Three-dimensional integration technology for sensor application using 5-µm-pitch au cone bump connections

2015 ◽  
Author(s):  
Makoto Motoyoshi ◽  
Kohki Yanagimura ◽  
Junichi Takanohashi ◽  
Mariappan Murugesan ◽  
Masahiro Aoyagi ◽  
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Keyword(s):  
Three Dimensional ◽  
Integration Technology ◽  
Sensor Application

scholarly journals Fully epitaxial giant magnetoresistive devices with half-metallic Heusler alloy fabricated on poly-crystalline electrode using three-dimensional integration technology

2020 ◽  
Vol 200 ◽  
pp. 1038-1045
Author(s):  
Jiamin Chen ◽  
Yuya Sakuraba ◽  
Kay Yakushiji ◽  
Yuichi Kurashima ◽  
Naoya Watanabe ◽  
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Keyword(s):  
Heusler Alloy ◽  
Three Dimensional ◽  
Half Metallic ◽  
Integration Technology

Development of Three-Dimensional Integration Technology for Magnetic Random Access Memories

2019 ◽  
Vol 22 (6) ◽  
pp. 495-500
Author(s):  
Kay Yakushiji ◽  
Hideki Takagi ◽  
Naoya Watanabe ◽  
Akio Fukushima ◽  
Katsuya Kikuchi ◽  
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Three Dimensional ◽  
Random Access ◽  
Integration Technology

CHIP-TO-WAFER THREE-DIMENSIONAL INTEGRATION TECHNOLOGY FOR RETINAL PROSTHESIS CHIPS

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HIROKAZU KIKUCHI ◽  
YUSUKE YAMADA ◽  
TAKAFUMI FUKUSHIMA ◽  
TETSU TANAKA ◽  
MITSUMASA KOYANAGI
Keyword(s):  
Three Dimensional ◽  
Retinal Prosthesis ◽  
Integration Technology
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