The criticality of sub-components utilized for next-generation high-volume manufacturing

2017 ◽  
Author(s):  
Ya-hong Neirynck ◽  
Dalia Vernikovsky
Keyword(s):  
High Volume ◽  
Next Generation

Design and Economic Considerations to Achieve the Price Parity of SiC MOSFETs with Silicon IGBTs

2016 ◽  
Vol 858 ◽  
pp. 889-893
Author(s):  
Woong Je Sung ◽  
B. Jayant Baliga
Keyword(s):  
Cost Analysis ◽  
High Volume ◽  
Next Generation ◽  
Packaging Technology ◽  
Processing Cost ◽  
Chip Size ◽  
Advanced Packaging ◽  
Economic Considerations ◽  
Intuitive Model

This paper aims to establish an intuitive model to determine the chip size of 1200V SiC MOSFET for a particular current rating. In order to provide the direction of next generation SiC MOSFETs, the most vital device parameters were investigated, and their quantitative influences are given. Cost analysis, based on the proposed method, shows that it is feasible to achieve the price parity to Silicon IGBTs by concurrent efforts such as improvements on the device innovation, advanced packaging technology, and reduced processing cost by leveraging high volume commercial 150 mm Si Foundries in US.

scholarly journals Automated, Quality Assured and High Volume Oriented Production of Fiber Metal Laminates (FML) for the Next Generation of Passenger Aircraft Fuselage Shells

2019 ◽  
Vol 26 (1) ◽  
pp. 502-508 ◽  
Author(s):  
Hakan Ucan ◽  
Joachim Scheller ◽  
Chinh Nguyen ◽  
Dorothea Nieberl ◽  
Thomas Beumler ◽  
...  
Keyword(s):  
Research Work ◽  
Research Programme ◽  
High Volume ◽  
Next Generation ◽  
New Production ◽  
Fiber Metal Laminates ◽  
Production Chain ◽  
Joint Project ◽  
Aerospace Applications ◽  
Fiber Metal

AbstractThe use of fiber-metal laminates (FML) allows for substantial advantages over a fuselage skin made of monolithic aluminum materials. Glass fiber prepreg reinforced aluminium is characterized by high damage tolerance capabilities, supporting the structural strength capability in case of any kind of damage. For this reason, FML, and GLARE in particular, have been identified as superior materials for aerospace applications. More than 400m2 FML is applied on each A380, as skin panels and as D-noses for both, vertical and horizontal stabilizer. FML possess the potential to become the baseline material for next-generation single-aisle aircrafts [1, 2, 6].The development of a new production chain that will allow automated fuselage production for future short-haul aircrafts is the focus of the studies that make up the joint project AUTOGLARE. As part of the fifth call-up for the German Aeronautical Research Programme (LuFo), the German Aerospace Center (DLR) is working with its project partners Airbus Operations, Premium Aerotech (PAG) and the Fraunhofer Gesellschaft (FhG). The development of a production chain for stiffened fuselage panels made of Fiber metal Laminates should support a production rate of 60 aircraft per month [3].This study contains the research work of the DLR and FhG regarding the automated and quality assured process for chain stiffened FML fuselages. In addition to a detailed explanation of the systems that were set up, this paper covers the planned tests, the completed demonstration models and the findings derived from them.

Interaction Between Single Unit Trucks and Concrete Barriers in High Speed Impacts

2007 ◽  
Author(s):  
John D. Reid ◽  
Ronald K. Faller
Keyword(s):  
Single Unit ◽  
High Speed ◽  
High Volume ◽  
Full Scale ◽  
Single Units ◽  
Next Generation ◽  
Crash Testing ◽  
Concrete Barriers ◽  
Recommended Practices

Single Units Trucks (SUT’s) are commonly used for hauling many things and typically have a loaded mass between 8,000 to 10,000 kg (18,000 and 23,000 lbs). Concrete barriers are commonly used on high volume traffic highways that have very little median space between opposing traffic lanes. The interaction between SUT’s and concrete barriers during impacts at speeds between 80–90 km/h (50–56 mph) at angles up to 15 degrees is of importance not only to the driver, but also to the surrounding traffic. Of particular concern is the vehicle rolling-over the barrier. This study investigates some recent full-scale crash testing and simulation of SUT’s into concrete barriers. Information gained from this study is being used to help determine the next generation of recommended practices and procedures for designing and testing concrete barriers, as well as other types of barriers, like bridge-rails.

scholarly journals SUSTAINABILITY EFFECTS OF NEXT-GENERATION INTERSECTION CONTROL FOR AUTONOMOUS VEHICLES

Transport ◽  
2015 ◽  
Vol 30 (3) ◽  
pp. 342-352 ◽  
Author(s):  
Zhixia (Richard) Li ◽  
Madhav V. Chitturi ◽  
Lang Yu ◽  
Andrea R. Bill ◽  
David A. Noyce
Keyword(s):  
Energy Consumption ◽  
Autonomous Vehicles ◽  
High Volume ◽  
Ambient Air ◽  
Next Generation ◽  
Pm 2.5 ◽  
Time Space ◽  
Moderate Volume ◽  
Vehicle Technologies ◽  
Intersection Control

Transportation sustainability is adversely affected by recurring traffic congestions, especially at urban intersections. Frequent vehicle deceleration and acceleration caused by stop-and-go behaviours at intersections due to congestion adversely impacts energy consumption and ambient air quality. Availability of the maturing vehicle technologies such as autonomous vehicles and Vehicle-To-Vehicle (V2V) / Vehicle-To-Infrastructure (V2I) communications provides technical feasibility to develop solutions that can reduce vehicle stops at intersections, hence enhance the sustainability of intersections. This paper presents a next-generation intersection control system for autonomous vehicles, which is named ACUTA. ACUTA employs an enhanced reservation-based control algorithm that controls autonomous vehicles’ passing sequence at an intersection. Particularly, the intersection is divided into n-by-n tiles. An intersection controller reserves certain time-space for each vehicle, and assures no conflict exists between reservations. The algorithm was modelled in microscopic traffic simulation platform VISSIM. ACUTA algorithm modelling as well as enhancement strategies to minimize vehicle intersection stops and eventually emission and energy consumption were discussed in the paper. Sustainability benefits offered by this next-generation intersection were evaluated and compared with traditional intersection control strategies. The evaluation reveals that multi-tile ACUTA reduces carbon monoxide (CO) and Particulate Matter (PM) 2.5 emissions by about 5% under low to moderate volume conditions and by about 3% under high volume condition. Meanwhile, energy consumption is reduced by about 4% under low to moderate volume conditions and by about 12% under high volume condition. Compared with four-way stop control, single-tile ACUTA reduces CO and PM 2.5 emissions as well as energy consumption by about 15% under any prevailing volume conditions. These findings validated the sustainability benefits of employing next-generation vehicle technologies in intersection traffic control. In addition, extending the ACUTA to corridor level was explored in the paper.

An AAA Framework for IP Multicast Communication in Next Generation Networks

2009 ◽  
pp. 40-66 ◽  
Author(s):  
Prashant Pillai
Keyword(s):  
High Volume ◽  
Video On Demand ◽  
Next Generation Networks ◽  
Ip Multicast ◽  
Next Generation ◽  
Multicast Communication ◽  
Efficient Access ◽  
Data Volume ◽  
User Access ◽  
Audio Video

IP multicast mechanisms provide efficient bandwidth consumption and distribution of high volume contents such as audio/video streaming, audio/video-on-demand and file sharing to multiple users. To commercially deploy multicast services in next generation networks it is important for Network Providers (NPs) to be able to control user access to the multicast content and to be able to account the multicast usage. This chapter compares some of the existing security mechanisms and highlights their inadequacies for providing efficient multicast security. The chapter then describes an AAA framework for IP multicast, which combines the IETF MSEC architecture with efficient AAA techniques to provide secure multicast content and to enable NPs to authenticate, authorise and provide efficient access control of end users requesting multicast content. This AAA framework also supports both post-paid and pre-paid accounting of users and allows the monitoring of session information like session duration and data volume for each multicast session.

Direct Printing for Next Generation High Density Packaging

2011 ◽  
Vol 2011 (1) ◽  
pp. 001007-001011
Author(s):  
Xudong Chen ◽  
Kenneth Church
Keyword(s):  
High Volume ◽  
High Density ◽  
Next Generation ◽  
New Techniques ◽  
Direct Printing ◽  
Size Limitation ◽  
Size Constraints ◽  
Pick And Place ◽  
Key Factor ◽  
Line Widths

Next generation micro-packaging will feature a number of advances in high density techniques, including more components in a smaller volume. New techniques for metallization, passives, antennas, solders, and adhesives will be required. The key factor for these will be size constraints. Micro-dispensing can print a number of materials to include dielectrics, ruthenates, metallics, solder, and adhesives. Those with experience in micro-dispensing recognize the size limitation using a dispensing approach and understand that the hope of achieving smaller line widths, smaller pad sizes, and precise placement of the material is not feasible. nScrypt has demonstrated the ability to considerably shrink the line widths and dots from traditional micro-dispensing, thus enabling the next generation packaging and increasing the component count in the same or less volume. Micro-dispensing solder dots, precisely placing narrow adhesive lines and potentially directly printing resistors and antennas to replace standard pick and place and connectorized antennas will be demonstrated to reduce the size and volume for high micro-electronic circuits. In addition to the new and enabling reduced volume approach, nScrypt will also demonstrate how the speed of this approach will rival traditional high volume screen printing and other masking technologies, thus making this a viable manufacturing tool for micro-packaging.

Versatile Lead-Free Solder Electroplating Products for Advanced Bumping Technologies

2014 ◽  
Vol 2014 (DPC) ◽  
pp. 001603-001621
Author(s):  
Inho Lee ◽  
Regina Cho ◽  
Lou Grippo ◽  
Yen-Lin Taylor ◽  
Wayne Baldelli ◽  
...  
Keyword(s):  
Alloy Composition ◽  
High Volume ◽  
Die Design ◽  
Lead Free ◽  
Next Generation ◽  
Production Lines ◽  
Diverse Range ◽  
Wide Range ◽  
Snag Solder ◽  
High Yields

Lead-free SnAg solder bumps deposited by electroplating are used extensively in high volume production lines for a number of new bumping technologies including C4 bumps, Cu pillars capped with SnAg solder and 3D microbumps. New bumping technologies present their challenging requirements such as tightly controlled thickness uniformity, alloy composition uniformity and avoidance of reflow voids to create high yields and low defects. To meet these requirements, SnAg plating chemistry must deliver strong performance over a wide range of applications. Traditional device manufacturers, wafer foundry companies and Outsourced Assembly and Test (OSAT) companies are manufacturing a number of different types of bumped wafers in their production lines; a diverse range of die design and pattern densities, thin and thick resist film wafers, mushroom and in-via plating, and wide range of plating rate. The variety and complexity of bumping wafers have challenged SnAg plating chemistries to meet tight requirements in terms of running cost saving and high production yield. Hence, development of versatile and robust chemistries for electroplating is critical to overcome these challenges In view of all these challenges and unmet needs in the market, Dow focused its efforts on developing a brand-new additive system for SnAg plating. On the one hand, we tapped into our know-how on solder plating to establish correlations between various types of end-user requirements and experiences to fundamental electrochemistry response. On the other hand, 300mm in-house plating and process tools are leveraged to speed up the feedback process and provide pilot run data. At the end, this highly iterative approach enabled us to optimize the performance of the chemistry without sacrifice on design space. In this paper, we will discuss next generation of SnAg electroplating products capable of achieving versatile performance requirements over a wide range of applications. The bump height WID co-planarity% ((hmax-hmin)/2havg ×100) was achieved less than ±5% over the wide range of current density from 4 ASD to 12 ASD. Smooth surface morphology, narrow Ag alloy composition distribution less than ±0.2% across the 300mm wafers, and reflow void free were observed. An optimized formulation of the next generation SnAg products was successfully demonstrated plating capability on various bumping technologies such as C4 bumping, Cu pillars capped SnAg solders and micro bumps meeting plating requirements.

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