Development of BiAgX® HT Solder Paste for 200°C Application

2016 ◽  
Vol 2016 (HiTEC) ◽  
pp. 000128-000133 ◽  
Author(s):  
Hongwen Zhang ◽  
Jonathan Minter ◽  
Ning-Cheng Lee
Keyword(s):  
Shear Strength ◽  
Thermal Cycling ◽  
Melting Temperature ◽  
Thermal Aging ◽  
Joint Strength ◽  
Solder Paste ◽  
Thermal Cycling Test ◽  
Cycling Test ◽  
Die Attach ◽  
Board Level

Abstract BiAgX® paste with the remelting temperature around 262°C has been tested and adopted successfully for die attach applications [1–5]. BiAgX® HT pastes with the enhanced remelting temperature above 265°C have been designed for the application of 200°C or even higher. The joint strength has been well maintained for most of the tested pastes after thermal aging @ 200°C for 1000hrs. The thermal cycling test (from −55°C to 200°C) degrades the bond shear strength but some of the tested pastes can still keep the joint strength well above IEC standard (IEC 60749-19) required. The melting temperature and the reliability have been observed to closely associate with the alloying elements Z%wt. The BiAgX® pastes have also been modified for board level assembly application. BiAgX® solder wire is under development too.

Development of low temperature sintered nano silver pastes using MO technology and resin reinforcing technology

2014 ◽  
Vol 2014 (HITEC) ◽  
pp. 000172-000177
Author(s):  
Koji Sasaki ◽  
Noritsuka Mizumura
Keyword(s):  
Shear Strength ◽  
Low Temperature ◽  
Thermal Cycling ◽  
Thick Film ◽  
Thermal Performance ◽  
Low Temperature Sintering ◽  
Thermal Cycling Test ◽  
Nano Silver ◽  
Cycling Test ◽  
Thick Film Technology

Traditional thick film technology is widely used in various electronics products. There are two type of paste based on thick film technology. Typically, over 400°C is required for high temperature sintering type which contains glass for adhesion function. It shows high electrical and thermal performance. On the other hand, 150–300°C range process is used for low temperature process type as silver epoxy. In last decade, nano silver technology shows amazing progress to address low temperature operation by low temperature sintering. This paper will discuss the results on fundamental study of newly developed nano silver pastes with unique approach which uses MO (Metallo-organic) technology and resin reinforcing technology. Nano silver pastes contain several types of dispersant as surface coating to prevent agglomeration of the particles. Various coating technique has been reported to optimize sintering performance and stability. MO technology provides low temperature sintering capability by minimizing the coating material. The nano silver pastes show high electrical and thermal performance. However, degradation of die shear strength has been found by thermal cycling test due to the fragility of porous sintered structure. To improve the mechanical property, resin reinforcing technology has been developed. By adding special resin to the pastes, the porous area is filled with the resin and the sintered structure is reinforced. Degradation of die shear strength was not found by thermal cycling test to 1000 cycles. Nano silver pastes using MO technology and resin reinforcing technology will meet lots of requirement on various thick film applications.

Development of low temperature sintered nano silver pastes using MO technology and resin reinforcing technology

2013 ◽  
Vol 2013 (1) ◽  
pp. 000842-000847
Author(s):  
Koji Sasaki ◽  
Noritsuka Mizumura
Keyword(s):  
Shear Strength ◽  
Low Temperature ◽  
Thermal Cycling ◽  
Thick Film ◽  
Thermal Performance ◽  
Low Temperature Sintering ◽  
Thermal Cycling Test ◽  
Nano Silver ◽  
Cycling Test ◽  
Thick Film Technology

Traditional thick film technology is widely used in various electronics products. There are two type of paste based on thick film technology. Typically, over 400°C is required for high temperature sintering type which contains glass for adhesion function. It shows high electrical and thermal performance. On the other hand, 150–300°C range process is used for low temperature process type as silver epoxy. In last decade, nano silver technology shows amazing progress to address low temperature operation by low temperature sintering. This paper will discuss the results on fundamental study of newly developed nano silver pastes with unique approach which uses MO (Metallo-organic) technology and resin reinforcing technology. Nano silver pastes contain several types of dispersant as surface coating to prevent agglomeration of the particles. Various coating technique has been reported to optimize sintering performance and stability. MO technology provides low temperature sintering capability by minimizing the coating material. The nano silver pastes show high electrical and thermal performance. However, degradation of die shear strength has been found by thermal cycling test due to the fragility of porous sintered structure. To improve the mechanical property, resin reinforcing technology has been developed. By adding special resin to the pastes, the porous area is filled with the resin and the sintered structure is reinforced. Degradation of die shear strength was not found by thermal cycling test to 1000 cycles. Nano silver pastes using MO technology and resin reinforcing technology will meet lots of requirement on various thick film applications.

Transient Thermal Analysis for Board-Level Chip-Scale Packages Subjected to Coupled Power and Thermal Cycling Test Conditions

2005 ◽  
Vol 128 (3) ◽  
pp. 281-284 ◽  
Author(s):  
Tong Hong Wang ◽  
Chang-Chi Lee ◽  
Yi-Shao Lai ◽  
Yu-Cheng Lin
Keyword(s):  
Thermal Analysis ◽  
Boundary Conditions ◽  
Thermal Cycling ◽  
Thermal Cycling Test ◽  
Transient Thermal Analysis ◽  
Cycling Test ◽  
Test Conditions ◽  
Power Cycling ◽  
Transient Thermal ◽  
Board Level

In this work, thermal characteristics of a board-level chip-scale package, subjected to coupled power and thermal cycling test conditions defined by JEDEC, are investigated through the transient thermal analysis. Tabular boundary conditions are utilized to deal with time-varying thermal boundary conditions brought by thermal cycling. It is obvious from the analysis that the presence of power cycling leads to a significant deviation of the junction temperature from the thermal cycling profile. However, for components away from the die, the deviation is insignificant. Moreover, for low-power applications, temperature histories from coupled power and thermal cycling are approximately linear combinations of temperature histories from pure power cycling and the ones from pure thermal cycling.

A Drop-in Die-Attach Solution for the High Temperature Lead-Free BiAgX Solder Paste System

2012 ◽  
Vol 2012 (HITEC) ◽  
pp. 000058-000065 ◽  
Author(s):  
HongWen Zhang ◽  
Ning-Cheng Lee
Keyword(s):  
Thermal Cycling ◽  
Thermal Aging ◽  
Considerable Increase ◽  
Lead Free ◽  
Solder Paste ◽  
Mixed Powder ◽  
Die Attach ◽  
Alloy Solder ◽  
Dislocation Movement ◽  
High Lead

In the current work, a mixed powder BiAgX solder paste system with the melting temperature above 260°C and comparable, or better, reliability to the high lead-containing solders has been studied. The mixed powder solder paste system is composed of a high-melting first alloy solder powder as a majority and the additive solder powder as a minority. The additive solder is designed to react aggressively with various surface finish materials before, or together with, the melting of the majority solder to form a controllable IMC layer. The IMC layer of the mixed powder system is controllable by the species and quantity of the additive solder, and it is observed to be insensitive to thermal aging and thermal cycling in current tests, while the high lead-containing solders show a considerable increase in IMC layer thickness. Microstructure investigation shows that the fishbone shaped IMC layer interlocks with the bonding interface between solder and components. Both micron-sized and nano-sized Ag-rich precipitations in the joints have been observed to be well distributed in the joint. The exposed Ag-rich particles and the surrounding stepwise pattern in the Bi matrix on the fracture surface indicate that these Ag-rich particles constrain the dislocation movement in Bi matrix, enhancing the strength and the ductility of the joint. Under thermal aging and thermal cycling, both the micron-sized and nano-sized Ag-rich precipitations exhibit only discernible and localized coarsening. The stable interfacial IMC together with the existence of the well-dispersed Ag-rich particles are attributed to the promising reliability in the BiAgX solder paste system.

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