Highly Thermally Stable, Green Solvent Disintegrable, and Recyclable Polymer Substrates for Flexible Electronics

2020 ◽  
Vol 41 (19) ◽  
pp. 2000292
Author(s):  
Linlin Chen ◽  
Huang Yu ◽  
Mahmut Dirican ◽  
Dongjun Fang ◽  
Yan Tian ◽  
...  
2010 ◽  
Vol 93-94 ◽  
pp. 5-8 ◽  
Author(s):  
Iryna Yakimets ◽  
Duncan MacKerron ◽  
Peter Giesen ◽  
Keith J. Kilmartin ◽  
Marloes Goorhuis ◽  
...  

Flexible electronics technology can potentially result in many compelling applications not satisfied by the rigid Si-based conventional electronics. Commercially available foils such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN) have emerged as the most suitable polymer materials for wide range of flexible electronics applications. Despite the enormous progress which has been recently done on the optimization of physical and mechanical properties of PET and PEN foils, their dimensional stability at the micro-scale is still an issue during patterning of wiring by means of lithography. Consequently, the measurement of in-plane micro-deformation of foil is of great importance for understanding and predicting its thermal, hydroscopic and mechanical behaviour during processing.


2012 ◽  
Vol 1529 ◽  
Author(s):  
Siyuan Ma ◽  
Vadim Bromberg ◽  
Frank D. Egitto ◽  
Timothy J. Singler

ABSTRACTDeposition of solution-processed functional materials generally requires additional post-processing to optimize the functionality of the material. We study sintering of Ag nanoparticle (NP) (with average diameter 77nm) deposits for improved electrical conductivity, with emphasis on Argon plasma methods compatible with the low temperature requirements of regular low-cost flexible polymer substrates. The relationship between plasma parameters (such as power and treatment time) versus sintering results (sintered structure depth, film continuity and electrical sheet resistance) will be reported. According to our efforts so far, we have achieved the electrical resistivity of the sintered film at about 20 times greater than the value of bulk silver using a process compatible with the low temperature requirements of common flexible polymer substrates.


2019 ◽  
Vol 11 (22) ◽  
pp. 20281-20290 ◽  
Author(s):  
Huang Yu ◽  
Dongjun Fang ◽  
Mahmut Dirican ◽  
Ruiping Wang ◽  
Yan Tian ◽  
...  

2020 ◽  
Vol 3 (1) ◽  
pp. 785-793 ◽  
Author(s):  
Ruiping Wang ◽  
Huang Yu ◽  
Mahmut Dirican ◽  
Linlin Chen ◽  
Dongjun Fang ◽  
...  

2015 ◽  
Vol 3 (47) ◽  
pp. 24049-24054 ◽  
Author(s):  
Nitin Choudhary ◽  
Mumukshu Patel ◽  
Yee-Hsien Ho ◽  
Narendra B. Dahotre ◽  
Wonki Lee ◽  
...  

We demonstrate the direct deposition of two-dimensional (2D) MoS2thin film on Cu-foil and polymer substrates, exhibiting an excellent capacitance and outstanding cyclic stability. The MoS2based supercapacitors will enable new opportunities in flexible electronics and energy devices.


Polymers ◽  
2021 ◽  
Vol 13 (13) ◽  
pp. 2209
Author(s):  
Barun K. Barick ◽  
Neta Shomrat ◽  
Uri Green ◽  
Zohar Katzman ◽  
Tamar Segal-Peretz

Nanoscale textured surfaces play an important role in creating antibacterial surfaces, broadband anti-reflective properties, and super-hydrophobicity in many technological systems. Creating nanoscale oxide textures on polymer substrates for applications such as ophthalmic lenses and flexible electronics imposes additional challenges over conventional nanofabrication processes since polymer substrates are typically temperature-sensitive and chemically reactive. In this study, we investigated and developed nanofabrication methodologies to create highly ordered oxide nanostructures on top of polymer substrates without any lithography process. We developed suitable block copolymer self-assembly, sequential infiltration synthesis (SIS), and reactive ion etching (RIE) for processes on polymer substrates. Importantly, to prevent damage to the temperature-sensitive polymer and polymer/oxide interface, we developed the process to be entirely performed at low temperatures, that is, below 80 °C, using a combination of UV crosslinking, solvent annealing, and modified SIS and RIE processes. In addition, we developed a substrate passivation process to overcome reactivity between the polymer substrate and the SIS precursors as well as a high precision RIE process to enable deep etching into the thermally insulated substrate. These methodologies widen the possibilities of nanofabrication on polymers.


Nanomaterials ◽  
2020 ◽  
Vol 10 (4) ◽  
pp. 701 ◽  
Author(s):  
Jaemook Lim ◽  
Youngchan Kim ◽  
Jaeho Shin ◽  
Younggeun Lee ◽  
Wooseop Shin ◽  
...  

Laser-induced forward transfer (LIFT) and selective laser sintering (SLS) are two distinct laser processes that can be applied to metal nanoparticle (NP) ink for the fabrication of a conductive layer on various substrates. A pulsed laser and a continuous-wave (CW) laser are utilized respectively in the conventional LIFT and SLS processes; however, in this study, CW laser-induced transfer of the metal NP is proposed to achieve simultaneous sintering and transfer of the metal NP to a wide range of polymer substrates. At the optimum laser parameters, it was shown that a high-quality uniform metal conductor was created on the acceptor substrate while the metal NP was sharply detached from the donor substrate, and we anticipate that such an asymmetric transfer phenomenon is related to the difference in the adhesion strengths. The resultant metal electrode exhibits a low resistivity that is comparable to its bulk counterpart, together with strong adhesion to the target polymer substrate. The versatility of the proposed process in terms of the target substrate and applicable metal NPs brightens its prospects as a facile manufacturing scheme for flexible electronics.


2015 ◽  
Vol 596 ◽  
pp. 167-173 ◽  
Author(s):  
Maria A. Torres Arango ◽  
Anna M. Cokeley ◽  
Jared J. Beard ◽  
Konstantinos A. Sierros

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