2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
Latest Publications

TOTAL DOCUMENTS

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781509054480

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Process window discovery, expansion and control of design hotspots susceptible to overlay failures

2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2017.7969272 ◽

2017 ◽

Cited By ~ 3

Author(s):

Kaushik Sah ◽

Andrew Cross ◽

Antonio Mani ◽

Dieter Van Den Heuvel ◽

Philippe Foubert

Keyword(s):

Process Window ◽

And Control

Download Full-text

2017 ASMC sponsors

2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2017.7969185 ◽

2017 ◽

Cited By ~ 1

Download Full-text

A batch study of trace metal impurities in high-k semiconductor precursors CFM: Contamination free manufacturing

2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2017.7969201 ◽

2017 ◽

Author(s):

Vijay Chowdhury ◽

Mohsina Islam ◽

Shi Liu

Keyword(s):

Trace Metal ◽

Metal Impurities ◽

High K ◽

Batch Study ◽

Semiconductor Precursors

Download Full-text

Rapid, semi-quantitative depth profiling of ultra-thin films using plasma profiling time-of-flight mass spectrometry: AM: Advanced metrology

2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2017.7969245 ◽

2017 ◽

Cited By ~ 1

Author(s):

Yann Mazel ◽

Jean-Paul Barnes ◽

Emmanuel Nolot ◽

Agnes Tempez ◽

Sebastien Legendre

Keyword(s):

Mass Spectrometry ◽

Thin Films ◽

Time Of Flight ◽

Depth Profiling ◽

Flight Mass Spectrometry

Download Full-text

Innovative scalable design based care area methodology for defect monitoring in production

2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2017.7969215 ◽

2017 ◽

Cited By ~ 1

Author(s):

Ian Tolle ◽

Ankit Jain

Keyword(s):

Scalable Design

Download Full-text

Reduction of wafer arcing during high aspect ratio etching

2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2017.7969273 ◽

2017 ◽

Cited By ~ 1

Author(s):

Zusing Yang ◽

Min-Feng Hung ◽

Kuo-Pin Chang ◽

Chih-Yao Lin ◽

Sheng-Yuan Chang ◽

...

Keyword(s):

Aspect Ratio ◽

High Aspect Ratio

Download Full-text

Amorphous silicon coatings for control of corrosion and metal ion contamination

2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2017.7969259 ◽

2017 ◽

Author(s):

David A. Smith ◽

Min Yuan ◽

Jesse Bischof ◽

Luke Patterson ◽

James B. Mattzela

Keyword(s):

Amorphous Silicon ◽

Metal Ion

Download Full-text

Spin coating modeling and planarization using fill patterns for advanced packaging technologies

2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2017.7969228 ◽

2017 ◽

Cited By ~ 1

Author(s):

Christopher Lang ◽

Duane Boning

Keyword(s):

Spin Coating ◽

Advanced Packaging

Download Full-text

A novel approach to fault detection using full sensor trace analytic

2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2017.7969221 ◽

2017 ◽

Author(s):

Tom Ho ◽

Justin Wong

Keyword(s):

Fault Detection ◽

Novel Approach

Download Full-text

The criticality of sub-components utilized for next-generation high-volume manufacturing

2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2017.7969263 ◽

2017 ◽

Author(s):

Ya-hong Neirynck ◽

Dalia Vernikovsky

Keyword(s):

High Volume ◽

Next Generation

Download Full-text

2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Process window discovery, expansion and control of design hotspots susceptible to overlay failures

2017 ASMC sponsors

A batch study of trace metal impurities in high-k semiconductor precursors CFM: Contamination free manufacturing

Rapid, semi-quantitative depth profiling of ultra-thin films using plasma profiling time-of-flight mass spectrometry: AM: Advanced metrology

Innovative scalable design based care area methodology for defect monitoring in production

Reduction of wafer arcing during high aspect ratio etching

Amorphous silicon coatings for control of corrosion and metal ion contamination

Spin coating modeling and planarization using fill patterns for advanced packaging technologies

A novel approach to fault detection using full sensor trace analytic

The criticality of sub-components utilized for next-generation high-volume manufacturing

2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
Latest Publications