Analysis of copper plasticity impact in TSV-middle and backside TSV-last fabrication processes

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2015.7159723 ◽

2015 ◽

Cited By ~ 4

Author(s):

Wei Guo ◽

Aditya P. Karmarkar ◽

Xiaopeng Xu ◽

Geert Van der Plas ◽

Stefaan Van Huylenbroeck ◽

...

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