Reliability study of high-end Pb-free CBGA solder joint under various thermal cycling test conditions

2009 ◽  
Author(s):  
Dongji Xie ◽  
Vadim Gektin ◽  
David Geiger
Keyword(s):  
Solder Joint ◽  
Thermal Cycling ◽  
Thermal Cycling Test ◽  
Reliability Study ◽  
Cycling Test ◽  
Test Conditions

scholarly journals Thermal Cycling Test and Simulation of Fan-Out Chip-Last Panel-Level Packaging for Heterogeneous Integration

2021 ◽  
Vol 18 (2) ◽  
pp. 29-39
Author(s):  
John H Lau ◽  
Cheng-Ta Ko ◽  
Chia-Yu Peng ◽  
Kai-Ming Yang ◽  
Tim Xia ◽  
...  
Keyword(s):  
Solder Joint ◽  
Thermal Cycling ◽  
Circuit Board ◽  
Heterogeneous Integration ◽  
Thermal Cycling Test ◽  
Test Results ◽  
Solder Joint Reliability ◽  
Cycling Test ◽  
Pcb Assembly ◽  
Joint Reliability

Abstract In this study, the reliability of the solder joints of a heterogeneous integration of one large chip (10 × 10 mm) and two smaller chips (7 × 5 mm) by a fan-out method with a redistribution layer-first substrate fabricated on a 515 × 510-mm panel is investigated. Emphasis is placed on the thermal cycling test (−55°C Δ 125°C, 50-min cycle) of the heterogeneous integration package on a printed circuit board (PCB). The thermal cycling test results are plotted into a Weibull distribution. The Weibull slope and characteristic life at median rank are presented. At 90% confidence, the true Weibull slope and the true 10% life interval are also provided. A linear acceleration factor is adopted to map the solder joint reliability at the test condition to the solder joint reliability at an operating condition. The failure location and failure mode of the PCB assembly of the heterogeneous integration package are provided and discussed. A nonlinear, time- and temperature-dependent 3-D finite element simulation is performed for the heterogeneous integration PCB assembly and correlated with the thermal cycling test results.

Transient Thermal Analysis for Board-Level Chip-Scale Packages Subjected to Coupled Power and Thermal Cycling Test Conditions

2005 ◽  
Vol 128 (3) ◽  
pp. 281-284 ◽  
Author(s):  
Tong Hong Wang ◽  
Chang-Chi Lee ◽  
Yi-Shao Lai ◽  
Yu-Cheng Lin
Keyword(s):  
Thermal Analysis ◽  
Boundary Conditions ◽  
Thermal Cycling ◽  
Thermal Cycling Test ◽  
Transient Thermal Analysis ◽  
Cycling Test ◽  
Test Conditions ◽  
Power Cycling ◽  
Transient Thermal ◽  
Board Level

In this work, thermal characteristics of a board-level chip-scale package, subjected to coupled power and thermal cycling test conditions defined by JEDEC, are investigated through the transient thermal analysis. Tabular boundary conditions are utilized to deal with time-varying thermal boundary conditions brought by thermal cycling. It is obvious from the analysis that the presence of power cycling leads to a significant deviation of the junction temperature from the thermal cycling profile. However, for components away from the die, the deviation is insignificant. Moreover, for low-power applications, temperature histories from coupled power and thermal cycling are approximately linear combinations of temperature histories from pure power cycling and the ones from pure thermal cycling.

scholarly journals Thermal Cycling Test and Simulation of Six-Side Molded Panel-Level Chip-Scale Packages (PLCSPs)

2021 ◽  
Vol 18 (2) ◽  
pp. 67-80
Author(s):  
John H Lau ◽  
Cheng-Ta Ko ◽  
Chia-Yu Peng ◽  
Tzvy-Jang Tseng ◽  
Kai-Ming Yang ◽  
...  
Keyword(s):  
Solder Joint ◽  
Thermal Cycling ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Thermal Cycling Test ◽  
Test Results ◽  
Cycling Test ◽  
Chip Scale Package ◽  
C 50 ◽  
The One

Abstract In this study, the reliability of the solder joints of a six-side molded panel-level chip-scale package (PLCSP) is investigated. Emphasis is placed on the thermal cycling test (−55°C Δ 125°C, 50-min cycle) of the six-side molded PLCSP on a printed circuit board. For comparison purpose, the one without six-side molded (ordinary) PLCSP is also subjected to the same test. The thermal cycling test results are plotted into a Weibull distribution, and the true Weibull slope and true characteristic life at 90% confidence are presented. The solder joint mean life ratio of these two cases and its confidence level are also determined. Furthermore, their solder joint failure location and failure mode are provided. Finally, a nonlinear, time- and temperature-dependent 3-D finite element simulation is performed for these two cases and correlated with the thermal cycling test results.

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