Defect mitigation of plasma-induced delamination of TiW/Cu from SiNx layer in thin si interposer processing with glass carriers

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2015.7159703 ◽

2015 ◽

Author(s):

Vijay Sukumaran ◽

Thuy Tran-Quinn ◽

Jorge Lubguban ◽

Dave Webster ◽

Brittany Hedrick ◽

...

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