Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003)
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152

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Published By IEEE

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A comprehensive study in thermal dissipation assessment of MPM-FCBGA

Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) ◽

10.1109/eptc.2003.1271570 ◽

2004 ◽

Cited By ~ 1

Author(s):

Mingzong Wang ◽

Jeng Yuan Lai ◽

Yu-Po Wang ◽

C.S. Hsiao

Keyword(s):

Thermal Dissipation ◽

Comprehensive Study

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Printed wiring board with coaxial wirings for high speed signal transmission

Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) ◽

10.1109/eptc.2003.1271577 ◽

2004 ◽

Cited By ~ 1

Author(s):

K. Kikuchi ◽

N. Tanaka ◽

H. Nakagawa ◽

K. Tokoro ◽

A. Kawashima ◽

...

Keyword(s):

High Speed ◽

Signal Transmission ◽

Printed Wiring Board ◽

Wiring Board

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Finite element analysis of sequential processes for ball grid array packages

Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) ◽

10.1109/eptc.2003.1271629 ◽

2004 ◽

Author(s):

Z.W. Zhong ◽

T.Y. Tee ◽

K.O. Liew

Keyword(s):

Finite Element Analysis ◽

Finite Element ◽

Ball Grid Array ◽

Element Analysis ◽

Sequential Processes ◽

Ball Grid Array Packages

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Development of a dynamic test board for FCBGA solder joint reliability assessment in shock & vibration

Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) ◽

10.1109/eptc.2003.1271525 ◽

2004 ◽

Author(s):

Tze Yang Hin ◽

Keh Shin Beh ◽

K.N. Seetharamu

Keyword(s):

Solder Joint ◽

Reliability Assessment ◽

Dynamic Test ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Test Board

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Thermal characterization of a thermally enhanced QFN package

Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) ◽

10.1109/eptc.2003.1271569 ◽

2004 ◽

Cited By ~ 8

Author(s):

S. Krishnamoorthi ◽

K.Y. Goh ◽

D.Y.R. Chong ◽

R. Kapoor ◽

A.Y.S. Sun

Keyword(s):

Thermal Characterization

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Test strategies for fine pitch wafer level packaged devices

Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) ◽

10.1109/eptc.2003.1271553 ◽

2004 ◽

Cited By ~ 3

Author(s):

J. Jayabalan ◽

M.D. Rotaru ◽

Deng Chun ◽

Feng Han Hua ◽

M.K. Iyer ◽

...

Keyword(s):

Wafer Level ◽

Test Strategies ◽

Fine Pitch

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Ball bond process optimization using in situ ball shear force

Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) ◽

10.1109/eptc.2003.1271624 ◽

2004 ◽

Cited By ~ 1

Author(s):

J. Medding ◽

M. Mayer

Keyword(s):

Process Optimization ◽

Shear Force ◽

Ball Bond ◽

Ball Shear

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Comparison of bonding defects for longitudinal and transverse thermosonic flip-chip

Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) ◽

10.1109/eptc.2003.1271544 ◽

2004 ◽

Cited By ~ 1

Author(s):

M.L.H. Leung ◽

H.C. Lai-Wah ◽

P.L. Chou-Kee

Keyword(s):

Flip Chip

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Challenges in the reliability study of chip-on-glass (COG) technology for mobile display applications

Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) ◽

10.1109/eptc.2003.1271590 ◽

2004 ◽

Cited By ~ 14

Author(s):

Z.P. Wang

Keyword(s):

Reliability Study

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New package/board materials technology for next-generation convergent microsystems

Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) ◽

10.1109/eptc.2003.1271540 ◽

2004 ◽

Cited By ~ 2

Author(s):

N. Kumbhat ◽

P.M. Raj ◽

S. Bansal ◽

R. Doraiswami ◽

S. Bhattacharya ◽

...

Keyword(s):

Next Generation

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Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

A comprehensive study in thermal dissipation assessment of MPM-FCBGA

Printed wiring board with coaxial wirings for high speed signal transmission

Finite element analysis of sequential processes for ball grid array packages

Development of a dynamic test board for FCBGA solder joint reliability assessment in shock & vibration

Thermal characterization of a thermally enhanced QFN package

Test strategies for fine pitch wafer level packaged devices

Ball bond process optimization using in situ ball shear force

Comparison of bonding defects for longitudinal and transverse thermosonic flip-chip

Challenges in the reliability study of chip-on-glass (COG) technology for mobile display applications

New package/board materials technology for next-generation convergent microsystems

Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003)
Latest Publications