A facile process combined with inkjet printing, surface modification and electroless deposition to fabricate adhesion-enhanced copper patterns on flexible polymer substrates for functional flexible electronics
2021 ◽
Vol 72
(7)
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pp. 386-390
Keyword(s):
2020 ◽
Vol 64
(5)
◽
pp. 50405-1-50405-5
Keyword(s):
2021 ◽
Vol 632
◽
pp. 052007
Keyword(s):
2014 ◽
Vol 1038
◽
pp. 49-55
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Keyword(s):
2008 ◽
Vol 85
(5-6)
◽
pp. 1108-1111
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