycling test results are plotted into a Weibull distribution. The Weibull slope and characteristic life at median rank are presented. At 90% confidence, the true Weibull slope and the true 10% life interval are also provided. A linear acceleration factor is adopted to map the solder joint reliability at the test condition to the solder joint reliability at an operating condition. The failure location and failure mode of the PCB assembly of the heterogeneous integration package are provided and discussed. A nonlinear, time- and temperature-dependent 3-D finite element simulation is performed for the heterogeneous integration PCB assembly and correlated with the thermal cycling test results.

Experimental Evaluation on Solder Joint Reliability of PBGA Assembly Under Mechanical Drop Test

2002 ◽  
Author(s):  
Shi-Wei Ricky Lee ◽  
Yin-Lai Tracy Li ◽  
Hoi-Wai Ben Lui
Keyword(s):  
Solder Joint ◽  
Failure Modes ◽  
Solder Joints ◽  
Drop Test ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Free Solder ◽  
Board Level ◽  
Better Than ◽  
Mechanical Drop Test

The present study is intended to investigate the board level solder joint reliability of PBGA assemblies under mechanical drop test. During the course of this study, a five-leg experiment was designed to investigate various combinations of solder materials and peak reflow temperatures. Two major failure modes, namely, solder cracking and copper trace breakage, were identified. In addition, the critical location of solder joints was characterized. It was found that Sn-Pb eutectic solder joints performed better than Pb-free solder joints under mechanical impact loading.

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