scholarly journals Flexible Electronics: A General Surface Swelling‐Induced Electroless Deposition Strategy for Fast Fabrication of Copper Circuits on Various Polymer Substrates (Adv. Mater. Interfaces 14/2017)

2017 ◽  
Vol 4 (14) ◽  
Author(s):  
Xueyan Sun ◽  
Lijing Zhang ◽  
Shengyang Tao ◽  
Yongxian Yu ◽  
Sijie Li ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
Electroless Deposition ◽  
Polymer Substrates ◽  
General Surface

A General Surface Swelling‐Induced Electroless Deposition Strategy for Fast Fabrication of Copper Circuits on Various Polymer Substrates

2017 ◽  
Vol 4 (14) ◽  
pp. 1700052 ◽  
Author(s):  
Xueyan Sun ◽  
Lijing Zhang ◽  
Shengyang Tao ◽  
Yongxian Yu ◽  
Sijie Li ◽  
...  
Keyword(s):  
Electroless Deposition ◽  
Polymer Substrates ◽  
General Surface

Highly Thermally Stable, Green Solvent Disintegrable, and Recyclable Polymer Substrates for Flexible Electronics

2020 ◽  
Vol 41 (19) ◽  
pp. 2000292
Author(s):  
Linlin Chen ◽  
Huang Yu ◽  
Mahmut Dirican ◽  
Dongjun Fang ◽  
Yan Tian ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
Thermally Stable ◽  
Green Solvent ◽  
Polymer Substrates

Polymer Substrates for Flexible Electronics: Achievements and Challenges

2010 ◽  
Vol 93-94 ◽  
pp. 5-8 ◽  
Author(s):  
Iryna Yakimets ◽  
Duncan MacKerron ◽  
Peter Giesen ◽  
Keith J. Kilmartin ◽  
Marloes Goorhuis ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Mechanical Behaviour ◽  
Flexible Electronics ◽  
Physical And Mechanical Properties ◽  
Polymer Materials ◽  
Polyethylene Naphthalate ◽  
Polymer Substrates ◽  
Micro Scale ◽  
Wide Range ◽  
Micro Deformation

Flexible electronics technology can potentially result in many compelling applications not satisfied by the rigid Si-based conventional electronics. Commercially available foils such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN) have emerged as the most suitable polymer materials for wide range of flexible electronics applications. Despite the enormous progress which has been recently done on the optimization of physical and mechanical properties of PET and PEN foils, their dimensional stability at the micro-scale is still an issue during patterning of wiring by means of lithography. Consequently, the measurement of in-plane micro-deformation of foil is of great importance for understanding and predicting its thermal, hydroscopic and mechanical behaviour during processing.

Low Temperature Plasma Sintering of Silver Nanoparticles for Potential Flexible Electronics Applications

2012 ◽  
Vol 1529 ◽  
Author(s):  
Siyuan Ma ◽  
Vadim Bromberg ◽  
Frank D. Egitto ◽  
Timothy J. Singler
Keyword(s):  
Low Temperature ◽  
Flexible Electronics ◽  
Treatment Time ◽  
Functional Materials ◽  
Average Diameter ◽  
Plasma Parameters ◽  
Temperature Plasma ◽  
Polymer Substrates ◽  
Flexible Polymer ◽  
Temperature Requirements

ABSTRACTDeposition of solution-processed functional materials generally requires additional post-processing to optimize the functionality of the material. We study sintering of Ag nanoparticle (NP) (with average diameter 77nm) deposits for improved electrical conductivity, with emphasis on Argon plasma methods compatible with the low temperature requirements of regular low-cost flexible polymer substrates. The relationship between plasma parameters (such as power and treatment time) versus sintering results (sintered structure depth, film continuity and electrical sheet resistance) will be reported. According to our efforts so far, we have achieved the electrical resistivity of the sintered film at about 20 times greater than the value of bulk silver using a process compatible with the low temperature requirements of common flexible polymer substrates.

Directly deposited MoS2thin film electrodes for high performance supercapacitors

2015 ◽  
Vol 3 (47) ◽  
pp. 24049-24054 ◽  
Author(s):  
Nitin Choudhary ◽  
Mumukshu Patel ◽  
Yee-Hsien Ho ◽  
Narendra B. Dahotre ◽  
Wonki Lee ◽  
...  
Keyword(s):  
Thin Film ◽  
Flexible Electronics ◽  
High Performance ◽  
Cyclic Stability ◽  
Two Dimensional ◽  
Polymer Substrates ◽  
Energy Devices ◽  
Direct Deposition ◽  
Cu Foil

We demonstrate the direct deposition of two-dimensional (2D) MoS2thin film on Cu-foil and polymer substrates, exhibiting an excellent capacitance and outstanding cyclic stability. The MoS2based supercapacitors will enable new opportunities in flexible electronics and energy devices.

scholarly journals Fabrication of Nanoscale Oxide Textured Surfaces on Polymers

Polymers ◽  
2021 ◽  
Vol 13 (13) ◽  
pp. 2209
Author(s):  
Barun K. Barick ◽  
Neta Shomrat ◽  
Uri Green ◽  
Zohar Katzman ◽  
Tamar Segal-Peretz
Keyword(s):  
Flexible Electronics ◽  
Self Assembly ◽  
Temperature Sensitive ◽  
Textured Surfaces ◽  
Oxide Interface ◽  
Solvent Annealing ◽  
Polymer Substrates ◽  
Uv Crosslinking ◽  
Oxide Nanostructures ◽  
Antibacterial Surfaces

Nanoscale textured surfaces play an important role in creating antibacterial surfaces, broadband anti-reflective properties, and super-hydrophobicity in many technological systems. Creating nanoscale oxide textures on polymer substrates for applications such as ophthalmic lenses and flexible electronics imposes additional challenges over conventional nanofabrication processes since polymer substrates are typically temperature-sensitive and chemically reactive. In this study, we investigated and developed nanofabrication methodologies to create highly ordered oxide nanostructures on top of polymer substrates without any lithography process. We developed suitable block copolymer self-assembly, sequential infiltration synthesis (SIS), and reactive ion etching (RIE) for processes on polymer substrates. Importantly, to prevent damage to the temperature-sensitive polymer and polymer/oxide interface, we developed the process to be entirely performed at low temperatures, that is, below 80 °C, using a combination of UV crosslinking, solvent annealing, and modified SIS and RIE processes. In addition, we developed a substrate passivation process to overcome reactivity between the polymer substrate and the SIS precursors as well as a high precision RIE process to enable deep etching into the thermally insulated substrate. These methodologies widen the possibilities of nanofabrication on polymers.

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