Low Temperature Plasma Sintering of Silver Nanoparticles for Potential Flexible Electronics Applications

2012 ◽  
Vol 1529 ◽  
Author(s):  
Siyuan Ma ◽  
Vadim Bromberg ◽  
Frank D. Egitto ◽  
Timothy J. Singler
Keyword(s):  
Low Temperature ◽  
Flexible Electronics ◽  
Treatment Time ◽  
Functional Materials ◽  
Average Diameter ◽  
Plasma Parameters ◽  
Temperature Plasma ◽  
Polymer Substrates ◽  
Flexible Polymer ◽  
Temperature Requirements

ABSTRACTDeposition of solution-processed functional materials generally requires additional post-processing to optimize the functionality of the material. We study sintering of Ag nanoparticle (NP) (with average diameter 77nm) deposits for improved electrical conductivity, with emphasis on Argon plasma methods compatible with the low temperature requirements of regular low-cost flexible polymer substrates. The relationship between plasma parameters (such as power and treatment time) versus sintering results (sintered structure depth, film continuity and electrical sheet resistance) will be reported. According to our efforts so far, we have achieved the electrical resistivity of the sintered film at about 20 times greater than the value of bulk silver using a process compatible with the low temperature requirements of common flexible polymer substrates.

Rovibrational distribution of H2 in low temperature plasma: the dependence on the plasma parameters

2005 ◽  
Vol 337-339 ◽  
pp. 1082-1086 ◽  
Author(s):  
Bingjia Xiao ◽  
Shinichiro Kado ◽  
Shin Kajita ◽  
Daisuke Yamasaki ◽  
Satoru Tanaka
Keyword(s):  
Low Temperature ◽  
Low Temperature Plasma ◽  
Plasma Parameters ◽  
Temperature Plasma

scholarly journals Low-Temperature Plasma Modification of Styrene–Butadiene Block Copolymer Surfaces for Improved Adhesion—A Kinetic Approach

Polymers ◽  
2020 ◽  
Vol 12 (4) ◽  
pp. 935 ◽  
Author(s):  
Jacek Tyczkowski ◽  
Hanna Kierzkowska-Pawlak ◽  
Jan Sielski ◽  
Iwona Krawczyk-Kłys
Keyword(s):  
Block Copolymer ◽  
Low Temperature ◽  
Plasma Treatment ◽  
Treatment Time ◽  
Peel Strength ◽  
Cross Linking ◽  
Low Temperature Plasma ◽  
Temperature Plasma ◽  
Plasma Treatment Time ◽  
Styrene Butadiene

This paper proposed a kinetic model that can describe the changes in the adhesion properties of styrene–butadiene (SBS) block copolymer surfaces under the influence of low-temperature plasma treatment. As a measure of these changes, the peel strength of joints formed between the copolymer surface and the polyurethane adhesive was chosen. Five types of low-temperature low-pressure RF plasma, two inert plasmas (Ar and He), and three reactive plasmas (O2, CO2, and CCl4) were tested. It was found that for all these types of plasma, the peel strength with the plasma treatment time first increases rapidly reaching a maximum value, and then there is a visible decrease in peel strength, after which the peel strength increases again. This dependence of the peel strength on the plasma treatment time is very well described by the proposed model, which considers three processes: (1) the generation of radical states followed by the creation of functional groups involved in the adhesive bonding process, (2) the surface cross-linking that decreases the concentration of these functional groups, and (3) the formation of nano-roughness. The model analysis revealed differences between the action of reactive and inert plasmas in the SBS surface cross-linking mechanism and preferential etching process, as well as differences in the generation of radical states between the O2 plasma (electron process) and other plasmas tested (ionic processes).

Fabrication of Inkjet Printed Flexible Electronics by Low Temperature Subtractive Laser Processing

2005 ◽  
Author(s):  
Seung Hwan Ko ◽  
Jaewon Chung ◽  
Yeonho Choi ◽  
Costas P. Griogoropoulos ◽  
Dimos Poulikakos
Keyword(s):  
Low Temperature ◽  
Laser Beam ◽  
Flexible Electronics ◽  
Monomethyl Ether ◽  
Polymer Substrate ◽  
Nano Particles ◽  
Drop On Demand ◽  
Flexible Polymer ◽  
Gold Nano Particles ◽  
Electrical Components

The low temperature fabrication of passive electrical components (resistor, capacitor) on flexible substrates is presented in this paper. A drop-on-demand (DOD) ink-jetting system was used to print passive electrical components from gold nano-particles suspended in Alpha-Terpineol solution on a flexible polymer substrate. PVP (poly-4-vinylphenol) in PGMEA (propylene glycol monomethyl ether acetate) solvent was inkjet-printed as dielectric layer for capacitor. A pulsed laser beam was irradiated to produce finer electrical components, thereby overcoming the inherent limitation of inkjet processing. A continuous Ar laser beam was irradiated locally to evaporate carrier solvent as well as to cure the gold nano-particles in order to improve the electrical resistivity. Conductor lines and capacitors were fabricated on polymer substrate and their performance was analyzed.

Investigations on spatial distribution of low temperature plasma parameters using NiCr wire probe diagnostic

Measurement ◽  
2016 ◽  
Vol 91 ◽  
pp. 194-200 ◽  
Author(s):  
Muhammad Yasin Naz ◽  
Shazia Shukrullah ◽  
Shaharin Anwar Sulaiman ◽  
Najeeb-ur-Rehman ◽  
Yasin Khan ◽  
...  
Keyword(s):  
Spatial Distribution ◽  
Low Temperature ◽  
Low Temperature Plasma ◽  
Plasma Parameters ◽  
Temperature Plasma ◽  
Wire Probe

Cold atmospheric plasma activity on microorganisms. A study on the influence of the treatment time and surface

2015 ◽  
Vol 81 (4) ◽  
Author(s):  
C. L. Xaplanteris ◽  
E. D. Filippaki ◽  
J. K. Christodoulakis ◽  
M. A. Kazantzaki ◽  
E. P. Tsakalos ◽  
...  
Keyword(s):  
Low Temperature ◽  
Atmospheric Pressure ◽  
Open Space ◽  
Treatment Time ◽  
Ambient Air ◽  
Atmospheric Plasma ◽  
Large Area ◽  
Temperature Plasma ◽  
Cold Atmospheric Plasma ◽  
Environment Temperature

The second half of the 20th century can be characterized and named as the ‘plasma era’, as the plasma gathered scientific interest because of its special physical behaviour. Thus, it was considered as the fourth material state and the plasma physics began to form consequently. In addition to this, many important applications of plasma were discovered and put to use. Especially, in last few decades, there has been an increased interest in the use of cold atmospheric plasma in bio-chemical applications. Until now, thermal plasma has been commonly used in many bio-medical and other applications; however, more recent efforts have shown that plasma can also be produced at lower temperature (close to the environment temperature) by using ambient air in an open space (in atmospheric pressure). However, two aspects remain neglected: firstly, low-temperature plasma production with a large area, and secondly, acquiring the necessary knowledge and understanding the relevant interaction mechanisms of plasma species with microorganisms. These aspects are currently being investigated at the ‘Demokritos’ Plasma Laboratory in Athens, Greece with radio frequency (27.12 MHz and it integer harmonics)-driven sub-atmospheric pressure plasma (100 Pa). The first aspect was achieved with atmospheric plasma being produced at a low temperature (close to the environment temperature) and in a large closed space systems. Regarding the plasma effect on living microorganisms, preliminary experiments and findings have already been carried out and many more have been planned for the near future.

Characterization of Capacitively Coupled Radio-Frequency Argon Plasma by Electrical Circuit Simulation

2011 ◽  
Vol 110-116 ◽  
pp. 5373-5379
Author(s):  
B. Bora ◽  
H. Bhuyan ◽  
M. Favre ◽  
E. Wyndham ◽  
H. Chuaqui
Keyword(s):  
Low Temperature ◽  
Radio Frequency ◽  
Circuit Simulation ◽  
Argon Plasma ◽  
Electrical Circuit ◽  
Plasma Parameters ◽  
Temperature Plasma ◽  
Capacitively Coupled ◽  
Wide Range ◽  
Discharge Model

Low temperature radio frequency plasma is widely used in low temperature plasma processing medium for material processing in many fields including microelectronics, aerospace, and the biology. For proper utilization of the process, it is very much important to know the plasma parameters. In this paper a novel technique is used to determine the plasma parameters from the electrical discharge characteristic and the power balance method. The homogeneous discharge model is used to evaluate the relation between the plasma parameters with the discharge characteristics. The electron density and temperature is found to be well agree with the Langmuir probe data in the range of 0.5x1016 to 45x1016 cm-3 and 1.4 to 1.6 ev for wide range of rf power.

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